公开(公告)号：US20140247571A1

公开(公告)日：2014-09-04

申请号：US14276469

申请日：2014-05-13

Applicant: IBIDEN CO., LTD.

Inventor： Shunsuke SAKAI ,  Kenji Sato ,  Toshiki Furutani

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0298 ,  H01L21/568 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/45 ,  H01L24/48 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/184 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09781 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0156 ,  H05K2203/0191 ,  H05K2203/049 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A wiring board with a built-in electronic component includes a core substrate having a penetrating hole formed in the core substrate, an electronic component accommodated in the penetrating hole in the core substrate, a conductive pattern layer formed on a first surface of the core substrate and including a first conductive pattern and a second conductive pattern, and an interlayer insulation layer formed over the conductive pattern layer and the first surface of the core substrate. The second conductive pattern is formed adjacent to a periphery of the penetrating hole such that the second conductive pattern is formed along an outline of the periphery of the penetrating hole.

Abstract translation: 具有内置电子部件的布线基板包括芯基板，该芯基板具有形成在芯基板上的贯通孔，容纳在芯基板的贯通孔中的电子部件，形成在芯基板的第一面上的导电图案层 并且包括第一导电图案和第二导电图案，以及形成在导电图案层和芯基板的第一表面之上的层间绝缘层。 所述第二导电图形与所述贯通孔的周边相邻地形成，使得所述第二导电图案沿着所述贯通孔的周边的轮廓形成。

公开(公告)号：US09113574B2

公开(公告)日：2015-08-18

申请号：US14063052

申请日：2013-10-25

Applicant: IBIDEN CO., LTD.

Inventor： Kenji Sato ,  Masahiro Zanma

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/186 ,  H05K3/4644 ,  H05K3/4697 ,  H05K2201/09827 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49146

Abstract: A wiring board with a built-in electronic component includes a core substrate having a cavity, an electronic component accommodated in the cavity of the core substrate and having a body portion and multiple conductive portions formed on a surface of the body portion, a filling resin filling the space formed in the cavity having the component positioned in the cavity, and an resin insulation layer formed on the core substrate such that the resin insulation layer is covering an opening of the cavity and a surface of the component. The core substrate has an inclination suppressing structure formed on one or more side walls forming the cavity such that the distance between the side wall forming the cavity and the component varies in a portion of the side wall having the inclination suppressing structure and a portion of the side wall other than the portion having the inclination suppressing structure.

Abstract translation: 具有内置电子部件的布线基板包括具有空腔的芯基板，容纳在芯基板的空腔中的电子部件，具有主体部和形成在主体部的表面上的多个导电部，填充树脂 填充形成在具有位于空腔中的部件的空腔中的空间，以及形成在芯基板上的树脂绝缘层，使得树脂绝缘层覆盖空腔的开口和部件的表面。 核心基板具有形成在形成空腔的一个或多个侧壁上的倾斜抑制结构，使得形成空腔的侧壁与部件之间的距离在具有倾斜抑制结构的侧壁的一部分中变化，并且部分 侧壁除了具有倾斜抑制结构的部分之外。