公开(公告)号：US09953909B2

公开(公告)日：2018-04-24

申请号：US15212951

申请日：2016-07-18

Applicant: Intel Corporation

Inventor： Zuyang Liang ,  Michael Garcia ,  Joshua D. Heppner ,  Srikant Nekkanty

IPC: H01L23/48 ,  H01L23/498 ,  H01L23/13

CPC classification number: H01L23/49816 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49827 ,  H01R13/2485

Abstract: Embodiments herein may relate to an electronic device that includes a board. The electronic device may include a device physically coupled with the board by an anchoring pin. The electronic device may further include a plurality of ball grid array (BGA) solder joints coupled with the device. For example, the BGA solder joints may electrically and/or communicatively couple one or more pins of the device with the board. The BGA solder joints may have a shape that is different than the anchoring pin. Other embodiments may be described and/or claimed.

公开(公告)号：US20180019558A1

公开(公告)日：2018-01-18

申请号：US15716356

申请日：2017-09-26

Applicant: INTEL CORPORATION

Inventor： Dhanya Athreya ,  Gaurav Chawla ,  Kemal Aygun ,  Glen P. Gordon ,  Sarah M. Canny ,  Jeffory L. Smalley ,  Srikant Nekkanty ,  Michael Garcia ,  Joshua D. Heppner

IPC: H01R33/76 ,  H01L23/32 ,  H01L23/498

CPC classification number: H01R33/7685 ,  H01L23/32 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

公开(公告)号：US20170288331A1

公开(公告)日：2017-10-05

申请号：US15084726

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Kuang C. Liu ,  Michael Garcia ,  Eric W. Buddrius ,  Kevin J. Ceurter ,  Jonathon Robert Carstens

IPC: H01R12/75 ,  H01R12/70

CPC classification number: H01R12/75 ,  H01R12/7023 ,  H01R12/774 ,  H01R13/639

Abstract: Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.

公开(公告)号：US20160254629A1

公开(公告)日：2016-09-01

申请号：US14764931

申请日：2014-09-26

Applicant: INTEL CORPORATION

Inventor： Dhanya Athreya ,  Gaurav Chawla ,  Kemal Aygun ,  Glen P. Gordon ,  Sarah M. Canny ,  Jeffory L. Smalley ,  Srikant Nekkanty ,  Michael Garcia ,  Joshua D. Heppner

IPC: H01R33/76 ,  H01L23/32

CPC classification number: H01R33/7685 ,  H01L23/32 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例针对套接触接触技术和配置。 在一个实施例中，装置可以包括具有第一侧和与第一侧相对设置的第二侧的插座衬底，通过插座衬底形成的开口，设置在开口中并被配置为在第一 所述电接触件具有延伸超过所述第一侧面的悬臂部分，其中所述开口中的所述插座基板的所述第一侧面和所述表面镀有金属。 可以描述和/或要求保护其他实施例。