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公开(公告)号：US20250067976A1
公开(公告)日：2025-02-27
申请号：US18940860
申请日：2024-11-08
Applicant: Industrial Technology Research Institute
Inventor： Han-Kuei Fu , Meng-Han Lin , Hsu-Shih Huang , Ming-Hsien Wu , Chia-Hsin Chao , Wei-Hung Kuo
Abstract: A head-mounted eye tracking system including a light-transmitting substrate, an eye tracker, and a signal processor is provided. The eye tracker is configured to sense eyeballs of a wearer. The eye tracker includes a plurality of light-emitting devices and a plurality of sensing devices. The plurality of light-emitting devices are configured to emit a tracking beam. The plurality of sensing devices are configured to receive the tracking beam reflected by the eyeballs of the wearer. The signal processor is electrically connected to the eye tracker. The plurality of sensing devices are embedded in grooves within the light-transmitting substrate.
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公开(公告)号：US20240206070A1
公开(公告)日：2024-06-20
申请号：US18090459
申请日：2022-12-28
Applicant: Industrial Technology Research Institute
Inventor： Wan-Yi Lin , Ming-Hsien Wu
CPC classification number: H05K1/147 , H05K1/18 , H05K2201/10128
Abstract: A display device includes a first display module. The first display module includes a first support substrate, a first flexible substrate, a first conductive circuit, a plurality of first electronic elements, and a protection layer. The first flexible substrate is disposed on the first support substrate. The first conductive circuit is disposed on the first support substrate. The first electronic elements are disposed on the first conductive circuit, where the first conductive circuit is located between the first electronic elements and the first support substrate and is electrically connected to the first electronic elements. The protection layer covers the first electronic elements and the first conductive circuit. The first flexible substrate and the first conductive circuit are bent from a side surface of the first support substrate to a back surface of the first support substrate.
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公开(公告)号：US11837628B2
公开(公告)日：2023-12-05
申请号：US17385954
申请日：2021-07-27
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Chia-Hsin Chao , Yen-Hsiang Fang
IPC: H01L27/15
CPC classification number: H01L27/156
Abstract: A display array including a semiconductor stacked layer, an insulating layer, a plurality of electrode pads, and a driving backplane is provided. The semiconductor stacked layer has a plurality of light emitting regions arranged along a reference plane. The insulating layer is disposed to an outer surface of the semiconductor stacked layer and contacts the semiconductor stacked layer. The insulating layer has a plurality of openings respectively corresponding to the plurality of light emitting regions. The electrode pads are disposed to the insulating layer and are respectively electrically connect the plurality of light emitting regions through the plurality of openings. The driving backplane is disposed to the semiconductor stacked layer and electrically connected to the plurality of electrode pads, wherein a light emitting material layer of the semiconductor stacked layer has consistency along an extension direction of the reference plane.
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公开(公告)号：US20230053079A1
公开(公告)日：2023-02-16
申请号：US17974531
申请日：2022-10-27
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Chia-Hsin Chao , Yen-Hsiang Fang
Abstract: A method for manufacturing a display array includes the following steps: providing a substrate and forming a semiconductor stacked layer on the substrate; forming an insulating layer and a plurality of electrode pads on an outer surface of the semiconductor stacked layer, the insulating layer and the electrode pads directly contacting the semiconductor stacked layer, wherein the insulating layer has a plurality of openings spaced apart from each other; and transferring the semiconductor stacked layer, the insulating layer and the electrode pads from the substrate to a driving backplane, wherein the electrode pads are respectively electrically connected to the driving backplane through the openings of the insulating layer to form a plurality of light emitting regions in the semiconductor stacked layer as the electrode pads and the semiconductor stacked layer are energized by the driving backplane.
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公开(公告)号：US11515299B2
公开(公告)日：2022-11-29
申请号：US16232064
申请日：2018-12-26
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Chia-Hsin Chao , Yen-Hsiang Fang
Abstract: A method for manufacturing a display array includes the following steps: providing a substrate and forming a semiconductor stacked layer on the substrate; forming an insulating layer and a plurality of electrode pads on an outer surface of the semiconductor stacked layer, the insulating layer and the electrode pads directly contacting the semiconductor stacked layer, wherein the insulating layer has a plurality of openings, and the electrode pads are respectively located in the openings of the insulating layer and separated by the insulating layer; and transferring the semiconductor stacked layer, the insulating layer and the electrode pads from the substrate to a driving backplane, wherein the electrode pads are respectively electrically connected to a portion of the semiconductor stacked layer and the driving backplane through the openings of the insulating layer to form a plurality of light emitting regions in the semiconductor stacked layer.
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Patent Agency Ranking
公开(公告)号：US20210280747A1
公开(公告)日：2021-09-09
申请号：US16990968
申请日：2020-08-11
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Yao-Jun Tsai
Abstract: A subpixel structure includes a substrate and a light emitting diode chip. The light emitting diode chip is disposed on the substrate. The light emitting diode chip has a chip area and a light emitting area, and the light emitting area is less than or equal to one tenth of the chip area.
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公开(公告)号：US10679081B2
公开(公告)日：2020-06-09
申请号：US15730687
申请日：2017-10-11
Applicant: Industrial Technology Research Institute
Inventor： Chia-Hsin Chao , Yen-Hsiang Fang , Ming-Hsien Wu , Po-Hsun Wang
Abstract: A biometric device includes a substrate, an image sensor, at least one infrared light emitting diode (IR LED), a supporting structure and an optical layer. The image sensor is disposed on the substrate. The at least one IR LED is disposed on the substrate. The supporting structure is disposed on the substrate and located between the image sensor and the at least one infrared light emitting diode. The optical layer is disposed on the supporting structure, covers the image sensor, and includes a coded pattern.
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公开(公告)号：US10522062B2
公开(公告)日：2019-12-31
申请号：US15372409
申请日：2016-12-08
Applicant: Industrial Technology Research Institute
Inventor： Ying-Chien Chu , Yen-Hsiang Fang , Chia-Hsin Chao , Ming-Hsien Wu , Shih-Hao Wang
Abstract: A three-dimensional display module includes a substrate, a display layer, a first electrode layer, a liquid-crystal layer, a second electrode layer, and a drive unit. The substrate has first electrodes and second electrodes. The display layer is disposed on the substrate and includes light-emitting elements. The first electrode layer is disposed on the display layer. The liquid-crystal layer is disposed on the display layer. The second electrode layer is disposed on the liquid-crystal layer. The drive unit drives the first electrodes and the first electrode layer to supply power to the light-emitting elements, such that the light-emitting elements generate light passing through the liquid-crystal layer to form a display image. The drive unit drives the second electrodes and the second electrode layer to produce an electric field on the liquid-crystal layer to change focal length of the liquid-crystal layer so as to control depth of field of the display image.
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公开(公告)号：US20190355705A1
公开(公告)日：2019-11-21
申请号：US16232064
申请日：2018-12-26
Applicant: Industrial Technology Research Institute
Inventor： Ming-Hsien Wu , Chia-Hsin Chao , Yen-Hsiang Fang
Abstract: A method for manufacturing a display array includes the following steps: providing a substrate and forming a semiconductor stacked layer on the substrate; forming an insulating layer and a plurality of electrode pads on an outer surface of the semiconductor stacked layer, the insulating layer and the electrode pads directly contacting the semiconductor stacked layer, wherein the insulating layer has a plurality of openings, and the electrode pads are respectively located in the openings of the insulating layer and separated by the insulating layer; and transferring the semiconductor stacked layer, the insulating layer and the electrode pads from the substrate to a driving backplane, wherein the electrode pads are respectively electrically connected to a portion of the semiconductor stacked layer and the driving backplane through the openings of the insulating layer to form a plurality of light emitting regions in the semiconductor stacked layer.
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公开(公告)号：US09825013B2
公开(公告)日：2017-11-21
申请号：US14970548
申请日：2015-12-16
Applicant: Industrial Technology Research Institute
Inventor： Wen-Yung Yeh , Chia-Hsin Chao , Ming-Hsien Wu , Kuang-Yu Tai
IPC: H01L29/20 , H01L33/00 , H01L25/075 , H01L27/15 , H01L33/58 , H01L33/06 , H01L33/32 , H01L33/38 , H01L33/54 , H01L33/62 , H01L33/44
CPC classification number: H01L25/0753 , H01L27/156 , H01L33/06 , H01L33/32 , H01L33/38 , H01L33/44 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2924/0002 , H01L2924/00
Abstract: A light emitting device array including a circuit substrate and a plurality of device layers is provided. The circuit substrate includes a plurality of bonding pads and a plurality of conductive bumps located over the bonding pads. The device layers are capable of emitting different colored lights electrically connected with the circuit substrate through the conductive bumps and the bonding pads. The device layers capable of emitting different colored lights have different thicknesses and the conductive bumps bonded with the device layers capable of emitting different colored lights have different heights such that top surfaces of the device layers capable of emitting different colored lights are located on a same level of height.
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