公开(公告)号：US10199238B2

公开(公告)日：2019-02-05

申请号：US15903913

申请日：2018-02-23

Applicant: Infineon Technologies AG

Inventor： Inpil Yoo ,  Andreas Grassmann

IPC: H01L21/48 ,  H01L23/473 ,  H01L23/498 ,  H01L23/18 ,  H01L21/54 ,  H01L23/373 ,  H01L23/44 ,  H01L21/56 ,  H01L23/08 ,  H01L23/367 ,  H01L23/31

Abstract: A cooling apparatus includes a discrete module and a plastic housing. The discrete module includes a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound and a first cooling plate at least partly uncovered by the mold compound. The plastic housing surrounds the periphery of the discrete module. The plastic housing includes a first singular plastic part which receives the discrete module and a second singular plastic part attached to a periphery of the first plastic part. The second plastic part has a cutout which exposes at least part of the first cooling plate and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of the discrete module at a side of the discrete module with the first cooling plate.

公开(公告)号：US20180182643A1

公开(公告)日：2018-06-28

申请号：US15903913

申请日：2018-02-23

Applicant: Infineon Technologies AG

Inventor： Inpil Yoo ,  Andreas Grassmann

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/473 ,  H01L23/44 ,  H01L23/373 ,  H01L23/367 ,  H01L23/18 ,  H01L23/08 ,  H01L21/56 ,  H01L21/54 ,  H01L23/31

CPC classification number: H01L21/4882 ,  H01L21/4817 ,  H01L21/4875 ,  H01L21/54 ,  H01L21/565 ,  H01L23/08 ,  H01L23/18 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/3672 ,  H01L23/3737 ,  H01L23/44 ,  H01L23/473 ,  H01L23/49811

Abstract: A cooling apparatus includes a discrete module and a plastic housing. The discrete module incudes a semiconductor die encapsulated by a mold compound, a plurality of leads electrically connected to the semiconductor die and protruding out of the mold compound and a first cooling plate at least partly uncovered by the mold compound. The plastic housing surrounds the periphery of the discrete module. The plastic housing includes a first singular plastic part which receives the discrete module and a second singular plastic part attached to a periphery of the first plastic part. The second plastic part has a cutout which exposes at least part of the first cooling plate and a sealing structure containing a sealing material which forms a water-tight seal around the periphery of the discrete module at a side of the discrete module with the first cooling plate.

公开(公告)号：US20170154835A1

公开(公告)日：2017-06-01

申请号：US15432680

申请日：2017-02-14

Applicant: Infineon Technologies AG

Inventor： Christian Neugirg ,  Andreas Grassmann ,  Wolfram Hable ,  Ottmar Geitner ,  Frank Winter ,  Alexander Schwarz ,  Inpil Yoo

IPC: H01L23/373 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/3733 ,  H01L21/4853 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/373 ,  H01L23/49833 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/40137 ,  H01L2224/83801 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/181 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.