公开(公告)号：US11982854B2

公开(公告)日：2024-05-14

申请号：US17992670

申请日：2022-11-22

Applicant: Intel Corporation

Inventor： Sang Yup Kim ,  Myung Jin Yim ,  Woosung Kim

IPC: G02B6/43 ,  G02B6/122 ,  G02B6/42 ,  G02B6/12

CPC classification number: G02B6/43 ,  G02B6/122 ,  G02B6/4212 ,  G02B6/4274 ,  G02B2006/12061

Abstract: An interposer apparatus for co-packaging an electronic integrated circuit and a photonic integrated circuit may include a dielectric substrate; an optical waveguide disposed on the dielectric substrate to optically couple the photonic integrated circuit disposed on one side of the dielectric substrate with at least one of another photonic integrated circuit disposed on the dielectric substrate or an optical device disposed on the dielectric substrate; and a metal interconnect disposed through the dielectric substrate to electrically couple the photonic integrated circuit disposed on the one side of the dielectric substrate with an electronic integrated circuit disposed on the other side of the dielectric substrate.

公开(公告)号：US10790910B2

公开(公告)日：2020-09-29

申请号：US16231464

申请日：2018-12-22

Applicant: Intel Corporation

Inventor： Hyoung-Jun Kim ,  Hwee Chin Ong ,  Sang Yup Kim ,  Raghuram Narayan ,  Jeffrey B. Driscoll ,  Woosung Kim

IPC: H04B10/564 ,  H04B10/516 ,  G02F1/21 ,  H04B10/572 ,  G02F1/225 ,  G02F1/01

Abstract: Embodiments may relate to an optical modulator system. The optical modulator system may include a first photodiode to measure a first optical level at an output of a Mach-Zehnder modulator (MZM). The system may further include a second photodiode to measure a second optical level at a termination of the MZM. The system may further include a logic coupled with the first photodiode and the second photodiode, the logic to identify a modulator bias that minimizes the first optical level. Other embodiments may be described or claimed.

公开(公告)号：US09893816B2

公开(公告)日：2018-02-13

申请号：US15081813

申请日：2016-03-25

Applicant: Intel Corporation

Inventor： Woosung Kim ,  Myung Jin Yim

IPC: H04B10/572 ,  H04B10/079 ,  H04B10/69 ,  G02B6/12 ,  G02B6/124 ,  G02F1/015 ,  G02B6/122 ,  H01S5/30

CPC classification number: H04B10/572 ,  G02B6/12004 ,  G02B6/1221 ,  G02B6/124 ,  G02B2006/12123 ,  G02B2006/12142 ,  G02F1/015 ,  G02F1/292 ,  G02F2001/0151 ,  H01S5/0085 ,  H01S5/021 ,  H01S5/02248 ,  H01S5/1007 ,  H01S5/125 ,  H01S5/3013 ,  H04B10/0795 ,  H04B10/691 ,  H04B10/801 ,  H04B10/803

Abstract: Apparatuses including integrated circuit (IC) optical assemblies and processes for operation of IC optical assemblies are disclosed herein. In some embodiments, the IC optical assemblies include a transmitter component to provide light output having a particular beam direction, and a transmitter driver component. The transmitter component includes a light source optically coupled to a plurality of waveguides, a plurality of gratings, and a plurality of phase tuners. The transmitter driver component causes a light provided by the light source to be centered at a particular wavelength and a particular phase to be induced by each phase tuner of the plurality of phase tuners on a respective waveguide of the plurality of waveguides, in accordance with a feedback signal, to generate the light output having the particular beam direction.