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    LINEAR EDGE CONNECTOR RETENTION
    6.
    发明申请
    LINEAR EDGE CONNECTOR RETENTION 审中-公开

    公开(公告)号：US20170288330A1

    公开(公告)日：2017-10-05

    申请号：US15084682

    申请日：2016-03-30

    申请人： Intel Corporation

    发明人： Feifei Cheng ,  Kuang C. Liu ,  Michael Garcia ,  Eric W. Buddrius ,  Kevin J. Ceurter ,  Anthony P. Valpiani ,  Jonathon Robert Carstens

    IPC分类号： H01R12/75 ,  H01R12/70

    摘要： Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.

    TECHNIQUES AND CONFIGURATIONS ASSOCIATED WITH A PACKAGE LOAD ASSEMBLY
    8.
    发明申请
    TECHNIQUES AND CONFIGURATIONS ASSOCIATED WITH A PACKAGE LOAD ASSEMBLY 有权
    与包装装配相关的技术和配置

    公开(公告)号：US20160079150A1

    公开(公告)日：2016-03-17

    申请号：US14484896

    申请日：2014-09-12

    申请人： Intel Corporation

    发明人： Gaurav Chawla ,  Joshua D. Heppner ,  Vijaykumar Krithivasan ,  Michael Garcia ,  Kuang C. Liu ,  Rajasekaran Swaminathan

    IPC分类号： H01L23/498 ,  H01L23/36 ,  H01L21/48 ,  B23P15/26

    CPC分类号： H05K7/20 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/00

    摘要： Embodiments of the present disclosure are directed toward techniques and configurations associated with a package load assembly. In one embodiment, a package load assembly may include a frame configured to form a perimeter around a die area of a package substrate having a first surface configured to be coupled with a surface of the package substrate and a second surface disposed opposite to the first surface. The frame may include deformable members disposed on the second surface, which may be configured to be coupled with a base of a heat sink to distribute force applied between the heat sink and the package substrate, via the frame, and may deform under application of the force, which may allow the base of the heat sink to contact a surface of an integrated heat spreader within the die area of the package substrate.

    摘要翻译： 本公开的实施例涉及与封装负载组件相关联的技术和配置。 在一个实施例中，包装负载组件可以包括框架，该框架被配置为围绕包装衬底的管芯区域形成周边，该封装衬底具有构造成与封装衬底的表面耦合的第一表面和与第一表面相对设置的第二表面 。 框架可以包括设置在第二表面上的可变形构件，其可以被配置为与散热器的底座相耦合，以经由框架分布施加在散热器和封装衬底之间的力，并且可以在应用 力，其可以允许散热器的底部接触在封装衬底的管芯区域内的集成散热器的表面。

    Containers for holding and dispensing stacks of electronic device components
    10.
    发明授权
    Containers for holding and dispensing stacks of electronic device components 有权

    公开(公告)号：US10214340B2

    公开(公告)日：2019-02-26

    申请号：US15201372

    申请日：2016-07-01

    申请人： Intel Corporation

    发明人： Mingjie Xu ,  Pan Gu ,  Bassam M. Ziadeh ,  Michael Garcia ,  Zhizhong Tang

    IPC分类号： B65D83/08 ,  H05K13/00 ,  B65D85/62 ,  H05K13/04 ,  H01L23/40

    摘要： A container assembly and system for dispensing a stack of electronic device components includes an elongated tube having a cavity configured to contain a stack of said components. The tube has a dispensing end opposite an access end and a dispenser opening sized to dispense the electronic device components. The access end has an access opening sized to allow entry of a press to push the stack upwardly. A retainer is positioned proximate the access end to engage a last component in the stack and prevent it from exiting the tube through the access opening. The retainer may include a plurality of retainers. The retainer(s) can be a pair of retainers, four retainers, a chamfer formed in the tube, a perimeter insert, and/or a slidable panel. A method of making and a method of dispensing are provided.