公开(公告)号：US20240063082A1

公开(公告)日：2024-02-22

申请号：US18498891

申请日：2023-10-31

Applicant: Intel Corporation

Inventor： Barrett M. Faneuf ,  Phil Geng ,  Kenan Arik ,  David Shia ,  Casey Winkel ,  Sandeep Ahuja ,  Eric D. McAfee ,  Jeffory L. Smalley ,  Minh T.D. Le ,  Ralph V. Miele ,  Marc Milobinski ,  Aaron P. Anderson ,  Brendan T. Pavelek ,  Carlos Alvizo Flores ,  Fernando Gonzalez Lenero

IPC: H01L23/367 ,  H05K7/20 ,  H05K7/14 ,  G11C5/06

CPC classification number: H01L23/3677 ,  H05K7/20509 ,  H05K7/1422 ,  G11C5/06

Abstract: An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

公开(公告)号：US20230395460A1

公开(公告)日：2023-12-07

申请号：US18450928

申请日：2023-08-16

Applicant: Intel Corporation

Inventor： David Shia ,  Rick Canham ,  Eric W. Buddrius ,  Jeffory L. Smalley ,  John Beatty ,  Kenan Arik ,  Mohanraj Prabhugoud ,  Kirk Wheeler ,  Shelby Ferguson ,  Jorge Contreras Perez ,  Daniel Neumann ,  Ernesto Borboa Lizarraga

IPC: H01L23/40

CPC classification number: H01L23/4093 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2023/405

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for supports for internal hardware of electronic devices. An example support includes an integrated circuit (IC) carrier that includes a plurality of walls, supports carried by the walls to support an IC from below the IC, and a retention clip to secure the IC.

公开(公告)号：US11608919B2

公开(公告)日：2023-03-21

申请号：US16287418

申请日：2019-02-27

Applicant: INTEL CORPORATION

Inventor： Mark Sprenger ,  Joseph Broderick ,  Aaron Anderson ,  Kenan Arik ,  Brian Jarrett

IPC: F16L37/08 ,  F16L29/04 ,  F16L37/60 ,  F16L37/23 ,  F16L37/084 ,  F16L37/00

Abstract: Couplings are disclosed herein. A plug of a coupling includes a plug body and a socket interface coupled to the plug body. The socket interface includes a shoulder extending axially outward from the plug body, a neck extending axially outward and radially inward from the shoulder, and a socket guide extending axially outward and radially outward from the neck.

公开(公告)号：US09703327B2

公开(公告)日：2017-07-11

申请号：US14752938

申请日：2015-06-27

Applicant: Intel Corporation

Inventor： Mark E. Sprenger ,  Kenan Arik ,  Drew G. Damm

IPC: G06F1/16 ,  E05D7/10

CPC classification number: E05D7/1061 ,  E05D7/10 ,  G06F1/16 ,  G06F1/1616 ,  G06F1/1681 ,  Y10T16/554

Abstract: The present disclosure includes a fastenerless hinge system which enables a thin form factor low cost design. A hinge system described herein may include a hinge bracket and a hinge wing. The hinge bracket includes an elevated portion thereby providing a hollow region and one or more spring tabs. The hinge wing is slidably coupled to the hinge bracket through the hollow portion. Advantageously, a hinge system consistent with the present disclosure does not include fasteners such that the “Z” height of the computing device may be minimized in addition to reducing costs.