公开(公告)号：US09825387B2

公开(公告)日：2017-11-21

申请号：US15084726

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Kuang C. Liu ,  Michael Garcia ,  Eric W. Buddrius ,  Kevin J. Ceurter ,  Jonathon Robert Carstens

IPC: H01R13/62 ,  H01R12/75 ,  H01R12/70 ,  H01R13/639

CPC classification number: H01R12/75 ,  H01R12/7023 ,  H01R12/774 ,  H01R13/639

Abstract: Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.

公开(公告)号：US10205292B2

公开(公告)日：2019-02-12

申请号：US15716356

申请日：2017-09-26

Applicant: INTEL CORPORATION

Inventor： Dhanya Athreya ,  Gaurav Chawla ,  Kemal Aygun ,  Glen P. Gordon ,  Sarah M. Canny ,  Jeffory L. Smalley ,  Srikant Nekkanty ,  Michael Garcia ,  Joshua D. Heppner

IPC: H01R33/76 ,  H01L23/32 ,  H01L23/498

Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

公开(公告)号：US20180002101A1

公开(公告)日：2018-01-04

申请号：US15201372

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Mingjie Xu ,  Pan GU ,  Bassam M. Ziadeh ,  Michael Garcia ,  Zhizhong Tang

IPC: B65D83/08 ,  B65D85/62

CPC classification number: B65D83/0811 ,  B65D85/62 ,  H01L2023/4075 ,  H01L2023/4087 ,  H01L2924/0002 ,  H05K13/0084 ,  H05K13/0434

Abstract: A container assembly and system for dispensing a stack of electronic device components includes an elongated tube having a cavity configured to contain a stack of said components. The tube has a dispensing end opposite an access end and a dispenser opening sized to dispense the electronic device components. The access end has an access opening sized to allow entry of a press to push the stack upwardly. A retainer is positioned proximate the access end to engage a last component in the stack and prevent it from exiting the tube through the access opening. The retainer may include a plurality of retainers. The retainer(s) can be a pair of retainers, four retainers, a chamfer formed in the tube, a perimeter insert, and/or a slidable panel. A method of making and a method of dispensing are provided.

公开(公告)号：US09615483B2

公开(公告)日：2017-04-04

申请号：US14484896

申请日：2014-09-12

Applicant: Intel Corporation

Inventor： Gaurav Chawla ,  Joshua D. Heppner ,  Vijaykumar Krithivasan ,  Michael Garcia ,  Kuang C. Liu ,  Rajasekaran Swaminathan

IPC: H05K7/20 ,  H01L23/367 ,  H01L23/40 ,  H01L23/433

CPC classification number: H05K7/20 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations associated with a package load assembly. In one embodiment, a package load assembly may include a frame configured to form a perimeter around a die area of a package substrate having a first surface configured to be coupled with a surface of the package substrate and a second surface disposed opposite to the first surface. The frame may include deformable members disposed on the second surface, which may be configured to be coupled with a base of a heat sink to distribute force applied between the heat sink and the package substrate, via the frame, and may deform under application of the force, which may allow the base of the heat sink to contact a surface of an integrated heat spreader within the die area of the package substrate.

公开(公告)号：US20180019193A1

公开(公告)日：2018-01-18

申请号：US15212951

申请日：2016-07-18

Applicant: Intel Corporation

Inventor： Zuyang Liang ,  Michael Garcia ,  Joshua D. Heppner ,  Srikant Nekkanty

IPC: H01L23/498 ,  H01L23/13

CPC classification number: H01L23/49816 ,  H01L23/13 ,  H01L23/49811 ,  H01L23/49827 ,  H01R13/2485

Abstract: Embodiments herein may relate to an electronic device that includes a board. The electronic device may include a device physically coupled with the board by an anchoring pin. The electronic device may further include a plurality of ball grid array (BGA) solder joints coupled with the device. For example, the BGA solder joints may electrically and/or communicatively couple one or more pins of the device with the board. The BGA solder joints may have a shape that is different than the anchoring pin. Other embodiments may be described and/or claimed.

公开(公告)号：US20170288330A1

公开(公告)日：2017-10-05

申请号：US15084682

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Kuang C. Liu ,  Michael Garcia ,  Eric W. Buddrius ,  Kevin J. Ceurter ,  Anthony P. Valpiani ,  Jonathon Robert Carstens

IPC: H01R12/75 ,  H01R12/70

Abstract: Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.

公开(公告)号：US09780510B2

公开(公告)日：2017-10-03

申请号：US14764931

申请日：2014-09-26

Applicant: INTEL CORPORATION

Inventor： Dhanya Athreya ,  Gaurav Chawla ,  Kemal Aygun ,  Glen P. Gordon ,  Sarah M. Canny ,  Jeffory L. Smalley ,  Srikant Nekkanty ,  Michael Garcia ,  Joshua D. Heppner

IPC: H01R24/00 ,  H01R33/76 ,  H01L23/32 ,  H01L23/498

CPC classification number: H01R33/7685 ,  H01L23/32 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed towards socket contact techniques and configurations. In one embodiment, an apparatus may include a socket substrate having a first side and a second side disposed opposite to the first side, an opening formed through the socket substrate, an electrical contact disposed in the opening and configured to route electrical signals between the first side and the second side of the socket substrate, the electrical contact having a cantilever portion that extends beyond the first side, wherein the first side and surfaces of the socket substrate in the opening are plated with a metal. Other embodiments may be described and/or claimed.

公开(公告)号：US20160079150A1

公开(公告)日：2016-03-17

申请号：US14484896

申请日：2014-09-12

Applicant: Intel Corporation

Inventor： Gaurav Chawla ,  Joshua D. Heppner ,  Vijaykumar Krithivasan ,  Michael Garcia ,  Kuang C. Liu ,  Rajasekaran Swaminathan

IPC: H01L23/498 ,  H01L23/36 ,  H01L21/48 ,  B23P15/26

CPC classification number: H05K7/20 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations associated with a package load assembly. In one embodiment, a package load assembly may include a frame configured to form a perimeter around a die area of a package substrate having a first surface configured to be coupled with a surface of the package substrate and a second surface disposed opposite to the first surface. The frame may include deformable members disposed on the second surface, which may be configured to be coupled with a base of a heat sink to distribute force applied between the heat sink and the package substrate, via the frame, and may deform under application of the force, which may allow the base of the heat sink to contact a surface of an integrated heat spreader within the die area of the package substrate.

Abstract translation: 本公开的实施例涉及与封装负载组件相关联的技术和配置。 在一个实施例中，包装负载组件可以包括框架，该框架被配置为围绕包装衬底的管芯区域形成周边，该封装衬底具有构造成与封装衬底的表面耦合的第一表面和与第一表面相对设置的第二表面 。 框架可以包括设置在第二表面上的可变形构件，其可以被配置为与散热器的底座相耦合，以经由框架分布施加在散热器和封装衬底之间的力，并且可以在应用 力，其可以允许散热器的底部接触在封装衬底的管芯区域内的集成散热器的表面。

公开(公告)号：US10680367B2

公开(公告)日：2020-06-09

申请号：US15084682

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Kuang C. Liu ,  Michael Garcia ,  Eric W. Buddrius ,  Kevin J. Ceurter ,  Anthony P. Valpiani ,  Jonathon Robert Carstens

IPC: H01R12/75 ,  H01R12/77 ,  H01R13/62 ,  H01R13/639 ,  H01R12/70

Abstract: Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.

公开(公告)号：US10214340B2

公开(公告)日：2019-02-26

申请号：US15201372

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Mingjie Xu ,  Pan Gu ,  Bassam M. Ziadeh ,  Michael Garcia ,  Zhizhong Tang

IPC: B65D83/08 ,  H05K13/00 ,  B65D85/62 ,  H05K13/04 ,  H01L23/40

Abstract: A container assembly and system for dispensing a stack of electronic device components includes an elongated tube having a cavity configured to contain a stack of said components. The tube has a dispensing end opposite an access end and a dispenser opening sized to dispense the electronic device components. The access end has an access opening sized to allow entry of a press to push the stack upwardly. A retainer is positioned proximate the access end to engage a last component in the stack and prevent it from exiting the tube through the access opening. The retainer may include a plurality of retainers. The retainer(s) can be a pair of retainers, four retainers, a chamfer formed in the tube, a perimeter insert, and/or a slidable panel. A method of making and a method of dispensing are provided.