公开(公告)号：US11444205B2

公开(公告)日：2022-09-13

申请号：US16143001

申请日：2018-09-26

Applicant: Intel Corporation

Inventor： Arnab Sen Gupta ,  Matthew Metz ,  Benjamin Chu-Kung ,  Abhishek Sharma ,  Van H. Le ,  Miriam R. Reshotko ,  Christopher J. Jezewski ,  Ryan Arch ,  Ande Kitamura ,  Jack T. Kavalieros ,  Seung Hoon Sung ,  Lawrence Wong ,  Tahir Ghani

IPC: H01L29/786 ,  H01L23/31 ,  H01L29/45 ,  H01L29/40 ,  H01L29/66 ,  H01L27/24 ,  H01L27/108

Abstract: Embodiments herein describe techniques for a semiconductor device including a substrate and a transistor above the substrate. The transistor includes a channel layer above the substrate, a conductive contact stack above the substrate and in contact with the channel layer, and a gate electrode separated from the channel layer by a gate dielectric layer. The conductive contact stack may be a drain electrode or a source electrode. In detail, the conductive contact stack includes at least a metal layer, and at least a metal sealant layer to reduce hydrogen diffused into the channel layer through the conductive contact stack. Other embodiments may be described and/or claimed.

公开(公告)号：US20200098619A1

公开(公告)日：2020-03-26

申请号：US16141522

申请日：2018-09-25

Applicant: INTEL CORPORATION

Inventor： Thomas Marieb ,  Zhiyong Ma ,  Miriam R. Reshotko ,  Christopher Jezewski ,  Flavio Griggio ,  Rahim Kasim ,  Nikholas G. Toledo

IPC: H01L21/768 ,  H01L23/532 ,  C23C18/48 ,  C25D3/58

Abstract: Techniques are disclosed for providing cladded metal interconnects. Given an interconnect trench, a barrier layer is conformally deposited onto the bottom and sidewalls of the trench. A first layer of a bilayer adhesion liner is selectively deposited on the barrier layer, and a second layer of the bilayer adhesion liner is selectively deposited on the first layer. An interconnect metal is deposited into the trench above the bilayer adhesion liner. Any excess interconnect metal is recessed to get the top surface of the interconnect metal to a proper plane. Recessing the excess interconnect metal may include recessing previously deposited excess adhesion liner and barrier layer materials. The exposed top surface of the interconnect metal in the trench is then capped with the bilayer adhesion liner materials to provide a cladded metal interconnect core. In some embodiments, the adhesion liner is a single layer adhesion liner.