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公开(公告)号：US09306117B2
公开(公告)日：2016-04-05
申请号：US14583594
申请日：2014-12-27
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Ying-Chien Chu , Shih-Hao Wang , Yen-Hsiang Fang , Mu-Tao Chu
CPC classification number: H01L33/0095 , H01L25/0753 , H01L27/153 , H01L33/44 , H01L33/58 , H01L2224/95 , H01L2924/0002 , H01L2924/00
Abstract: A transfer-bonding method for light emitting devices including following steps is provided. A plurality of light emitting devices is formed over a first substrate and is arranged in array, wherein each of the light emitting devices includes a device layer and an interlayer sandwiched between the device layer and the first substrate. A protective layer is formed over the first substrate to selectively cover parts of the light emitting devices, and other parts of the light emitting devices are uncovered by the protective layer. The device layers uncovered by the protective layer are bonded with a second substrate. The interlayers uncovered by the protective layer are removed, so that parts of the device layers uncovered by the protective layer are separated from the first substrate and are transfer-bonded to the second substrate.
Abstract translation: 提供了包括以下步骤的发光器件的转印 - 粘合方法。 多个发光器件形成在第一衬底上并且被布置成阵列，其中每个发光器件包括器件层和夹在器件层和第一衬底之间的夹层。 在第一基板上形成保护层以选择性地覆盖部分发光器件，并且发光器件的其它部分被保护层覆盖。 由保护层未覆盖的器件层与第二衬底结合。 由保护层覆盖的夹层被去除，使得被保护层未覆盖的器件层的部分与第一衬底分离并且转移结合到第二衬底。
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公开(公告)号：US11837628B2
公开(公告)日：2023-12-05
申请号：US17385954
申请日：2021-07-27
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Chia-Hsin Chao , Yen-Hsiang Fang
IPC: H01L27/15
CPC classification number: H01L27/156
Abstract: A display array including a semiconductor stacked layer, an insulating layer, a plurality of electrode pads, and a driving backplane is provided. The semiconductor stacked layer has a plurality of light emitting regions arranged along a reference plane. The insulating layer is disposed to an outer surface of the semiconductor stacked layer and contacts the semiconductor stacked layer. The insulating layer has a plurality of openings respectively corresponding to the plurality of light emitting regions. The electrode pads are disposed to the insulating layer and are respectively electrically connect the plurality of light emitting regions through the plurality of openings. The driving backplane is disposed to the semiconductor stacked layer and electrically connected to the plurality of electrode pads, wherein a light emitting material layer of the semiconductor stacked layer has consistency along an extension direction of the reference plane.
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公开(公告)号：US20230053079A1
公开(公告)日：2023-02-16
申请号：US17974531
申请日：2022-10-27
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Chia-Hsin Chao , Yen-Hsiang Fang
Abstract: A method for manufacturing a display array includes the following steps: providing a substrate and forming a semiconductor stacked layer on the substrate; forming an insulating layer and a plurality of electrode pads on an outer surface of the semiconductor stacked layer, the insulating layer and the electrode pads directly contacting the semiconductor stacked layer, wherein the insulating layer has a plurality of openings spaced apart from each other; and transferring the semiconductor stacked layer, the insulating layer and the electrode pads from the substrate to a driving backplane, wherein the electrode pads are respectively electrically connected to the driving backplane through the openings of the insulating layer to form a plurality of light emitting regions in the semiconductor stacked layer as the electrode pads and the semiconductor stacked layer are energized by the driving backplane.
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公开(公告)号：US11515299B2
公开(公告)日：2022-11-29
申请号：US16232064
申请日：2018-12-26
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Chia-Hsin Chao , Yen-Hsiang Fang
Abstract: A method for manufacturing a display array includes the following steps: providing a substrate and forming a semiconductor stacked layer on the substrate; forming an insulating layer and a plurality of electrode pads on an outer surface of the semiconductor stacked layer, the insulating layer and the electrode pads directly contacting the semiconductor stacked layer, wherein the insulating layer has a plurality of openings, and the electrode pads are respectively located in the openings of the insulating layer and separated by the insulating layer; and transferring the semiconductor stacked layer, the insulating layer and the electrode pads from the substrate to a driving backplane, wherein the electrode pads are respectively electrically connected to a portion of the semiconductor stacked layer and the driving backplane through the openings of the insulating layer to form a plurality of light emitting regions in the semiconductor stacked layer.
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公开(公告)号：US10679081B2
公开(公告)日：2020-06-09
申请号：US15730687
申请日：2017-10-11
Applicant: Industrial Technology Research Institute
Inventor： Chia-Hsin Chao , Yen-Hsiang Fang , Ming-Hsien Wu , Po-Hsun Wang
Abstract: A biometric device includes a substrate, an image sensor, at least one infrared light emitting diode (IR LED), a supporting structure and an optical layer. The image sensor is disposed on the substrate. The at least one IR LED is disposed on the substrate. The supporting structure is disposed on the substrate and located between the image sensor and the at least one infrared light emitting diode. The optical layer is disposed on the supporting structure, covers the image sensor, and includes a coded pattern.
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Patent Agency Ranking
公开(公告)号：US10522062B2
公开(公告)日：2019-12-31
申请号：US15372409
申请日：2016-12-08
Applicant: Industrial Technology Research Institute
Inventor： Ying-Chien Chu , Yen-Hsiang Fang , Chia-Hsin Chao , Ming-Hsien Wu , Shih-Hao Wang
Abstract: A three-dimensional display module includes a substrate, a display layer, a first electrode layer, a liquid-crystal layer, a second electrode layer, and a drive unit. The substrate has first electrodes and second electrodes. The display layer is disposed on the substrate and includes light-emitting elements. The first electrode layer is disposed on the display layer. The liquid-crystal layer is disposed on the display layer. The second electrode layer is disposed on the liquid-crystal layer. The drive unit drives the first electrodes and the first electrode layer to supply power to the light-emitting elements, such that the light-emitting elements generate light passing through the liquid-crystal layer to form a display image. The drive unit drives the second electrodes and the second electrode layer to produce an electric field on the liquid-crystal layer to change focal length of the liquid-crystal layer so as to control depth of field of the display image.
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公开(公告)号：US20190355705A1
公开(公告)日：2019-11-21
申请号：US16232064
申请日：2018-12-26
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Chia-Hsin Chao , Yen-Hsiang Fang
Abstract: A method for manufacturing a display array includes the following steps: providing a substrate and forming a semiconductor stacked layer on the substrate; forming an insulating layer and a plurality of electrode pads on an outer surface of the semiconductor stacked layer, the insulating layer and the electrode pads directly contacting the semiconductor stacked layer, wherein the insulating layer has a plurality of openings, and the electrode pads are respectively located in the openings of the insulating layer and separated by the insulating layer; and transferring the semiconductor stacked layer, the insulating layer and the electrode pads from the substrate to a driving backplane, wherein the electrode pads are respectively electrically connected to a portion of the semiconductor stacked layer and the driving backplane through the openings of the insulating layer to form a plurality of light emitting regions in the semiconductor stacked layer.
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公开(公告)号：US10134963B2
公开(公告)日：2018-11-20
申请号：US15291043
申请日：2016-10-11
Applicant: Industrial Technology Research Institute
Inventor： Chien-Chun Lu , Chen-Peng Hsu , Zhi-Wei Koh , Yen-Hsiang Fang
Abstract: A package structure of an ultraviolet light emitting diode is provided, which includes a substrate, a transparent body, at least one ultraviolet light emitting diode, a connecting element and an ultraviolet shielding layer. The transparent body is disposed on the substrate. The transparent body has a space inside thereof. The at least one ultraviolet light emitting diode is disposed on the substrate and inside the space. The connecting element is disposed between the substrate and the transparent body. The ultraviolet shielding layer is disposed between the transparent body and the connecting element.
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公开(公告)号：USD801181S1
公开(公告)日：2017-10-31
申请号：US29566699
申请日：2016-06-02
Applicant: Industrial Technology Research Institute
Designer： Zhi-Wei Koh , Chien-Chun Lu , Chen-Peng Hsu , Yen-Hsiang Fang
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公开(公告)号：US09773711B2
公开(公告)日：2017-09-26
申请号：US15060616
申请日：2016-03-04
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Yen-Hsiang Fang
CPC classification number: H01L22/20 , H01L24/75 , H01L24/81 , H01L33/0079 , H01L33/0095
Abstract: A picking-up and placing process for electronic devices includes: forming a plurality of electronic devices arranged in an array on a carrier, wherein a first conductive layer having a conductive pattern is disposed between each of the electronic devices and the carrier, and a width of the electronic device is greater than that of the corresponding conductive pattern; selectively picking-up parts of the electronic devices and corresponding first conductive layers from the carrier via a picking-up and placing module; and placing the parts of the electronic devices and the corresponding first conductive layers on a target substrate by the picking-up and placing module. An electronic module is further provided.
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