公开(公告)号：US20190057937A1

公开(公告)日：2019-02-21

申请号：US15774221

申请日：2015-12-09

Applicant: Intel Corporation

Inventor： Robert Starkston ,  Robert L. Sankman ,  Scott M. Mokler ,  Richard C. Stamey

IPC: H01L23/538 ,  H01L23/498

CPC classification number: H01L23/5385 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49894 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L25/0655 ,  H01L2221/68345

Abstract: A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.

公开(公告)号：US11444033B2

公开(公告)日：2022-09-13

申请号：US16918900

申请日：2020-07-01

Applicant: Intel Corporation

Inventor： Robert Starkston ,  Robert L. Sankman ,  Scott M. Mokler ,  Richard C. Stamey

IPC: H01L23/538 ,  H01L21/683 ,  H01L21/48 ,  H01L23/498 ,  H01L25/065

Abstract: A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.

公开(公告)号：US20180343744A1

公开(公告)日：2018-11-29

申请号：US15771774

申请日：2015-12-03

Applicant: INTEL CORPORATION

Inventor： Robert Starkston ,  Richard C. Stamey ,  Robert L. Sankman ,  Scott M. Mokler

IPC: H05K1/18 ,  H05K1/11 ,  H05K1/14 ,  H05K3/42

Abstract: A hybrid microelectronic substrate may be formed by the incorporation of a high density microelectronic patch substrate within a lower density microelectronic substrate. The hybrid microelectronic substrate may allow for direct flip chip attachment of a microelectronic device having high density interconnections to the high density microelectronic patch substrate portion of the hybrid microelectronic substrate, while allowing for lower density interconnection and electrical routes in areas where high density interconnections are not required.

公开(公告)号：US20170071079A1

公开(公告)日：2017-03-09

申请号：US15356873

申请日：2016-11-21

Applicant: Intel Corporation

Inventor： Shankar Krishnan ,  Richard C. Stamey ,  Brian S. Jarrett ,  Geoffrey G. Von Allmen

IPC: H05K7/20

CPC classification number: H05K7/20836 ,  H01L23/44 ,  H05K7/20236 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

Abstract: Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

Abstract translation: 本文公开了与冷却电子设备的一个或多个发热部件相关联的装置，方法和存储介质。 在实施例中，电子设备可以包括可以包括介电流体和一个或多个发热部件的罐。 电子设备还可以包括与罐相耦合的一个或多个换能器。 换能器可以被配置为产生超声波，其控制介质流体在罐内的位置的运动。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09516792B2

公开(公告)日：2016-12-06

申请号：US14668331

申请日：2015-03-25

Applicant: Intel Corporation

Inventor： Shankar Krishnan ,  Richard C. Stamey ,  Brian S. Jarrett ,  Geoffrey G. Von Allmen

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20836 ,  H01L23/44 ,  H05K7/20236 ,  H05K7/20272 ,  H05K7/20281 ,  H05K7/203 ,  H05K7/20772 ,  H05K7/20781 ,  H05K7/2079

Abstract: Apparatuses, methods and storage media associated with cooling one or more heat-generating components of an electronic device are disclosed herein. In embodiments, an electronic device may include a tank that may include a dielectric fluid and one or more heat-generating components. The electronic device may further include one or more transducers coupled with the tank. The transducers may be configured to generate an ultrasonic wave that controls movement of the dielectric fluid at a location within the tank. Other embodiments may be described and/or claimed.

Abstract translation: 本文公开了与冷却电子设备的一个或多个发热部件相关联的装置，方法和存储介质。 在实施例中，电子设备可以包括可以包括介电流体和一个或多个发热部件的罐。 电子设备还可以包括与罐相耦合的一个或多个换能器。 换能器可以被配置为产生超声波，其控制介质流体在罐内的位置的运动。 可以描述和/或要求保护其他实施例。