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公开(公告)号:US20170288067A1
公开(公告)日:2017-10-05
申请号:US15084727
申请日:2016-03-30
Applicant: Intel Corporation
Inventor: Arnon Hirshberg , Barak Freedman , Daniel Grodensky
IPC: H01L31/0203 , H01L31/102
CPC classification number: H01L31/0203 , G01J1/02 , G01J1/0271 , G01J1/0403 , G01J1/0411 , G01J1/0422 , G01J1/06 , G01J2001/0276
Abstract: Techniques for shielding an optical sensor are described. An example of an electronic device includes an optical sensor and a combined light-focusing and electrical-shielding unit disposed over the optical sensor. The light-focusing and electrical-shielding unit has two portions. The first portion gathers light and focuses the light on the electrical sensor. The second portion encloses sides of the first portion and is coated with an electrically conductive material to shield the optical sensor from electromagnetic interference.
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公开(公告)号:US20170090142A1
公开(公告)日:2017-03-30
申请号:US14865360
申请日:2015-09-25
Applicant: INTEL CORPORATION
Inventor: Barak Freedman , Adi Shechtman
Abstract: A method and apparatus for actively aligning an optical device are described. An apparatus includes an optical device. The optical device includes a supporting surface, a light source mounted to the supporting surface, a lens mount configured to hold a lens, a lens holder configured to hold the lens mount, wherein the lens mount is configured to be mounted to the supporting surface. A light detector is configured to determine a light intensity of a light beam through the lens, the light intensity indicating the alignment of the lens. An alignment device is to move the lens until the light intensity indicates that the lens is aligned, and a curing light is to cure adhesive layers between the lens and the lens mount, the lens mount and the lens holder, and the lens holder and the supporting surface.
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公开(公告)号:US20160373727A1
公开(公告)日:2016-12-22
申请号:US15251578
申请日:2016-08-30
Applicant: INTEL CORPORATION
Inventor: Ron Kimmel , Barak Freedman , Alex Bronstein , Michael Bronstein , Sagi Ben Moshe
CPC classification number: H04N13/246 , G06T7/521 , G06T7/80 , G06T2207/10024 , G06T2207/10028 , G06T2207/10048 , H04N5/2256 , H04N5/33 , H04N5/332 , H04N5/357 , H04N13/167 , H04N13/239 , H04N13/25 , H04N13/254 , H04N13/296
Abstract: Embodiments of the present disclosure provide techniques and configurations for an optoelectronic three-dimensional object acquisition assembly configured to correct image distortions. In one instance, the assembly may comprise a first device configured to project a light pattern on an object at a determined angle; a second device configured to capture a first image of the object illuminated with the projected light pattern; a third device configured to capture a second image of the object; and a controller coupled to the first, second, and third devices and configured to reconstruct an image of the object from geometric parameters of the object obtained from the first image, and to correct distortions in the reconstructed image caused by a variation of the determined angle of the light pattern projection, based at least in part on the first and second images of the object. Other embodiments may be described and/or claimed.
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公开(公告)号:US20150172635A1
公开(公告)日:2015-06-18
申请号:US14104242
申请日:2013-12-12
Applicant: Intel Corporation
Inventor: Ron Kimmel , Barak Freedman , Alex Bronstein , Michael Bronstein , Sagi Ben Moshe
CPC classification number: H04N13/246 , G06T7/521 , G06T7/80 , G06T2207/10024 , G06T2207/10028 , G06T2207/10048 , H04N5/2256 , H04N5/33 , H04N5/332 , H04N5/357 , H04N13/167 , H04N13/239 , H04N13/25 , H04N13/254 , H04N13/296
Abstract: Embodiments of the present disclosure provide techniques and configurations for an optoelectronic three-dimensional object acquisition assembly configured to correct image distortions. In one instance, the assembly may comprise a first device configured to project a light pattern on an object at a determined angle; a second device configured to capture a first image of the object illuminated with the projected light pattern; a third device configured to capture a second image of the object; and a controller coupled to the first, second, and third devices and configured to reconstruct an image of the object from geometric parameters of the object obtained from the first image, and to correct distortions in the reconstructed image caused by a variation of the determined angle of the light pattern projection, based at least in part on the first and second images of the object. Other embodiments may be described and/or claimed.
Abstract translation: 本公开的实施例提供了用于校正图像失真的光电三维物体采集组件的技术和配置。 在一个实例中,组件可以包括被配置成以确定的角度将光图案投射在物体上的第一装置; 第二装置,被配置为捕获被投射的光图案照射的对象的第一图像; 被配置为捕获所述对象的第二图像的第三设备; 以及控制器,其耦合到所述第一,第二和第三设备,并且被配置为根据从所述第一图像获得的对象的几何参数重建所述对象的图像,并且校正由所确定的角度的变化引起的所述重建图像中的失真 至少部分地基于对象的第一和第二图像。 可以描述和/或要求保护其他实施例。
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公开(公告)号:US10356389B2
公开(公告)日:2019-07-16
申请号:US14865330
申请日:2015-09-25
Applicant: INTEL CORPORATION
Inventor: Arnon Hirshberg , Barak Freedman
Abstract: A method and apparatus for dissipating an electrostatic charge from an optical element are described. An apparatus includes the optical element, a microelectromechanical system (MEMS) device located proximate to the optical element, and a conductive coating over the optical element, wherein the conductive coating is substantially transparent, and wherein the conductive coating dissipates the electrostatic charge.
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公开(公告)号:US10027950B2
公开(公告)日:2018-07-17
申请号:US15593313
申请日:2017-05-11
Applicant: INTEL CORPORATION
Inventor: Ron Kimmel , Barak Freedman , Alex Bronstein , Michael Bronstein , Sagi Ben Moshe
Abstract: Embodiments of the present disclosure provide techniques and configurations for an optoelectronic three-dimensional object acquisition assembly configured to correct image distortions. In one instance, the assembly may comprise a first device configured to project a light pattern on an object at a determined angle; a second device configured to capture a first image of the object illuminated with the projected light pattern; a third device configured to capture a second image of the object; and a controller coupled to the first, second, and third devices and configured to reconstruct an image of the object from geometric parameters of the object obtained from the first image, and to correct distortions in the reconstructed image caused by a variation of the determined angle of the light pattern projection, based at least in part on the first and second images of the object. Other embodiments may be described and/or claimed.
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公开(公告)号:US09874742B2
公开(公告)日:2018-01-23
申请号:US14865757
申请日:2015-09-25
Applicant: Intel Corporation
Inventor: Israel Petronius , Barak Freedman , Sagy Bareket , Arnon Hirshberg
CPC classification number: G02B26/0833 , B81B7/02 , G02B7/1821 , H05K1/028 , H05K1/111 , H05K1/189
Abstract: An apparatus for micro-electro-mechanical (MEMS) reinforcement is described herein. The apparatus includes a MEMS device and a stiffener. A micro scale mirror is to be embedded in a top layer of a substrate of the MEMS device. The stiffener is to be coupled to a back side of the MEMS device, wherein the stiffener is to stiffen the MEMS device via support of the MEMS device, without increasing a thickness of the MEMS device.
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公开(公告)号:US20170285238A1
公开(公告)日:2017-10-05
申请号:US15086709
申请日:2016-03-31
Applicant: Intel Corporation
Inventor: Arnon Hirshberg , Barak Freedman , Nikolai Berkovitch
CPC classification number: G02B5/3083 , G02B26/0833 , G02B27/283 , H04N3/08
Abstract: An optical assembly including a polarizing beam splitter (PBS) to receive a laser beam from a light source. A micro-electro-mechanical systems (MEMS) mirror disposed in a support structure of the assembly, wherein the MEMS mirror is rotatable and is configured to receive the laser beam from the PBS and to reflect an exit beam. A phase retardation layer deposited on the MEMS mirror.
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公开(公告)号:US20170090183A1
公开(公告)日:2017-03-30
申请号:US14865757
申请日:2015-09-25
Applicant: Intel Corporation
Inventor: Israel Petronius , Barak Freedman , Sagy Bareket , Arnon Hirshberg
CPC classification number: G02B26/0833 , B81B7/02 , G02B7/1821 , H05K1/028 , H05K1/111 , H05K1/189
Abstract: An apparatus for mirco-electro-mechanical (MEMS) reinforcement is described herein. The apparatus includes a MEMS device and a stiffener. A micro scale mirror is to be embedded in a top layer of a substrate of the MEMS device. The stiffener is to be coupled to a back side of the MEMS device, wherein the stiffener is to stiffen the MEMS device via support of the MEMS device, without increasing a thickness of the MEMS device.
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公开(公告)号:US09467680B2
公开(公告)日:2016-10-11
申请号:US14104242
申请日:2013-12-12
Applicant: Intel Corporation
Inventor: Ron Kimmel , Barak Freedman , Alex Bronstein , Michael Bronstein , Sagi Ben Moshe
CPC classification number: H04N13/246 , G06T7/521 , G06T7/80 , G06T2207/10024 , G06T2207/10028 , G06T2207/10048 , H04N5/2256 , H04N5/33 , H04N5/332 , H04N5/357 , H04N13/167 , H04N13/239 , H04N13/25 , H04N13/254 , H04N13/296
Abstract: Embodiments of the present disclosure provide techniques and configurations for an optoelectronic three-dimensional object acquisition assembly configured to correct image distortions. In one instance, the assembly may comprise a first device configured to project a light pattern on an object at a determined angle; a second device configured to capture a first image of the object illuminated with the projected light pattern; a third device configured to capture a second image of the object; and a controller coupled to the first, second, and third devices and configured to reconstruct an image of the object from geometric parameters of the object obtained from the first image, and to correct distortions in the reconstructed image caused by a variation of the determined angle of the light pattern projection, based at least in part on the first and second images of the object. Other embodiments may be described and/or claimed.
Abstract translation: 本公开的实施例提供了用于校正图像失真的光电三维物体采集组件的技术和配置。 在一个实例中,组件可以包括被配置成以确定的角度将光图案投射在物体上的第一装置; 第二装置,被配置为捕获被投射的光图案照射的对象的第一图像; 被配置为捕获所述对象的第二图像的第三设备; 以及控制器,其耦合到所述第一,第二和第三设备,并且被配置为根据从所述第一图像获得的对象的几何参数重建所述对象的图像,并且校正由所确定的角度的变化引起的所述重建图像中的失真 至少部分地基于对象的第一和第二图像。 可以描述和/或要求保护其他实施例。
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