公开(公告)号：US09510459B2

公开(公告)日：2016-11-29

申请号：US14098551

申请日：2013-12-06

Applicant: Industrial Technology Research Institute

Inventor： Jing-Yi Yan ,  Shu-Tang Yeh ,  Sheng-Wei Chen ,  Kuang-Jung Chen

IPC: H05K3/30 ,  H01L51/52 ,  G02F1/1333

CPC classification number: H05K3/30 ,  G02F1/133308 ,  G02F2001/133311 ,  G02F2202/28 ,  H01L51/5246 ,  H01L51/5259 ,  Y10T29/49128

Abstract: An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, a side wall barrier structure, a first adhesive, and a second adhesive is provided. The environmental sensitive electronic device is located on the first substrate. The first adhesive is located on the first substrate. The side wall barrier structure is located on the first adhesive, and the side wall barrier structure is adhered to the first substrate through the first adhesive. The second adhesive is located on the side wall barrier structure. The side wall barrier structure is adhered to the second substrate through the second adhesive, and the side wall barrier structure, the first adhesive, and the second adhesive are located between the first substrate and the second substrate. A manufacturing method of an environmental sensitive electronic device package is also provided.

Abstract translation: 提供了包括第一基板，第二基板，环境敏感电子设备，侧壁阻挡结构，第一粘合剂和第二粘合剂的环境敏感的电子设备封装。 环境敏感电子设备位于第一基板上。 第一粘合剂位于第一基底上。 侧壁阻挡结构位于第一粘合剂上，并且侧壁阻挡结构通过第一粘合剂粘附到第一基底。 第二粘合剂位于侧壁阻挡结构上。 侧壁阻挡结构通过第二粘合剂粘附到第二基板，并且侧壁阻挡结构，第一粘合剂和第二粘合剂位于第一基板和第二基板之间。 还提供了一种环境敏感电子设备封装的制造方法。

公开(公告)号：US20140349091A1

公开(公告)日：2014-11-27

申请号：US14055845

申请日：2013-10-16

Applicant: Industrial Technology Research Institute

Inventor： Jing-Yi Yan ,  Chen-Yu Chiang ,  Wen-Tung Wang ,  Bo-Cheng Kung ,  Hung-Chien Lin ,  Liang-Hsiang Chen

IPC: H01L51/52 ,  G02F1/1335 ,  G02F1/1333 ,  H01L51/00

CPC classification number: H01L51/5256 ,  H01L51/003 ,  H01L51/0097 ,  H01L2251/55 ,  Y02E10/549 ,  Y10T428/24942

Abstract: A thin-film device may include a carrier, a release layer, a stacking structure, and a flexible substrate. The release layer may be overlaid on the carrier, and the stacking structure is overlaid on the release layer. The stacking structure may include a first protective layer and a second protective layer, wherein the refractive index of the first protective layer exceeds that of the second protective layer. The flexible substrate may be overlaid on the release layer.

Abstract translation: 薄膜器件可以包括载体，释放层，堆叠结构和柔性基底。 释放层可以覆盖在载体上，堆叠结构覆盖在释放层上。 堆叠结构可以包括第一保护层和第二保护层，其中第一保护层的折射率超过第二保护层的折射率。 柔性基底可以覆盖在释放层上。

公开(公告)号：US08878226B2

公开(公告)日：2014-11-04

申请号：US13744207

申请日：2013-01-17

Applicant: Industrial Technology Research Institute

Inventor： Jing-Yi Yan ,  Shu-Tang Yeh ,  Chih-Chieh Hsu ,  Chen-Wei Lin ,  Kuang-Jung Chen

IPC: H01L33/00 ,  H01L51/52 ,  H01L27/32

CPC classification number: H01L51/5228 ,  H01L27/3244

Abstract: A light emitting device includes a substrate, and a plurality of light emitting structures disposed thereon. Each of the light emitting structures includes an auxiliary electrode disposed on the substrate, a first insulating layer disposed on the substrate and covering the auxiliary electrode, an electrode disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and having a first opening exposing the electrode, an organic light emitting layer disposed in the first opening, a cathode disposed on the organic light emitting layer, at least a conductive structure penetrating through the first insulating layer and the second insulating layer, and a closed ring structure disposed on the second insulating layer and around the cathode, wherein a thickness of the closed ring structure is larger than that of the cathode.

Abstract translation: 发光器件包括衬底和设置在其上的多个发光结构。 每个发光结构包括设置在基板上的辅助电极，设置在基板上并覆盖辅助电极的第一绝缘层，设置在第一绝缘层上的电极，设置在第一绝缘层上的第二绝缘层， 暴露电极的第一开口，设置在第一开口中的有机发光层，设置在有机发光层上的阴极，至少穿过第一绝缘层和第二绝缘层的导电结构，以及闭环结构 设置在第二绝缘层上并围绕阴极，其中闭环结构的厚度大于阴极的厚度。

公开(公告)号：US20130193843A1

公开(公告)日：2013-08-01

申请号：US13753449

申请日：2013-01-29

Applicant: Industrial Technology Research Institute

Inventor： Jing-Yi Yan ,  Chih-Chieh Hsu ,  Chen-Wei Lin ,  Shu-Tang Yeh ,  Ping-I Shih

IPC: H05B33/22

CPC classification number: H05B33/22 ,  H01L27/3211 ,  H01L27/322 ,  H01L27/3267 ,  H01L51/5218 ,  H01L51/5234

Abstract: A double-side light emitting display panel includes a substrate, a plurality of top emission pixel structures and a plurality of bottom emission pixel structures. The top emission pixel structures are disposed on the substrate, and the bottom emission pixel structures are disposed on the substrate. The top emission pixel structures and the bottom emission pixel structures are arranged alternatively on the substrate.

Abstract translation: 双面发光显示面板包括基板，多个顶部发射像素结构和多个底部发射像素结构。 顶部发射像素结构设置在衬底上，并且底部发射像素结构设置在衬底上。 顶部发射像素结构和底部发射像素结构交替地布置在衬底上。