ELECTRONIC DEVICES
    11.
    发明申请

    公开(公告)号:US20220102415A1

    公开(公告)日:2022-03-31

    申请号:US17410410

    申请日:2021-08-24

    Abstract: An electronic device is provided. The electronic device includes an optical sensing module that includes an optical sensor array. The optical sensor array includes at least one optical sensor, at least one transparent layer disposed on the optical sensor array, and a microlens array. The microlens array includes at least one microlens and is disposed on the transparent layer.

    DISPLAY DEVICE
    12.
    发明申请

    公开(公告)号:US20220075219A1

    公开(公告)日:2022-03-10

    申请号:US17524944

    申请日:2021-11-12

    Abstract: The display device includes a first substrate; an active layer disposed on the first substrate; a first insulation layer disposed on the active layer; a first electrode layer disposed on the first insulation layer including a gate electrode line extending along a first direction and a protruding portion extending along a second direction; a second insulation layer disposed on the first electrode layer; and a second electrode layer disposed on the second insulation layer. The second electrode layer includes a date line extending along the second direction and a conductive layer. The conductive layer includes a first conductive portion and a second conductive portion, wherein the first conductive portion has a first maximum width A along the first direction, and the second conductive portion has a second maximum width B along the first direction. The first maximum width A is less than the second maximum width B.

    DISPLAY DEVICE
    13.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20180239182A1

    公开(公告)日:2018-08-23

    申请号:US15958052

    申请日:2018-04-20

    Abstract: A display device includes a first substrate, and a semiconductor layer, and a gate line disposed over the first substrate. The gate line overlaps the semiconductor layer. The display device also includes a first insulating layer disposed over the semiconductor layer, wherein a first opening is formed through the first insulating layer. The display device further includes a metal pad disposed over the first insulating layer, being electrically connected to the semiconductor layer through the first opening, and a data line disposed over the first insulating layer, wherein the data line crosses the gate line. In addition, the display device includes a second insulating layer disposed over the metal pad and the first insulating layer, wherein a second opening is formed through the second insulating layer, and the second opening at least partially overlaps the gate line.

    PHOTO DETECTOR DEVICE
    14.
    发明申请

    公开(公告)号:US20180102393A1

    公开(公告)日:2018-04-12

    申请号:US15707423

    申请日:2017-09-18

    Abstract: A photo detector device is provided. The photo detector device includes a substrate, a first metal layer, a first interlayer dielectric layer, an active layer, a photodiode, and a second metal layer. The first metal layer is disposed on the substrate, wherein the first metal layer includes a gate line and a gate, and the gate is electrically connected to the gate line. The first interlayer dielectric layer is disposed on the first metal layer. The active layer is electrically insulated from the gate and partially overlaps the gate. The photodiode is disposed on the substrate. The second metal layer is disposed on the first interlayer dielectric layer, wherein the second metal layer includes a data line and a bias line, and the bias line is disposed on the photodiode.

    Sensing device
    15.
    发明公开
    Sensing device 审中-公开

    公开(公告)号:US20240361183A1

    公开(公告)日:2024-10-31

    申请号:US18619784

    申请日:2024-03-28

    CPC classification number: G01J5/0806

    Abstract: A sensing device includes: a first substrate; a plurality of sensing units disposed on the first substrate, wherein the plurality of sensing units are used for sensing light with wavelengths within a wavelength range; and a second substrate disposed opposite to the first substrate and assembled to the first substrate, wherein the second substrate has an overlapping area overlapping with the plurality of sensing units in a normal direction of the first substrate, wherein the second substrate has an optical lens in the overlapping area, the optical lens includes a plurality of micro-structures, and a pitch between the plurality of micro-structures is less than or equal to a maximum wavelength value of the wavelength range.

    SENSING DEVICE AND ELECTRONIC DEVICE
    16.
    发明公开

    公开(公告)号:US20240313027A1

    公开(公告)日:2024-09-19

    申请号:US18676702

    申请日:2024-05-29

    Abstract: A sensing device is provided. The sensing device includes a driving substrate, a sensing module, and a plurality of bonding pads. The driving substrate includes a first substrate and a plurality of driving circuits disposed on the first substrate. Each of the driving circuits includes a plurality of thin-film transistors. The sensing module is bonded to the driving substrate, and the sensing module includes a second substrate and a plurality of sensing elements disposed on the second substrate. The sensing module is bonded to the driving substrate through the bonding pads. In addition, each of the driving circuits is electrically connected to at least one of the sensing elements. The wavelength of light penetrating the first substrate is greater than or equal to 4 μm and less than or equal to 10 μm. An electronic device including the sensing device is also provided.

    Sensing device and method for manufacturing the same

    公开(公告)号:US20240255351A1

    公开(公告)日:2024-08-01

    申请号:US18410338

    申请日:2024-01-11

    CPC classification number: G01J3/2803 H10N19/00

    Abstract: The present disclosure provides a sensing device and a method for manufacturing the same. The method for manufacturing the sensing device includes the following steps: providing a first temporary substrate, wherein the first temporary substrate includes: a first carrier; a first substrate disposed on the first carrier; and a plurality of sensing elements disposed on the first substrate; providing a second temporary substrate, wherein the second temporary substrate includes: a second carrier; and a second substrate disposed on the second carrier; assembling the first temporary substrate and the second temporary substrate to bond the first substrate and the second substrate; removing the first carrier and disposing the first substrate on a supporting film; and removing the second carrier, wherein the first substrate and the second substrate are respectively a flexible substrate.

    SENSING DEVICE
    18.
    发明公开
    SENSING DEVICE 审中-公开

    公开(公告)号:US20230314232A1

    公开(公告)日:2023-10-05

    申请号:US18110364

    申请日:2023-02-15

    CPC classification number: G01J5/20 G01J5/0853 G01J2005/103

    Abstract: The present disclosure provides a sensing device including a substrate and a sensing pixel. The sensing pixel is disposed on the substrate and includes an electrode and a thermistor. The thermistor is electrically connected to the electrode and is separated from the substrate by an air gap. When the sensing pixel is operated in a period, the electrode receives a voltage, and a part of the thermistor moves toward the substrate, such that the thermistor is in thermal conduction with the substrate.

    Optical Sensing Device
    19.
    发明申请

    公开(公告)号:US20230098767A1

    公开(公告)日:2023-03-30

    申请号:US17896099

    申请日:2022-08-26

    Abstract: An optical sensing device includes a substrate; a light-sensing element disposed on the substrate; a light-shielding layer disposed on the light-sensing element, including a first opening overlapping the light-sensing element; an insulating layer disposed on the light-shielding layer, including a second opening overlapping the first opening; a light-shielding element disposed on a hole wall of the second opening; and a light-collecting element disposed on the insulating layer and overlapping the second opening.

    SENSING DEVICE AND ELECTRONIC DEVICE

    公开(公告)号:US20220399389A1

    公开(公告)日:2022-12-15

    申请号:US17740545

    申请日:2022-05-10

    Abstract: A sensing device is provided. The sensing device includes a driving substrate, a sensing module, and a plurality of bonding pads. The driving substrate includes a first substrate and a plurality of driving circuits disposed on the first substrate. Each of the driving circuits includes a plurality of thin-film transistors. The sensing module is bonded to the driving substrate, and the sensing module includes a second substrate and a plurality of sensing elements disposed on the second substrate. The sensing module is bonded to the driving substrate through the bonding pads. In addition, each of the driving circuits is electrically connected to at least one of the sensing elements. An electronic device including the sensing device is also provided.

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