A composition for preventing plant diseases resulted from infection of plant pathogens and a method for preparing the same
    11.
    发明申请
    A composition for preventing plant diseases resulted from infection of plant pathogens and a method for preparing the same 审中-公开
    用于预防植物病原体感染引起的植物病害的组合物及其制备方法

    公开(公告)号:US20060228428A1

    公开(公告)日:2006-10-12

    申请号:US11278535

    申请日:2006-04-03

    摘要: The present invention relates to a composition for preventing at least one plant disease resulted from infection of plant pathogens and a method for preparing the same. Particularly, the composition contains extract of at least one plant selected from the group consisting of Coptis chinensis Franch., Phellodendron genus plant, Sanguinaria canadensis and Chelidonium majus var. asiaticum which are natural plants having anti-plant pathogen activity or berberine which is purified therefrom. The composition of the present invention can be effectively used for preventing disease pathogens such as plant powdery mildew, anthracnose of pepper, damping-off of cucumber and gray mold rot of strawberry resulted from infection of plant pathogens such as Colletrotrichum gloeosporiodes, Pythium ultimum or Botrytis cinerea. For an alternative method for preparing the composition comprising berberine and/or derivatives thereof, the present invention provides various optimal culture condition and two phases cultivation methods using Phellodendron genus plant.

    摘要翻译: 本发明涉及用于预防由植物病原体感染引起的至少一种植物病害的组合物及其制备方法。 特别地,所述组合物含有选自黄连属,黄柏属植物,加拿大血统(Sanguinaria canadensis)和Che藜(Chelidonium majus var。)的至少一种植物提取物。 积雪草是具有抗植物病原体活性的天然植物或从其纯化的小檗碱。 本发明的组合物可以有效地用于预防植物病原体如植物病原体如植物白粉病,辣椒炭疽病,黄瓜阻尼和草莓灰霉病由植物病原体的感染引起的疾病病原体,例如Colletrotrichum gloeosporiodes,Pythium ultimum或Botrytis 灰葡萄酒 对于制备包含小檗碱和/或其衍生物的组合物的替代方法,本发明提供使用黄柏属植物的各种最佳培养条件和两相培养方法。

    Embedded multilayer chip capacitor and printed circuit board having the same
    14.
    发明申请
    Embedded multilayer chip capacitor and printed circuit board having the same 有权
    嵌入式多层片式电容器和具有相同功能的印刷电路板

    公开(公告)号:US20060198079A1

    公开(公告)日:2006-09-07

    申请号:US11319722

    申请日:2005-12-29

    IPC分类号: H01G4/228

    摘要: The invention provides an embedded multilayer chip capacitor, and a printed circuit board having the same. The embedded multilayer chip capacitor comprises a capacitor body having a plurality of dielectric layers stacked one on another; a plurality of first and second internal electrodes formed inside the capacitor body, separated by the dielectric layers; and first and second vias extended vertically inside the capacitor body. The first via is connected to the first internal electrodes and the second via is connected to the second internal electrodes. The first via is led to a bottom of the capacitor body and the second via is led to a top of the capacitor body.

    摘要翻译: 本发明提供一种嵌入式多层片状电容器及具有该电容器的印刷电路板。 嵌入式多层片状电容器包括:具有彼此层叠的多个电介质层的电容器本体; 多个第一和第二内部电极,形成在电容器本体内部,被电介质层分隔开; 并且第一和第二通孔在电容器体内垂直延伸。 第一通孔连接到第一内部电极,第二通孔连接到第二内部电极。 第一通孔被引导到电容器主体的底部,第二通孔被引导到电容器主体的顶部。