摘要:
Electronic device structures such as structures containing antennas, cables, connectors, welds, electronic device components, conductive housing structures, and other structures can be tested for faults using a test system to perform conducted testing. The test system may include a vector network analyzer or other test unit that generates radio-frequency test signals in a range of frequencies. The radio-frequency test signals may be transmitted to electronic device structures under test using a contact test probe that has at least signal and ground pins. The test probe may receive corresponding radio-frequency signals. The transmitted and received radio-frequency test signals may be analyzed to determine whether the electronic device structures under test contain a fault.
摘要:
Wireless electronic devices include wireless communications circuitry such as transceiver circuitry coupled to an antenna resonating element. The transceiver circuitry and the antenna element may be formed on first and second substrates, respectively. In compact wireless devices, transceiver and antenna matching circuits may be formed on the first substrate. During production testing, a radio-frequency test probe with integrated matching circuitry may be used to mate with a corresponding contact point on the first substrate. The integrated matching circuitry may include resistors, capacitors, and inductors soldered in desired series-parallel configurations within the test probe. When the test probe is mated to the contact point on the first substrate, a test unit connected to the test probe may be used to perform radio-frequency measurements to determine whether the transceiver circuitry satisfies design criteria.
摘要:
A portable test chamber with an open top may serve as a field testing apparatus for wireless testing of electronic devices. A wireless device under test may be mounted within a cavity in the test chamber. The cavity may be surrounded by a dielectric lining of anechoic material. A layer of electromagnetic shielding such as metal foil may cover the outer surfaces of the dielectric lining. The chamber may have a box shape with a rectangular opening at its top. Satellite navigation system signals or other wireless signals may be received through the opening at the top of the test chamber during testing. The electromagnetic shielding may reduce the effects of multipath interference during field tests.
摘要:
A test station may include a test host, a test unit, and a test enclosure. A device under test (DUT) having at least first and second antennas may be placed in the test enclosure during production testing. Radio-frequency test signals may be conveyed from the test unit to the DUT using a test antenna in the test enclosure. In a first time period during which the performance of the first antenna is being tested, the DUT may be oriented in a first position such that path loss between the first antenna and the test antenna is minimized. In a second time period during which the performance of the second antenna is being tested, the DUT may be oriented in a second position such that path loss between the second antenna and the test antenna is minimized. The DUT is marked as a passing DUT if gathered test data is satisfactory.
摘要:
Electronic devices may be tested using a test station with a test fixture. The test fixture may include a first holding structure in which a device under test may be placed and a second holding structure for supporting test probes. The second holding structure may be mated with a test probe alignment structure during test station setup operations. The test probe alignment structure may include registration features configured to set the relative position of the first and second holding structures to a known configuration and may include test probe alignment features that can be used to correctly position the placement of the test probes. If at least one of the test probes is not sufficiently aligned to its corresponding alignment feature, the test probe alignment structures will not be able to engage properly with the second holding structure, and the position of the problematic test probe may be adjusted accordingly.
摘要:
Conductive electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that has a capacitive coupling probe. The probe may have electrodes. The electrodes may be formed from patterned metal structures in a dielectric substrate. A test unit may provide radio-frequency test signals in a range of frequencies. The radio-frequency test signals may be applied to the conductive housing member or other conductive structures under test using the electrodes. Complex impedance data, forward transfer coefficient data, or other data may be used to determine whether the structures are faulty. A fixture may be used to hold the capacitive coupling probe in place against the conductive electronic device structures during testing.
摘要:
Electronic devices may be provided that contain wireless communications circuitry. The wireless communications circuitry may include radio-frequency transceiver circuitry and antenna structures. The antenna structures may form an antenna having first and second feeds at different locations. The transceiver circuit may have a first circuit that handles communications using the first feed and may have a second circuit that handles communications using the second feed. A first filter may be interposed between the first feed and the first circuit and a second filter may be interposed between the second feed and the second circuit. The first and second filters and the antenna may be configured so that the first circuit can use the first feed without being adversely affected by the presence of the second feed and so that the second circuit can use the second feed without being adversely affected by the presence of the first feed.
摘要:
A radio-frequency test system configured for testing device structures under test is provided. The test system may include a radio-frequency tester, a test probe that is coupled to the tester, and an auxiliary test fixture that receives the device structures under test. During testing, the device structures under test may be mounted on the auxiliary test fixture. The auxiliary test fixture may provide a ground contact point and a ground reference plane. The device structures under test may include a radio-frequency circuit coupled to a conductive member via a signal path. During testing, the test probe may mate with the conductive member on the device structures under test and the ground contact point on the auxiliary test fixture. The ground reference plane in the auxiliary test fixture may serve to provide proper grounding for the signal path to help improve the accuracy of test results associated with the radio-frequency circuit.
摘要:
A test station may include a test host, a test unit, and a test enclosure. A device under test (DUT) having at least first and second antennas may be placed in the test enclosure during production testing. Radio-frequency test signals may be conveyed from the test unit to the DUT using a test antenna in the test enclosure. In a first time period during which the performance of the first antenna is being tested, the DUT may be oriented in a first position such that path loss between the first antenna and the test antenna is minimized. In a second time period during which the performance of the second antenna is being tested, the DUT may be oriented in a second position such that path loss between the second antenna and the test antenna is minimized. The DUT is marked as a passing DUT if gathered test data is satisfactory.
摘要:
Custom antenna structures may be used to compensate for manufacturing variations in electronic device antennas. An antenna may have an antenna feed and conductive structures such as portions of a peripheral conductive electronic device housing member. The custom antenna structures compensate for manufacturing variations that could potentially lead to undesired variations in antenna performance. The custom antenna structures may make customized alterations to antenna feed structures or conductive paths within an antenna. An antenna may be formed from a conductive housing member that surrounds an electronic device. The custom antenna structures may be formed from a printed circuit board with a customizable trace. The customizable trace may have a contact pad portion on the printed circuit board. The customizable trace may be customized to connect the pad to a desired one of a plurality of contacts associated with the conductive housing member to form a customized antenna feed terminal.