公开(公告)号：US4866507A

公开(公告)日：1989-09-12

申请号：US864228

申请日：1986-05-19

申请人： Scott L. Jacobs ,  Perwaiz Nihal ,  Burhan Ozmat ,  Henri D. Schnurmann ,  Arthur R. Zingher

发明人： Scott L. Jacobs ,  Perwaiz Nihal ,  Burhan Ozmat ,  Henri D. Schnurmann ,  Arthur R. Zingher

IPC分类号： H01L23/12 ,  H01L23/50 ,  H01L23/538

CPC分类号： H01L23/5383 ,  H01L23/50 ,  H01L2224/16 ,  H01L2924/01014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/3011 ,  H01L2924/3025

摘要： An integrated circuit chip packaging structure, preferably having a semiconductor base substrate, i.e., silicon or gallium arsenide, alternating insulation and conductive layers on the base structure, at least two conductive layers being patterned into thin film wiring (i.e., thin film copper of approximately 5 microns), semiconductor integrated circuit chips connected to the upper-most patterned conductive layer, and means to connected the packaging structure to the next level of packaging (i.e., board or card).The thin film wiring layers typically each having coplanar ground, power and signal lines, with at least one power or ground line existing between coplanar signal lines to minimize cross talk. To facilitate efficient power distribution, lines of specific power levels of the patterned planes are connected to lines of the same power level on other patterned planes to form three dimensional power planes. To reduce package capacitance and keep the RC constant low, a personalized reference plane is incorporated. The personalized plane has insulating regions extending at least partially through the plane at predetermined locations that coincide with long signal lines on the wiring layers. The combined package provides a packaging alternative that has excellent electrical performance (i.e., speed, low RC constant, efficient power distribution), high density and thermal expansion matching between the underlying semiconductor structure and semiconductor chips mounted on the package. A high yield process for manufacturing the package is also disclosed.

摘要翻译： 一种集成电路芯片封装结构，优选地具有半导体基底（即，硅或砷化镓），在基底结构上的交替绝缘和导电层，将至少两个导电层图案化成薄膜布线（即大约为薄膜铜 5微米），连接到最上层图案的导电层的半导体集成电路芯片，以及将封装结构连接到下一级封装（即板或卡）的装置。 薄膜布线层通常各自具有共面的接地，功率和信号线，其中至少一个电源线或地线存在于共面信号线之间，以最小化串扰。 为了便于有效的功率分配，图案化平面的特定功率电平的线被连接到在其它图案化平面上的相同功率电平的线以形成三维电源平面。 为了减少封装电容并使RC恒定不变，引入了一个个性化的参考平面。 个性化平面具有至少部分地延伸穿过平面的绝缘区域，该预定位置与布线层上的长信号线重合。 组合封装提供具有优异的电性能（即，速度，低RC恒定，有效功率分布），下层半导体结构和安装在封装上的半导体芯片之间的高密度和热膨胀匹配的封装替代方案。 还公开了用于制造封装的高产量工艺。

公开(公告)号：US09459772B2

公开(公告)日：2016-10-04

申请号：US14009564

申请日：2012-04-09

申请人： Perwaiz Nihal

发明人： Perwaiz Nihal

IPC分类号： G06F3/048 ,  G06F3/0484 ,  G06Q10/10

CPC分类号： G06F3/0484 ,  G06Q10/10

摘要： Processor based systems and methods for providing a communication between a first and a second user are disclosed, one example method comprising receiving a first service request from the second user interface, authorizing a first communication type to the second user interface and the first user interface based on a profiles of a service provider profile, the first user and the second user profile, and providing the first communication type as the communication. In some embodiments, the systems and methods further comprise providing a notification to at least one of the first user interface or the second user interface of a service event based on the service provider profile. In some embodiments, the step of authorizing the communication service based on a service provider profile comprises comparing the service request to at least one service provider profile attribute.

摘要翻译： 公开了一种用于提供第一和第二用户之间的通信的基于处理器的系统和方法，一种示例性方法包括从第二用户接口接收第一服务请求，向第二用户界面授权第一通信类型和基于第一用户接口 在服务提供商简档的配置文件上，第一用户和第二用户简档，以及提供第一通信类型作为通信。 在一些实施例中，系统和方法还包括基于服务提供商简档向服务事件的第一用户界面或第二用户界面中的至少一个提供通知。 在一些实施例中，基于服务提供商简档授权通信服务的步骤包括将服务请求与至少一个服务提供商简档属性进行比较。

公开(公告)号：US20150052102A1

公开(公告)日：2015-02-19

申请号：US14376651

申请日：2013-03-08

申请人： Perwaiz Nihal

发明人： Perwaiz Nihal

IPC分类号： G06F17/30

CPC分类号： G06F16/27 ,  G06F16/955 ,  H04N21/00 ,  H04N21/252 ,  H04N21/26603 ,  H04N21/4307 ,  H04N21/4316 ,  H04N21/47205 ,  H04N21/4756 ,  H04N21/4786 ,  H04N21/4828 ,  H04N21/488 ,  H04N21/6582 ,  H04N21/6587 ,  H04N21/84 ,  H04N21/8405 ,  H04N21/8456

摘要： A method of creating a temporal content profile comprising the steps of receiving a content instance, receiving a metadata associated with the content instance, creating a content instance profile and creating a temporal content profile from the first content instance profile. In some embodiments, the temporal content profile comprises a first and a second content instance profile, each having a content instance and metadata. In some embodiments, the computer implemented methods comprise outputting a representation of a temporal content profile comprising the steps of receiving a representation of a content instance profile comprising a content instance and a metadata and outputting the representation of the temporal content profile to a user interface.

摘要翻译： 一种创建时间内容简档的方法，包括以下步骤：接收内容实例，接收与所述内容实例相关联的元数据，创建内容实例简档并从所述第一内容实例简档创建时间内容简档。 在一些实施例中，时间内容简档包括第一和第二内容实例简档，每个具有内容实例和元数据。 在一些实施例中，计算机实现的方法包括输出时间内容简档的表示，包括以下步骤：接收包括内容实例和元数据的内容实例简档的表示，并将时间内容简档的表示输出到用户界面。

公开(公告)号：US20140033051A1

公开(公告)日：2014-01-30

申请号：US14009564

申请日：2012-04-09

申请人： Perwaiz Nihal

发明人： Perwaiz Nihal

IPC分类号： G06F3/0484

CPC分类号： G06F3/0484 ,  G06Q10/10

摘要： Processor based systems and methods for providing a communication between a first and a second user are disclosed, one example method comprising receiving a first service request from the second user interface, authorizing a first communication type to the second user interface and the first user interface based on a profiles of a service provider profile, the first user and the second user profile, and providing the first communication type as the communication. In some embodiments, the systems and methods further comprise providing a notification to at least one of the first user interface or the second user interface of a service event based on the service provider profile. In some embodiments, the step of authorizing the communication service based on a service provider profile comprises comparing the service request to at least one service provider profile attribute.

摘要翻译： 公开了一种用于提供第一和第二用户之间的通信的基于处理器的系统和方法，一种示例性方法包括从第二用户接口接收第一服务请求，向第二用户界面授权第一通信类型和基于第一用户接口 在服务提供商简档的配置文件上，第一用户和第二用户简档，以及提供第一通信类型作为通信。 在一些实施例中，系统和方法还包括基于服务提供商简档向服务事件的第一用户界面或第二用户界面中的至少一个提供通知。 在一些实施例中，基于服务提供商简档授权通信服务的步骤包括将服务请求与至少一个服务提供商简档属性进行比较。

公开(公告)号：US06205138B1

公开(公告)日：2001-03-20

申请号：US09066209

申请日：1998-04-24

申请人： Perwaiz Nihal ,  Robert Alan Flavin ,  Thompson Baum Vesecky ,  Norbert George Vogl ,  Edward Payson Clarke, Jr. ,  Luis Rodriguez-Cortes ,  Geoffrey Hale Purdy

发明人： Perwaiz Nihal ,  Robert Alan Flavin ,  Thompson Baum Vesecky ,  Norbert George Vogl ,  Edward Payson Clarke, Jr. ,  Luis Rodriguez-Cortes ,  Geoffrey Hale Purdy

IPC分类号： H04L1250

CPC分类号： H04L49/101 ,  H04L49/201 ,  H04L49/351 ,  H04L49/40

摘要： This invention is a broadband matrix switch system and method of operation. The broadband matrix switch has N number of broadband inputs, each of the broadband inputs having one or more broadband signals. The matrix switch has M number of broadband outputs. There are N number of splitters. Each of the splitters has a splitter input connected to one of the broadband inputs. Each of the splitters has M number of splitter outputs that produce the splitter output signal. There are N times M number of node switches. Each node switch is uniquely connected to one of the splitter outputs. The node switches have a control input that allows the node switch to pass the respective splitter output signal upon receiving a close command at the control input and to terminate the respective splitter output signal with an input impedance upon receiving an open command at the control input. There are M number of combiners. Each combiner has a combiner output connected to one of the broadband outputs. Each combiner further having N number of combiner inputs. Each of the combiner inputs are connected to one and only one of the inputs through the respective splitter and node switch. The node switches terminate the combiner input with an output impedance upon receiving an open command. The matrix switch further has a controller that sends one or more open commands to selected node switches to connect one or more of the broadband inputs to one or more of the broadband outputs. The matrix switch has many uses in switching and monitoring and analyzing broadband networks, for example, cable TV networks.

摘要翻译： 本发明是宽带矩阵切换系统及其操作方法。 宽带矩阵切换器具有N个宽带输入，每个宽带输入具有一个或多个宽带信号。 矩阵开关具有M个宽带输出。 有N个分割器。 每个分路器具有连接到一个宽带输入的分路器输入。 每个分路器具有M个分路器输出，产生分路器输出信号。 有N次M个节点交换机。 每个节点开关独特地连接到分路器输出之一。 节点开关具有控制输入，其允许节点开关在接收到控制输入端的关闭命令时通过相应的分离器输出信号，并且在控制输入端接收到打开命令时终止具有输入阻抗的相应分离器输出信号。 有M个组合器。 每个组合器具有连接到其中一个宽带输出的组合器输出。 每个组合器还具有N个组合器输入。 每个组合器输入通过相应的分离器和节点开关连接到一个且仅一个输入。 节点开关在接收到打开命令时终止具有输出阻抗的组合器输入。 矩阵开关还具有控制器，该控制器向所选择的节点开关发送一个或多个打开的命令，以将一个或多个宽带输入连接到一个或多个宽带输出。 矩阵开关在切换和监测和分析宽带网络方面有许多用途，例如有线电视网络。

公开(公告)号：US4811082A

公开(公告)日：1989-03-07

申请号：US929946

申请日：1986-11-12

申请人： Scott L. Jacobs ,  Perwaiz Nihal ,  Burhan Ozmat ,  Henri D. Schnurmann

发明人： Scott L. Jacobs ,  Perwaiz Nihal ,  Burhan Ozmat ,  Henri D. Schnurmann

IPC分类号： H01L23/52 ,  H01L23/538 ,  H01L27/00 ,  H01L39/02 ,  H01L23/02 ,  H01L23/12

CPC分类号： H01L23/5383 ,  H01L23/538 ,  H01L2224/16225 ,  H01L2924/09701 ,  H01L2924/3011

摘要： A high speed, high performance integrated circuit packaging structure that may be used for emulating wafer scale integration structures. The preferred embodiment comprises an interposer having a base substrate having alternating insulation and conductive layers thereon, wherein a plurality of the conductive layers are wiring means which are adapted for maintaining an extremely low noise level in the package. The low noise level and low resistance and capacitance of the wiring means allows a plurality of discrete semiconductor segments to be mounted on and interconnected by the integrated circuit package with a significantly reduced number of drivers and receivers than required by Rent's Rule. Each integrated circuit structure of the present invention emulates a large chip or wafer scale integration structure in performance without having to yield the large chip or wafer, and without redundancy schemes. A plurality of these integrated circuit packaging structures are combined by decals to form a central processing unit of a computer or a portion thereof. In an alternate preferred embodiment, the base substrate of the interposer is made of silicon and any required drivers are formed therein, thus substantially eliminating the need for any drivers on each of the discrete semiconductor segments.

摘要翻译： 一种高速，高性能的集成电路封装结构，可用于仿真晶圆级整合结构。 优选实施例包括具有基底基板的插入件，其上具有交替的绝缘层和导电层，其中多个导电层是用于在封装中保持极低噪声水平的布线装置。 布线装置的低噪声电平和低电阻和电容允许多个分立的半导体段通过集成电路封装安装在其上并以与租赁规则要求相比大大减少的数量的驱动器和接收器相互连接。 本发明的每个集成电路结构在性能上模拟大的芯片或晶片级整合结构，而不必产生大的芯片或晶片，并且没有冗余方案。 多个这些集成电路封装结构通过贴花组合形成计算机或其一部分的中央处理单元。 在替代的优选实施例中，插入器的基底衬底由硅制成，并且在其中形成任何所需的驱动器，从而基本上消除了对每个分立半导体段上的任何驱动器的需要。