公开(公告)号：US20140247571A1

公开(公告)日：2014-09-04

申请号：US14276469

申请日：2014-05-13

Applicant: IBIDEN CO., LTD.

Inventor： Shunsuke SAKAI ,  Kenji Sato ,  Toshiki Furutani

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0298 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/184 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09781 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/049 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole such that the second conductive pattern is formed along an outline of the periphery of the penetrating hole.

Abstract translation: 具有内置电子部件的布线基板包括芯基板，该芯基板具有形成在芯基板上的贯通孔，容纳在芯基板的贯通孔中的电子部件，形成在芯基板的第一面上的导电图案层 并且包括第一导电图案和第二导电图案，以及形成在导电图案层和芯基板的第一表面之上的层间绝缘层。 所述第二导电图形与所述贯通孔的周边相邻地形成，使得所述第二导电图案沿着所述贯通孔的周边的轮廓形成。