-
11.发明申请Integrated Circuits with Magnetic Core Inductors and Methods of Fabrications Thereof 审中-公开具有磁芯电感器的集成电路及其制造方法公开(公告)号：US20140203399A1
公开(公告)日：2014-07-24
申请号：US14219944
申请日：2014-03-19
Applicant: Infineon Technologies AG
Inventor： Renate Hofmann , Carsten Ahrens , Wolfgang Klein , Alexander Glas
CPC classification number: H01L28/10 , H01F27/2804 , H01F41/046 , H01F2017/0066 , H01L23/5227 , H01L25/16 , H01L2924/0002 , H01L2924/00
Abstract: In one embodiment, a method of forming a semiconductor device includes forming a first inductor coil within and/or over a substrate. The first inductor coil is formed adjacent a top side of the substrate. First trenches are formed within the substrate adjacent the first inductor coil. The first trenches are filled at least partially with a magnetic fill material. At least a first portion of the substrate underlying the first inductor coil is thinned. A backside magnetic layer is formed under the first portion of the substrate. The backside magnetic layer and the magnetic fill material form at least a part of a magnetic core region of the first inductor coil.
Abstract translation: 在一个实施例中，形成半导体器件的方法包括在衬底之内和/或之上形成第一电感线圈。 第一电感线圈形成在衬底的顶侧附近。 第一沟槽形成在与第一电感线圈相邻的衬底内。 至少部分地用磁性填充材料填充第一沟槽。 至少第一电感线圈下面的衬底的第一部分变薄。 背面磁性层形成在基板的第一部分之下。 背面磁性层和磁性填充材料形成第一电感线圈的磁芯区域的至少一部分。
-
12.发明授权Integrated circuits with magnetic core inductors and methods of fabrications thereof 有权具有磁芯电感器的集成电路及其制造方法公开(公告)号：US08709831B2
公开(公告)日：2014-04-29
申请号：US13903935
申请日：2013-05-28
Applicant: Infineon Technologies Ag
Inventor： Renate Hofmann , Carsten Ahrens , Wolfgang Klein , Alexander Glas
IPC: H01L27/22
CPC classification number: H01L28/10 , H01F27/2804 , H01F41/046 , H01F2017/0066 , H01L23/5227 , H01L25/16 , H01L2924/0002 , H01L2924/00
Abstract: In one embodiment, a method of forming a semiconductor device includes forming a first inductor coil within and/or over a substrate. The first inductor coil is formed adjacent a top side of the substrate. First trenches are formed within the substrate adjacent the first inductor coil. The first trenches are filled at least partially with a magnetic fill material. At least a first portion of the substrate underlying the first inductor coil is thinned. A backside magnetic layer is formed under the first portion of the substrate. The backside magnetic layer and the magnetic fill material form at least a part of a magnetic core region of the first inductor coil.
Abstract translation: 在一个实施例中，形成半导体器件的方法包括在衬底之内和/或之上形成第一电感线圈。 第一电感线圈形成在衬底的顶侧附近。 第一沟槽形成在与第一电感线圈相邻的衬底内。 至少部分地用磁性填充材料填充第一沟槽。 至少第一电感线圈下面的衬底的第一部分变薄。 背面磁性层形成在基板的第一部分之下。 背面磁性层和磁性填充材料形成第一电感线圈的磁芯区域的至少一部分。
-
公开(公告)号：US12297102B2
公开(公告)日：2025-05-13
申请号：US18540253
申请日：2023-12-14
Applicant: Infineon Technologies AG
Inventor： Wolfgang Klein , Evangelos Angelopoulos , Stefan Barzen , Marc Fueldner , Stefan Geißler , Matthias Friedrich Herrmann , Ulrich Krumbein , Konstantin Tkachuk , Giordano Tosolini , Juergen Wagner
Abstract: In an embodiment, a method for forming a microfabricated structure includes depositing a first membrane on a substrate, depositing a first isolation layer on the first membrane, depositing a stator layer on the first isolation layer, forming a perforated stator from the stator layer, wherein the first isolation layer is disposed on a first surface of the perforated stator, depositing a second isolation layer on a second surface of the perforated stator and depositing a second membrane on the second isolation layer, including depositing a pillar coupled between the first membrane and the second membrane, wherein the first isolation layer includes a first glass layer having a low etch rate, and a second glass layer having a high etch rate embedded in the first glass layer.
-
公开(公告)号：US10981780B2
公开(公告)日：2021-04-20
申请号：US16543970
申请日：2019-08-19
Applicant: Infineon Technologies AG
Inventor： Wolfgang Klein , Evangelos Angelopoulos , Stefan Barzen , Marc Fueldner , Stefan Geissler , Matthias Friedrich Herrmann , Ulrich Krumbein , Konstantin Tkachuk , Giordano Tosolini , Juergen Wagner
Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.
-
公开(公告)号：US11212624B2
公开(公告)日：2021-12-28
申请号：US16533214
申请日：2019-08-06
Applicant: Infineon Technologies AG
Inventor： Wolfgang Klein , Karolina Gierl , Markus Meyer
Abstract: A MEMS-transducer comprises a membrane structure having a first main surface and a second main surface opposing the first main surface. A substrate structure holds the membrane structure, wherein the substrate structure overlaps with the first main surface of the membrane structure in a first edge region being adjacent to a first inner region of the first main surface. A gap is formed between the membrane structure and the substrate structure in the first edge region and extends from the first inner region into the first edge region.
-
Patent Agency Ranking
公开(公告)号：US20210053821A1
公开(公告)日：2021-02-25
申请号：US16543970
申请日：2019-08-19
Applicant: Infineon Technologies AG
Inventor： Wolfgang Klein , Evangelos Angelopoulos , Stefan Barzen , Marc Fueldner , Stefan Geissler , Matthias Friedrich Herrmann , Ulrich Krumbein , Konstantin Tkachuk , Giordano Tosolini , Juergen Wagner
Abstract: A microfabricated structure includes a deflectable membrane, a first clamping layer on a first surface of the deflectable membrane, a second clamping layer on a second surface of the deflectable membrane, a first perforated backplate on the first clamping layer, and a second perforated backplate on the second clamping layer, wherein the first clamping layer comprises a first tapered edge portion having a negative slope between the first perforated backplate and the deflectable membrane.
-
公开(公告)号：US20210040942A1
公开(公告)日：2021-02-11
申请号：US16922530
申请日：2020-07-07
Applicant: Infineon Technologies AG
Inventor： Martin Seidl , Alfons Dehe , Daniel Fruechtl , Wolfgang Klein , Ulrich Krumbein , Johann Strasser , Matthias Vobl
Abstract: A MEMS pump includes a basis structure, a membrane structure opposing the basis structure and being deflectable parallel to a surface normal of the basis structure and includes a pump chamber between the basis structure and the membrane structure wherein a volume of the pump chamber is based on a position of the membrane structure with respect to the basis structure. The MEMS pump includes a passage for letting a fluid pass into the pump chamber or exit the pump chamber, wherein the passage is arranged in-plane with respect to the pump chamber. The MEMS pump includes a valve structure coupled to the passage for connecting, in a first state, the passage to a first outer volume and for connecting, in a second state, the passage to a second outer volume.
-
公开(公告)号：US20200084549A1
公开(公告)日：2020-03-12
申请号：US16533214
申请日：2019-08-06
Applicant: Infineon Technologies AG
Inventor： Wolfgang Klein , Karolina Gierl , Markus Meyer
Abstract: A MEMS-transducer comprises a membrane structure having a first main surface and a second main surface opposing the first main surface. A substrate structure holds the membrane structure, wherein the substrate structure overlaps with the first main surface of the membrane structure in a first edge region being adjacent to a first inner region of the first main surface. A gap is formed between the membrane structure and the substrate structure in the first edge region and extends from the first inner region into the first edge region.
-
公开(公告)号：US20190215587A1
公开(公告)日：2019-07-11
申请号：US16241340
申请日：2019-01-07
Applicant: Infineon Technologies AG
Inventor： Wolfgang Klein
Abstract: A microelectromechanical system includes a housing with an access opening and a sound transducer with a membrane and a backplate, wherein the sound transducer is coupled to the access opening. The microelectromechanical system includes a filter arranged between the access opening and the sound transducer and includes a filter material and a pretension element, the pretension element being mechanically connected to the filter material, and wherein the pretension element produces stress in the filter material in order to provide a bending deformation of the filter in a direction away from the backplate.
-
20.发明申请公开(公告)号：US20180352337A1
公开(公告)日：2018-12-06
申请号：US16000260
申请日：2018-06-05
Applicant: Infineon Technologies AG
Inventor： Wolfgang Klein
Abstract: A MEMS sound transducer includes a backplate and a membrane held by an edge fixing such that the membrane is deflectable along a deflection direction toward the backplate. The MEMS sound transducer further includes an elevation element arranged between the membrane and the backplate and having a first height along the deflection direction. The MEMS sound transducer also includes a supporting structure and a spacer element arranged between the membrane and the supporting structure and having a second height along the deflection direction, the second height being greater than the first height. The supporting structure is the backplate or is a supporting element arranged opposite the backplate, such that the membrane is arranged between the backplate and the supporting element.
-
-
-
-
-
-
-
-
-
Search Results
45
records
(took 0.017 seconds)
