公开(公告)号：US20100137349A1

公开(公告)日：2010-06-03

申请号：US12612572

申请日：2009-11-04

申请人： Rakesh K. Jain ,  Eddy Low ,  Charles Francavilla ,  Timothy P. Shiau ,  Bum Kim ,  Satheesh K. Nair

发明人： Rakesh K. Jain ,  Eddy Low ,  Charles Francavilla ,  Timothy P. Shiau ,  Bum Kim ,  Satheesh K. Nair

IPC分类号： A61K31/438 ,  C07D233/40 ,  C07D471/10 ,  C07D263/20 ,  A61K31/421 ,  A61K31/4166 ,  A61P31/02

CPC分类号： A01N43/76 ,  A01N35/02 ,  A01N43/90 ,  A01N59/00 ,  A61K31/415 ,  A61K31/42 ,  C07D233/80 ,  C07D233/82 ,  C07D263/20 ,  C07D263/26 ,  C07D471/10 ,  C07D498/10

摘要： The present application relates to N-chlorinated oxazolidinone, hydantoin and imidazolidinone compounds of Formula I or pharmaceutically acceptable salts thereof, and associated compositions and methods of use as antimicrobial agents.

摘要翻译： 本申请涉及式I的N-氯化恶唑烷酮，乙内酰脲和咪唑烷酮化合物或其药学上可接受的盐，以及用作抗微生物剂的相关组合物和方法。

公开(公告)号：US20060208269A1

公开(公告)日：2006-09-21

申请号：US11370021

申请日：2006-03-08

申请人： Bum Kim ,  Hyung Kim ,  Ho Ahn ,  Young Jeong ,  Sung Yang

发明人： Bum Kim ,  Hyung Kim ,  Ho Ahn ,  Young Jeong ,  Sung Yang

IPC分类号： H01L33/00

CPC分类号： H01L33/54 ,  G02F1/133603 ,  G02F1/133615 ,  H01L33/60 ,  H01L2933/0091

摘要： The invention provides an LED package and a backlight device incorporating the LED lens. The LED package has a bottom surface and a light exiting surface cylindrically extended around a central axis of the package from the bottom surface. Also, a reflecting surface is positioned on an opposite side of the bottom surface and symmetrical around the central axis such that light incident from the bottom surface is reflected toward the light exiting surface. Further, a scattering area is formed on the reflecting surface. According to the invention, by applying scattering materials on the reflecting surface of the LED package, a reflecting paper does not need to be attached, thereby simplifying a process and reducing the manufacture time and cost.

摘要翻译： 本发明提供了一种LED封装和结合了LED透镜的背光装置。 LED封装具有底表面和从底表面围绕封装的中心轴线圆柱形延伸的光出射表面。 此外，反射表面位于底表面的相对侧并且围绕中心轴对称，使得从底表面入射的光被反射到光出射表面。 此外，在反射面上形成散射区域。 根据本发明，通过在LED封装的反射面上施加散射材料，不需要附着反射纸，从而简化了工艺并缩短了制造时间和成本。

公开(公告)号：US20060138472A1

公开(公告)日：2006-06-29

申请号：US11318503

申请日：2005-12-28

申请人： Bum Kim

发明人： Bum Kim

IPC分类号： H01L29/768 ,  H01L21/00

CPC分类号： H01L27/14632 ,  H01L27/14643 ,  H01L27/14656 ,  H01L27/14689

摘要： A CMOS image sensor includes a photo sensing device for generating photo charges, a floating diffusion region for storing the photo charges generated by the photo sensing device therein, a transfer transistor connected between the photo sensing device and the floating diffusion region for transferring the photo charges generated by the photo sensing device to the floating diffusion region, a reset transistor connected between a supply voltage terminal and the floating diffusion region for discharging the charges stored in the floating diffusion region to reset the floating diffusion region, a drive transistor for acting as a source follower buffer amplifier in response to an output signal from the photo sensing device, a switching transistor connected to the drive transistor for performing an addressing operation, and a charge control device connected between the photo sensing device and the transfer transistor for controlling the amount of charges stored in the photo sensing device.

摘要翻译： CMOS图像传感器包括用于产生光电荷的光感测装置，用于存储由其中的感光装置产生的光电荷的浮动扩散区域，连接在感光装置和浮动扩散区域之间的传输晶体管，用于传送照相电荷 由所述感光装置产生到所述浮动扩散区域的复位晶体管，连接在电源电压端子和所述浮动扩散区域之间的复位晶体管，用于对存储在所述浮动扩散区域中的电荷进行放电以复位所述浮动扩散区域;驱动晶体管， 源极跟随器缓冲放大器，响应于来自光感测装置的输出信号，连接到用于执行寻址操作的驱动晶体管的开关晶体管，以及连接在感光器件和转移晶体管之间的电荷控制器件，用于控制 存储在光感测装置中的电荷。

公开(公告)号：US20050156213A1

公开(公告)日：2005-07-21

申请号：US11022890

申请日：2004-12-28

申请人： Chang Han ,  Bum Kim

发明人： Chang Han ,  Bum Kim

IPC分类号： H01L21/265 ,  H01L21/76 ,  H01L21/8238 ,  H01L27/146 ,  H01L31/062 ,  H01L31/10

CPC分类号： H01L27/14689 ,  H01L27/14609 ,  H01L27/1463

摘要： A CMOS image sensor and a method for fabricating the same are disclosed, in which the boundary between an active region and a field region is not damaged by ion implantation. The method for fabricating a CMOS image sensor includes forming a trench in a first conductive type semiconductor substrate, forming a first conductive type heavily doped impurity ion region in the semiconductor substrate at both sides of the trench, forming a device isolation film by interposing an insulating film between the trench and the device isolation, sequentially forming a gate insulating film and a gate electrode on the semiconductor substrate, and forming a second conductive type impurity ion region for a photodiode in the semiconductor substrate between the gate electrode and the device isolation film.

摘要翻译： 公开了一种CMOS图像传感器及其制造方法，其中有源区域和场区域之间的边界不被离子注入所损坏。 CMOS图像传感器的制造方法包括在第一导电型半导体衬底中形成沟槽，在沟槽两侧的半导体衬底中形成第一导电型重掺杂杂质离子区域，通过插入绝缘膜形成器件隔离膜 在沟槽和器件隔离之间，在半导体衬底上依次形成栅绝缘膜和栅电极，以及在栅电极和器件隔离膜之间的半导体衬底中形成用于光电二极管的第二导电型杂质离子区。

公开(公告)号：US20050139878A1

公开(公告)日：2005-06-30

申请号：US11022886

申请日：2004-12-28

申请人： Chang Han ,  Bum Kim

发明人： Chang Han ,  Bum Kim

IPC分类号： H01L21/8238 ,  H01L27/146 ,  H01L31/062 ,  H01L31/10

CPC分类号： H01L27/14689 ,  H01L27/14609 ,  H01L27/1463

摘要： A CMOS image sensor and a method for fabricating the same are disclosed, in which a defect caused by impurity ion implantation at the boundary between an active region below a gate electrode of a transistor constituting a CMOS image sensor and a device isolation film can be minimized. The CMOS image sensor includes a first conductive type semiconductor substrate having a plurality of transistors, an active region overlapping each gate electrode of the transistors, a device isolation film adjacent to the active region, and a first conductive type heavily doped impurity ion region formed between the active region and the device isolation film.

摘要翻译： 公开了一种CMOS图像传感器及其制造方法，其中可以将构成CMOS图像传感器的晶体管的栅电极下方的有源区域和器件隔离膜之间的边界处的杂质离子注入引起的缺陷最小化 。 CMOS图像传感器包括具有多个晶体管的第一导电型半导体衬底，与晶体管的每个栅极重叠的有源区，与有源区相邻的器件隔离膜，以及形成在第一导电型重掺杂杂质离子区之间 有源区和器件隔离膜。

公开(公告)号：US20070284594A1

公开(公告)日：2007-12-13

申请号：US11730791

申请日：2007-04-04

申请人： Masayoshi Koike ,  Bum Kim

发明人： Masayoshi Koike ,  Bum Kim

IPC分类号： H01L27/15

CPC分类号： H01L33/20 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A light emitting diode (LED) chip including: a substrate; and a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, sequentially deposited on the substrate, in which when a length of the substrate is L and a width of the substrate is W, L/W>10.

摘要翻译： 一种发光二极管（LED）芯片，包括：基板; 以及包括依次沉积在基板上的第一导电半导体层，有源层和第二导电半导体层的发光结构，其中当基板的长度为L且基板的宽度为W时，L / W> 10。

公开(公告)号：US20070075170A1

公开(公告)日：2007-04-05

申请号：US11258172

申请日：2005-10-26

申请人： Bum Kim

发明人： Bum Kim

IPC分类号： B02C18/18

CPC分类号： B02C18/0007 ,  B02C2018/0046

摘要： A document shredder with a continuously wound vinyl bag, includes a shredding portion, a collection portion and a cover case. The shredding portion includes an intermediate plate having a drop opening through which the shredded strips of paper fall, and in which a control circuit is mounted, and a pair of cutting rolls disposed above the drop opening, and a top member including a feed opening disposed above the cutting rolls. The collection portion placed downward from the shredding portion, includes a housing frame of which the center is opened, and a roll unit of a vinyl bag in which the paper to be shredded is collected. The cover case includes a support board, side walls which are vertically elevated along three surfaces of the support board, a door in which the vinyl bag filled with the shredded strips of paper is cut and discharged, and the top member which is assembled with the upper portions of the side walls and the door.

摘要翻译： 具有连续卷绕的乙烯基袋的文件粉碎机包括粉碎部分，收集部分和盖壳体。 切碎部分包括具有下降开口的中间板，所述切碎的纸条穿过所述中间板落下，并且其中安装有控制回路;以及一对切割辊，所述切割辊设置在所述落下开口上方，以及顶部构件， 在切割辊上方。 从切碎部分向下放置的收集部分包括中心打开的壳体框架以及收集被切纸的乙烯基袋的卷筒单元。 盖壳包括支撑板，沿着支撑板的三个表面竖直升高的侧壁，其中填充有切碎的纸带的乙烯基袋被切割和排出的门，以及与该组件的顶部构件 侧壁和门的上部。

公开(公告)号：US20060187651A1

公开(公告)日：2006-08-24

申请号：US11136529

申请日：2005-05-25

申请人： Hyung Kim ,  Jung Park ,  Ho Ahn ,  Young Jeong ,  Young Park ,  Hun Hahm ,  Bum Kim

发明人： Hyung Kim ,  Jung Park ,  Ho Ahn ,  Young Jeong ,  Young Park ,  Hun Hahm ,  Bum Kim

IPC分类号： G01D11/28

CPC分类号： G02B6/0021 ,  G02B6/0038 ,  G02B6/0041 ,  G02F1/133603

摘要： A direct-illumination backlight apparatus uses LEDs as a light source. This backlight apparatus comprises: a flat reflective plate; an LED light source arranged on the reflective plate; a transparent plate arranged above the LED light source; a scattering pattern arranged on an underside of the transparent plate in a position corresponding to the LED light source; and a light guide made of transparent material, and arranged around the scattering pattern to introduce light incident from below into the transparent plate so that the light is internally reflected by the transparent plate. The light guide serves to introduce a partial light from an LED light source at such an angle that the partial light is trapped inside the transparent plate, and the scattering pattern serves to scatter the trapped light beam at a position directly above the LED light source so that the scattered light beam escapes out of the transparent plate toward an LCD panel. This can remove any dark area above the LED light source in the transparent plate and thus reduce the thickness of the direct-illumination backlight apparatus.

摘要翻译： 直接照明背光装置使用LED作为光源。 该背光装置包括：平面反射板; 布置在所述反射板上的LED光源; 布置在LED光源上方的透明板; 散布图案，布置在与LED光源相对应的位置的透明板的下侧上; 以及由透明材料制成的导光体，并且布置在散射图案周围以将从下方入射的光引入透明板，使得光被透明板内部反射。 该光导用于从LED光源引入部分光，使得部分光被捕获在透明板的内部，散射图用于将捕获的光束分散在LED光源正上方的位置，从而 散射的光束从透明板向LCD面板逸出。 这可以去除透明板中的LED光源上方的任何暗区，从而减小直射照明背光装置的厚度。

公开(公告)号：US20060171151A1

公开(公告)日：2006-08-03

申请号：US11318837

申请日：2005-12-28

申请人： Young Park ,  Hyung Kim ,  Jung Park ,  Ho Ahn ,  Young Jeong ,  Hun Hahm ,  Bum Kim

发明人： Young Park ,  Hyung Kim ,  Jung Park ,  Ho Ahn ,  Young Jeong ,  Hun Hahm ,  Bum Kim

IPC分类号： F21V5/00

CPC分类号： H01L33/60 ,  F21K9/68 ,  H01L33/54

摘要： A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.

摘要翻译： 提供了侧面发射型LED封装。 LED封装包括LED芯片，下部结构和上部结构。 下部结构具有下反射镜和透明密封构件。 下部结构支持LED芯片。 下镜从LED芯片向上和向外延伸，从而将来自LED芯片的光线向上反射。 透明密封件形成在下反射镜内部的LED芯片周围。 上部结构组合到下部结构的上部，以将由下部结构向上反射的光反射到径向横向方向。 如上所述，下部结构和上部结构彼此分开设置并组合，从而提高了密封构件的模制效率，并且可以容易地制造侧面发射型LED封装。

公开(公告)号：US20060146530A1

公开(公告)日：2006-07-06

申请号：US11134430

申请日：2005-05-23

申请人： Jung Park ,  Hun Hahm ,  Ho Ahn ,  Bum Kim ,  Young Park ,  Hyung Kim ,  Young Jeong

发明人： Jung Park ,  Hun Hahm ,  Ho Ahn ,  Bum Kim ,  Young Park ,  Hyung Kim ,  Young Jeong

IPC分类号： F21V7/00

CPC分类号： G02F1/133603 ,  G02F1/133605

摘要： This invention relates to an LED backlight apparatus. The LED backlight apparatus comprises: a housing having an upper opening; a reflective sheet provided on a bottom inside the housing; a plurality of LED light sources arranged above the reflective sheet at a predetermined distance to emit light toward the reflective sheet; and a light source support connected to a side wall of the housing to support the LED light sources. The light sources are arranged opposite to the reflective sheet so that light beams emitted from the LED light sources reflect from the reflective sheet before entering a diffuser plate behind the LED light sources from the reflective sheet, thereby potentially reducing the thickness of the backlight apparatus while ensuring a distance for the light beams to sufficiently mix together before entering the differ plate.

摘要翻译： 本发明涉及一种LED背光装置。 LED背光装置包括：具有上开口的壳体; 设置在所述壳体内的底部的反射片; 多个LED光源，以预定距离布置在反射片上方，以向反射片发射光; 以及连接到壳体的侧壁以支撑LED光源的光源支撑件。 光源与反射片相对布置，使得从LED光源发射的光束从反射片反射到反射片之后，从LED反射片进入漫射板后面，从而潜在地减小背光装置的厚度，同时 确保在进入不同板之前使光束充分混合在一起的距离。