公开(公告)号：US09448121B2

公开(公告)日：2016-09-20

申请号：US13854139

申请日：2013-04-01

Applicant: Industrial Technology Research Institute

Inventor： Heng-Chieh Chien ,  Ming-Ji Dai ,  Sheng-Tsai Wu ,  Huey-Lin Hsieh ,  Jing-Yi Huang

IPC: G01K1/00 ,  G01K7/00 ,  F25B21/04 ,  G01K3/08 ,  H01L35/30 ,  H01L35/32

CPC classification number: G01K7/00 ,  F25B21/04 ,  G01K3/08 ,  H01L35/30 ,  H01L35/32

Abstract: A measurement method, a measurement apparatus, and a computer program product for measuring a thermoelectric module are provided. A temperature is provided to the thermoelectric module. A current is applied to the thermoelectric module to turn both sides of the thermoelectric module into a hot side and a cold side. The temperature of the hot side is higher than that of the cold side. A terminal voltage of the thermoelectric module, a hot side temperature of the hot side, and a cold side temperature of the cold side are measured at different time points. A thermoelectric relationship between the terminal voltages and differences between the hot side temperatures and the corresponding cold side temperatures is obtained according to the terminal voltages, the hot side temperatures, and the cold side temperatures. At least one first parameter of the thermoelectric module is estimated according to the thermoelectric relationship.

Abstract translation: 提供了一种用于测量热电模块的测量方法，测量装置和计算机程序产品。 向热电模块提供温度。 向热电模块施加电流以将热电模块的两侧转变成热侧和冷侧。 热侧的温度高于冷侧的温度。 在不同的时间点测量热电模块的端电压，热侧的热侧温度和冷侧的冷侧温度。 根据端子电压，热侧温度和冷侧温度，获得端子电压与热侧温度与相应的冷侧温度之间的差异的热电关系。 根据热电关系估计热电模块的至少一个第一参数。

公开(公告)号：US09130080B2

公开(公告)日：2015-09-08

申请号：US13943810

申请日：2013-07-17

Applicant: Industrial Technology Research Institute

Inventor： Zhi-Cheng Hsiao ,  Ming-Ji Dai ,  Cheng-Ta Ko

IPC: H01L31/024 ,  H01L27/146

CPC classification number: H01L31/024 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469

Abstract: An encapsulation of backside illumination photosensitive device including a circuit sub-mount, a backside illumination photosensitive device, a plurality of conductive terminals, and a heat dissipation structure is provided. The backside illumination photosensitive device includes an interconnection layer and a photosensitive device array, wherein the interconnection layer is located on the circuit sub-mount, and between the photosensitive device array and the circuit sub-mount. The conductive terminals are located between the interconnection layer and the circuit sub-mount to electrically connect the interconnection layer and the circuit sub-mount. The heat dissipation structure is located under the interconnection layer, and the heat dissipation structure and the photosensitive device array are respectively located at two opposite sides of the interconnection layer.

Abstract translation: 提供了包括电路子安装座，背面照明光敏装置，多个导电端子和散热结构的背面照明光敏装置的封装。 背面照明光敏装置包括互连层和感光器件阵列，其中互连层位于电路子座上，并且位于感光器件阵列和电路子座之间。 导电端子位于互连层和电路子座之间，以电连接互连层和电路子座。 散热结构位于互连层下方，散热结构和感光器件阵列分别位于互连层的两个相对侧。

公开(公告)号：US10343868B2

公开(公告)日：2019-07-09

申请号：US15220958

申请日：2016-07-27

Applicant: Industrial Technology Research Institute

Inventor： Ming-Kaan Liang ,  Ming-Ji Dai ,  Chin-Hung Wang ,  Chih-Ming Shen

IPC: B65H27/00 ,  B65H23/188 ,  B65H23/04 ,  B65H23/192

Abstract: Provided is a roller with pressure sensor. The roller includes a pressure sensor mounted to the roller. The pressure sensor includes a plurality of pressure sensing units distributed on a thin film. The pressure sensing units are electrically connected to each other with a metal wire but not in contact with each other. Also provided is a roll-to-roll device, which includes a roller mechanism and a pressure sensor.

公开(公告)号：US11132786B2

公开(公告)日：2021-09-28

申请号：US16134986

申请日：2018-09-19

Applicant: Industrial Technology Research Institute

Inventor： Ming-Kaan Liang ,  An-Chun Luo ,  Yu-Shan Deng ,  Chih-Ming Shen ,  Ming-Ji Dai

IPC: G06T7/00 ,  G06N3/08 ,  G06K9/62

Abstract: A board defect filtering method is provided. The method includes: receiving a defect list; obtaining a plurality of defect images of a plurality of defect records on the defect list; receiving a circuit layout image; analyzing a defect location of a first defect image of the plurality of defect images according to the circuit layout image; cropping the first defect image to obtain a first cropped defect image according to the defect location; inputting the first cropping defect image to a defect classifying model; and determining whether the first defect image is a qualified product image or not according to an output result of the defect classifying model.

公开(公告)号：US10288696B2

公开(公告)日：2019-05-14

申请号：US15352989

申请日：2016-11-16

Applicant: Industrial Technology Research Institute

Inventor： Chih-Chung Chiu ,  Chih-Ming Tzeng ,  Li-Ling Liao ,  Yu-Lin Chao ,  Chih-Ming Shen ,  Ming-Kaan Liang ,  Chun-Kai Liu ,  Ming-Ji Dai

IPC: G01R31/40 ,  G01R31/00 ,  H02P29/68 ,  G01R21/06 ,  H02P27/08

Abstract: An intelligent diagnosis system for a power module. The system includes a power module, a hardware checking module and a diagnostic module. The power module has a temperature sensing element for obtaining a temperature difference between a starting minimum temperature and a current temperature. The hardware checking module has a current sensing element, a voltage sensing element and a magnetic coupling closed loop detection element for obtaining the current, the output voltage and the input voltage of the power module, and the hardware loop status, respectively. The diagnostic module calculates the number of cycles that have been operated, a measured impedance and an instantaneous power based on those measurement results, and calculating a risk index based on the number of cycles that have been operated, the temperature difference, the measured impedance, the instantaneous power and the hardware loop status, thereby determining the accumulation of the abnormality index record.

公开(公告)号：US20160163950A1

公开(公告)日：2016-06-09

申请号：US14562784

申请日：2014-12-08

Applicant: Industrial Technology Research Institute

Inventor： Li-Ling Liao ,  Ming-Ji Dai ,  Chun-Kai Liu ,  Cheng-Heng Kao ,  Cheng-Chieh Li ,  Jeffrey Snyder ,  Fivos Drymiotis

IPC: H01L35/32 ,  H01L35/34

CPC classification number: H01L35/32 ,  H01L35/08 ,  H01L35/34

Abstract: A structure of a thermoelectric module including at least one substrate, a thermoelectric device and an insulation protection structure is provided. The thermoelectric device is disposed on the substrate. The insulation protection structure surrounds the thermoelectric device. The thermoelectric device includes at least three electrode plates, first type and second type thermoelectric materials and a diffusion barrier structure. First and second electrode plates among the three electrode plates are disposed on the substrate. The first type thermoelectric material is disposed on the first electrode plate. The second type thermoelectric material is disposed on the second electrode plate. A third electrode plate among the three electrode plates is disposed on the first type and second type thermoelectric materials. The diffusion barrier structure is disposed on two terminals of each of the first type and second type thermoelectric materials. A fabrication method of the foregoing thermoelectric module is also provided.

Abstract translation: 提供了包括至少一个基板，热电元件和绝缘保护结构的热电模块的结构。 热电装置设置在基板上。 绝缘保护结构围绕热电装置。 热电装置包括至少三个电极板，第一类型和第二类型热电材料和扩散阻挡结构。 三个电极板中的第一和第二电极板设置在基板上。 第一类型热电材料设置在第一电极板上。 第二种热电材料设置在第二电极板上。 三个电极板中的第三电极板设置在第一类型和第二类型热电材料上。 扩散阻挡结构设置在第一类型和第二类型热电材料中的每一个的两个端子上。 还提供了上述热电模块的制造方法。