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公开(公告)号:US20240192058A1
公开(公告)日:2024-06-13
申请号:US18550981
申请日:2022-10-11
发明人: Ozer CELIK
IPC分类号: G01J5/08
CPC分类号: G01J5/0853
摘要: A microbolometer detector with adjustable spectral reactivity includes a reflective element between a suspended pixel body and a base section, a bimetallic arm, one end of which is connected to one end of the reflective element and the other end to the base section via the electrode connection, the temperature of which is increased by passing current, and changes the height of the reflective element by expanding with the increase in temperature.
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公开(公告)号:US12002897B2
公开(公告)日:2024-06-04
申请号:US18331173
申请日:2023-06-08
发明人: Osamu Morohara , Yoshiki Sakurai , Hiromi Fujita , Hirotaka Geka
IPC分类号: H01L31/109 , G01J5/08 , H01L31/0352 , H01L31/18
CPC分类号: H01L31/109 , G01J5/0853 , H01L31/035236 , H01L31/1844
摘要: An infrared detecting device is provided. The infrared detecting device includes: a semiconductor substrate; a first layer having a first conductivity type on the semiconductor substrate; a light receiving layer on the first layer; and a second layer having a second conductivity type on the light receiving layer. A part of the first layer, the light receiving layer, and the second layer form a mesa structure. The second layer contains AlzIn1-zSb (0.05
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公开(公告)号:US11990498B2
公开(公告)日:2024-05-21
申请号:US17156639
申请日:2021-01-25
IPC分类号: G01J5/12 , B81C1/00 , G01J5/02 , G01J5/04 , G01J5/08 , G01J5/16 , H01L27/146 , H01L31/0224 , H01L31/09
CPC分类号: H01L27/14669 , B81C1/00 , B81C1/00246 , G01J5/0225 , G01J5/024 , G01J5/046 , G01J5/048 , G01J5/0853 , G01J5/12 , G01J5/16 , H01L27/146 , H01L27/14612 , H01L27/14629 , H01L27/14643 , H01L27/14649 , H01L31/0224 , H01L31/09 , B81C2203/0742 , G01J2005/123
摘要: A complementary metal oxide semiconductor (CMOS) device embedded with micro-electro-mechanical system (MEMS) components in a MEMS region. The MEMS components, for example, are infrared (IR) thermoconforms. The device is encapsulated with a CMOS compatible IR transparent cap to hermetically seal the MEMS sensors in the MEMS region. The CMOS cap includes a base cap with release openings and a seal cap which seals the release openings.
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公开(公告)号:US20230288261A1
公开(公告)日:2023-09-14
申请号:US18019994
申请日:2021-04-12
发明人: Nobuaki SHIMAMOTO , Nayuta MINAMI
CPC分类号: G01J5/16 , G01J5/0853
摘要: An infrared sensor includes: a package body; an infrared sensor chip mounted on a front surface of the package body; an outside cap made of metal, having a function of transmitting infrared light as a detection target for the infrared sensor chip, and attached to the package body such that the outside cap is in front of, and covers, the infrared sensor chip; an inside cap made of metal, having a function of transmitting the infrared light as the detection target for the infrared sensor chip, and disposed between the package body and the outside cap such that the inside cap is in front of, and covers the infrared sensor chip; and a ground terminal to be connected to external ground. The outside cap is electrically insulated from the inside cap and the infrared sensor chip. The inside cap is electrically connected to the ground terminal.
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5.
公开(公告)号:US20230284531A1
公开(公告)日:2023-09-07
申请号:US18299885
申请日:2023-04-13
发明人: Desmond GIBSON , David HUTSON , Shigeng SONG
IPC分类号: H10N10/855 , H10N10/851 , H10N10/01 , G01J5/08 , G01J5/12
CPC分类号: H10N10/855 , H10N10/8556 , H10N10/01 , G01J5/0853 , G01J5/12 , G01J5/34
摘要: An absorber for absorbing electromagnetic radiation including a first layer with hydrogenated carbon, and a second layer with carbon, and the first layer is less absorbing than the second layer.
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6.
公开(公告)号:US20190207049A1
公开(公告)日:2019-07-04
申请号:US16297499
申请日:2019-03-08
申请人: Sergiy Vasylyev , Sergiy Vasylyev
发明人: Sergiy Vasylyev , Sergiy Vasylyev
IPC分类号: H01L31/054 , G02B19/00 , H01L31/0232 , G02B5/02 , H01L31/0525 , G01J5/08 , G01J1/04
CPC分类号: H01L31/0547 , G01J1/0407 , G01J5/0853 , G02B5/0231 , G02B5/0294 , G02B19/0028 , H01L31/02327 , H01L31/0525 , H01L31/0543 , Y02E10/52
摘要: A light converting optical system employing a planar light trapping optical structure illuminated by a monochromatic light source. The light trapping optical structure includes a photoresponsive layer including semiconductor quantum dots. The photoresponsive layer is configured at a relatively low thickness and located between opposing broad-area surfaces that confine and redistribute light within the structure and cause multiple transverse propagation of unabsorbed light through the photoresponsive layer to enhance absorption. The light trapping optical structure further incorporates various microstructured surfaces including light-distributing to surface relief features such as linear microlenses, prismatic surface relief features and/or linear grooves.
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公开(公告)号:US09978926B2
公开(公告)日:2018-05-22
申请号:US15136220
申请日:2016-04-22
发明人: Baoling Huang , Peng Zhang , Dezhao Li
IPC分类号: H01L31/058 , H01L35/32 , G01J5/12 , G01J5/02 , G01J5/08
CPC分类号: H01L35/325 , G01J5/024 , G01J5/0853 , G01J5/12
摘要: A thermal radiation microsensor can comprise thermoelectric micro pillars, in which multiple vertically standing thermoelectric micro pillars can act as thermoelectric pairs and mechanical support of an absorption layer. Radiation absorbed by the absorption layer can produce a temperature difference, which drives the thermocouple comprising p-type and n-type micro pillars to output a voltage. Multiple thermocouples can be connected in series to improve the signal output.
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公开(公告)号:US09945729B2
公开(公告)日:2018-04-17
申请号:US14730116
申请日:2015-06-03
申请人: FLIR Systems, Inc.
发明人: Robert F. Cannata , Kevin Peters , Patrick Franklin , Eric A. Kurth , James L. Dale , Tommy Marx , Craig Shott , Reza Salafian , Richard E. Bornfreund , Saumya Kothari
CPC分类号: G01J5/24 , G01J5/024 , G01J5/046 , G01J5/0853 , G01J5/20 , G01J2005/0077
摘要: Systems and methods may be provided for forming enhanced infrared absorption microbolometers. An enhanced infrared absorption microbolometer may include a metal cap formed from a thin layer of oxidizing metal such as titanium and/or a titanium oxide. The metal cap may be formed within a bridge portion of the microbolometer. The bridge portion may include other layers such as first and second absorber layers disposed on opposing sides of a layer of temperature sensitive resistive material. The layer of temperature sensitive resistive material may be located between the metal cap and a reflecting metal layer formed on a readout integrated circuit for the microbolometer.
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公开(公告)号:US09939322B2
公开(公告)日:2018-04-10
申请号:US15542425
申请日:2016-01-08
申请人: Apple Inc.
发明人: Miikka M. Kangas , Michael J. Bishop , Robert Chen , David I. Simon , Harold L. Sontag, III , George Dee Skidmore
CPC分类号: G01J5/0825 , G01J4/04 , G01J5/0225 , G01J5/0846 , G01J5/0853 , G01J5/20 , G01J2005/202
摘要: This relates to sensor systems, detectors, imagers, and readout integrated circuits (ROICs) configured to selectively detect one or more frequencies or polarizations of light, capable of operating with a wide dynamic range, or any combination thereof. In some examples, the detector can include one or more light absorbers; the patterns and/or properties of a light absorber can be configured based on the desired measurement wavelength range and/or polarization direction. In some examples, the detector can comprise a plurality of at least partially overlapping light absorbers for enhanced dynamic range detection. In some examples, the detector can be capable of electrostatic tuning for one or more flux levels by varying the response time or sensitivity to account for various flux levels. In some examples, the ROIC can be capable of dynamically adjusting at least one of the frame rate integrating capacitance, and power of the illumination source.
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10.
公开(公告)号:US20170370777A1
公开(公告)日:2017-12-28
申请号:US15677428
申请日:2017-08-15
申请人: RIKEN
发明人: Takuo Tanaka
CPC分类号: G01J5/0853 , G01J1/02 , G01J1/38 , G01J1/4228 , G01J5/023 , G01J5/38 , G01J5/44 , G01J5/48 , G02B5/208 , G02B5/22
摘要: In accordance with heat received from a target object, a visible light absorption element 10 changes a frequency component of visible light to reflect or transmit. The visible light absorption element 10 possesses a resonance frequency included in a visible light frequency region. The visible light absorption element 10 absorbs visible light of the resonance frequency. The visible light absorption element 10 thermally deforms due to temperature change to thereby change the resonance frequency, and absorbs visible light of the changed resonance frequency.
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