公开(公告)号：US11652071B2

公开(公告)日：2023-05-16

申请号：US17158634

申请日：2021-01-26

Applicant: Intel Corporation

Inventor： Brandon C Marin ,  Shivasubramanian Balasubramanian ,  Rahul Jain ,  Praneeth Akkinepally ,  Jeremy D Ecton

IPC: H01L23/495 ,  H01L23/64 ,  H01L23/498 ,  H01L49/02 ,  H01L21/48

CPC classification number: H01L23/642 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L28/40

Abstract: A substrate for an electronic device may include a first layer, a second layer, and may include a third layer. The first layer may include a capacitive material, and the capacitive material may be segmented into a first section, and a second section. Each of the first section and the second section may include a first surface and a second surface. The second layer may include a first conductor. The third layer may include a second conductor. The first surface of the second section of capacitive material may be directly coupled to the first conductor. The second surface of the second section of the capacitive material may be directly coupled to the second conductor. A first filler region may include a dielectric material and the first filler region may be located in a first gap between the first section of capacitive material and the second section of capacitive material.

公开(公告)号：US20220005638A1

公开(公告)日：2022-01-06

申请号：US17482861

申请日：2021-09-23

Applicant: Intel Corporation

Inventor： Brandon C. Marin ,  Frank Truong ,  Shivasubramanian Balasubramanian

IPC: H01F1/20 ,  H01F27/28 ,  H01L23/00 ,  H01L23/64 ,  H01L23/498 ,  H01F17/00

Abstract: A magnetic material may be fabricated with a plurality of magnetic filler particles dispersed within a carrier material, wherein at last one of the magnetic filler particles may comprise a ferromagnetic core coated with an inert material to form a shell surrounding the ferromagnetic core. Such a coating may allow for the use of ferromagnetic materials for forming embedded inductors in package substrates without the risk of being incompatible with fabrication processes used to form these package substrates.

公开(公告)号：US20200350396A1

公开(公告)日：2020-11-05

申请号：US16934873

申请日：2020-07-21

Applicant: Intel Corporation

Inventor： Shivasubramanian Balasubramanian ,  Dilan Seneviratne

IPC: H01L49/02 ,  H01L23/498 ,  H01L23/522 ,  H01L27/08

Abstract: A semiconductor package substrate includes an integral magnetic-helical inductor that is assembled during assembly of the semiconductor package substrate. The integral magnetic-helical inductor is located within a die footprint within the semiconductor package substrate.