公开(公告)号：US20180323877A9

公开(公告)日：2018-11-08

申请号：US15398714

申请日：2017-01-04

Applicant: Infinera Corporation

Inventor： Peter W. Evans ,  Jeffrey T. Rahn ,  Vikrant Lal ,  Miguel Iglesias Olmedo ,  Amir Hosseini ,  Parmijit Samra ,  Scott Corzine ,  Ryan W. Going

IPC: H04B10/50 ,  H04B10/40 ,  H04B10/67 ,  H04B10/2507 ,  G02F1/225

CPC classification number: H04B10/503 ,  G02B6/2813 ,  G02F1/2255 ,  G02F1/2257 ,  G02F2001/212 ,  H01S5/02453 ,  H01S5/02461 ,  H01S5/0261 ,  H01S5/0425 ,  H01S5/0612 ,  H01S5/06256 ,  H01S5/1003 ,  H01S5/1014 ,  H01S5/1017 ,  H01S5/1215 ,  H01S5/2081 ,  H01S5/22 ,  H01S5/3013 ,  H01S5/3214 ,  H01S2301/176 ,  H04B10/2507 ,  H04B10/40 ,  H04B10/616 ,  H04B10/67

Abstract: Methods, systems, and apparatus, including an optical receiver including an optical source, including a substrate; a laser provided on the substrate, the laser having first and second sides and outputting first light from the first side and second light from the second side, the first light output from the first side of the laser has a first power and the second light output from the second side has a second power; and a first modulator that receives the first light and a second modulator that receives the second light, such that the power of the first light at an input of the first modulator is substantially equal to the power of the second light at an input of the second modulator.

公开(公告)号：US10026723B2

公开(公告)日：2018-07-17

申请号：US15398708

申请日：2017-01-04

Applicant: Infinera Corporation

Inventor： Peter W. Evans ,  John W. Osenbach ,  Fred A. Kish ,  Jiaming Zhang ,  Miguel Iglesias Olmedo ,  Maria Anagnosti

IPC: H01L25/18 ,  H01L23/498 ,  H01L23/00 ,  H01L31/02 ,  H01L23/538 ,  G02F1/225 ,  G02B6/12 ,  G02F1/21

Abstract: Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including a lumped active optical element; an electrode configured to receive an electrical signal, where at least one characteristics of the lumped active optical element is changed based on the electrical signal received by the electrode; a ground electrode; and a bond contact electrically coupled to the electrode; and an interposer bonded to at least a portion of the photonic integrated circuit chip, the interposer including a conductive trace formed on a surface of the interposer, the conductive trace electrically coupled to a source of the electrical signal; a ground trace; and a conductive via bonded with the bond contact of the photonic integrated circuit chip, the conductive via electrically coupled to the conductive trace to provide the electrical signal to the electrode of the photonic integrated circuit chip.