公开(公告)号：US10906652B2

公开(公告)日：2021-02-02

申请号：US15663433

申请日：2017-07-28

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Gavin Sung ,  Michael Chih-Huei Wang ,  Vincent Hung ,  Jason Y. Jiang

IPC: B64D13/00 ,  G06F1/20 ,  H05K7/20 ,  B64C39/02

Abstract: Thermal management system for unmanned aerial vehicles are disclosed. An example housing for an unmanned aerial vehicle includes a central portion defining a cavity. The housing also includes a first arm to support a first propeller. The first arm has a first proximal end coupled to the central portion and a first distal end spaced from the central portion. The first distal end defines an inlet. The first arm defines a first fluid path in communication with the inlet and the central cavity. The housing also includes a second arm to support a second propeller. The second arm has a second proximal end coupled to the central portion and a second distal end spaced from the central portion. The second distal end defines an outlet. The second arm defines a second fluid path in communication with the outlet and the central cavity. The inlet and outlet are in fluid communication via the first path, the central cavity and the second path.

公开(公告)号：US20190141854A1

公开(公告)日：2019-05-09

申请号：US16231169

申请日：2018-12-21

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Gavin Sung ,  Tim Liu ,  Gerry Juan ,  Jason Y. Jiang

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/08 ,  H05K1/02

Abstract: In one aspect, an apparatus comprises a housing, a heat-generating component, a heat spreader, and a heat-transfer pipe. The housing forms a cavity in which the heat-generating component is located. The heat spreader is operable to distribute heat over a portion of the housing. The heat-transfer pipe is pivotally coupled to the heat-generating component and the heat spreader. The heat-transfer pipe operable to transfer heat from the heat-generating component to the heat spreader. The heat-transfer pipe and the heat spreader are movable between a first configuration and a second configuration. In the first configuration, a gap separates the heat spreader and the portion of the housing based on the heat-transfer pipe being at a first orientation. In the second configuration, the heat spreader closes the gap and is thermally coupled to the portion of the housing based on the heat-transfer pipe being at a second orientation.

公开(公告)号：US20170179645A1

公开(公告)日：2017-06-22

申请号：US14976170

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Gavin Sung ,  Jeff Ku ,  Lance Lin ,  Tim Liu ,  Jason Y. Jiang

IPC: H01R13/64 ,  H01R13/24

CPC classification number: H01R13/64 ,  G06F1/1613 ,  H01R13/24 ,  H01R13/2442 ,  H01R13/631 ,  H01R2201/06

Abstract: In one example an electronic device comprises at least one electronic component, a chassis comprising a first section, a connector to connect the first section of the chassis to a second section, the connector comprising a housing defining a first shaft, a retention structure disposed in the shaft, and a plurality of electrical contacts positioned within a corresponding plurality of channels in the retention structure. Other examples may be described.