Package, packaging method and substrate thereof for sliding type thin fingerprint sensor
    12.
    发明申请
    Package, packaging method and substrate thereof for sliding type thin fingerprint sensor 有权
    滑动型薄指纹传感器的封装,封装方法及其基板

    公开(公告)号:US20090073632A1

    公开(公告)日:2009-03-19

    申请号:US11902176

    申请日:2007-09-19

    IPC分类号: H01L21/56 H05F3/00

    摘要: A sliding type thin fingerprint sensor package mainly comprises a substrate and a fingerprint sensor chip. The chip defined as a sliding region and a conductive portion comprises a dielectric layer, a circuit layer and a passivation layer. The circuit layer has a plurality of external contact pads and at least one electrostatic conductive pad close to a window of the dielectric layer. The passivation layer formed on the circuit layer has a plurality of first openings to expose the external contact pads and a second opening to expose the electrostatic conductive pad of the circuit layer and the window of the dielectric layer. The electrostatic conductive pad and the window are located at the sliding region and the external contact pads are located at the conductive portion. The fingerprint sensor chip is electronically connected with the substrate. A sensing region of the fingerprint sensor chip is exposed via the second opening of the passivation layer and the window of the dielectric layer.

    摘要翻译: 滑动型薄指纹传感器封装主要包括基板和指纹传感器芯片。 限定为滑动区域和导电部分的芯片包括电介质层,电路层和钝化层。 电路层具有多个外部接触焊盘和靠近电介质层的窗口的至少一个静电导电焊盘。 形成在电路层上的钝化层具有多个第一开口以暴露外部接触焊盘和第二开口以暴露电路层的静电导电焊盘和电介质层的窗口。 静电导电垫和窗口位于滑动区域,外部接触垫位于导电部分。 指纹传感器芯片与基板电子连接。 指纹传感器芯片的感测区域经由钝化层的第二开口和电介质层的窗口露出。

    Chip-on-film package for image sensor and method for manufacturing the same
    13.
    发明申请
    Chip-on-film package for image sensor and method for manufacturing the same 审中-公开
    用于图像传感器的片上胶片封装及其制造方法

    公开(公告)号:US20050104186A1

    公开(公告)日:2005-05-19

    申请号:US10706997

    申请日:2003-11-14

    摘要: A chip-on-film (COF) package and method for image sensor has been disclosed. According to the method a COF film with opening is provided. The COF film has an upper surface, a lower surface and at least an opening. An image sensing chip is flip-chip mounted on the upper surface of the COF film. A transparent glass is bonded to the lower surface of the COF film. The opening is clipped by the transparent glass and the image sensing chip to form a hermetic space. The active surface of the image sensing chip includes an image sensing region toward the transparent glass through the opening and is sealed in the hermetic space by a limited filling material in order to prevent the image sensing region of the image sensing chip from contamination by means of COF tape packaging method.

    摘要翻译: 已经公开了一种用于图像传感器的片上芯片(COF)封装和方法。 根据该方法,提供具有开口的COF膜。 COF膜具有上表面,下表面和至少一个开口。 图像感测芯片被倒装安装在COF膜的上表面上。 透明玻璃结合到COF膜的下表面。 开口被透明玻璃和图像感测芯片夹住以形成密封空间。 图像感测芯片的有源表面包括通过开口朝向透明玻璃的图像感测区域,并且通过有限的填充材料密封在密封空间中,以便防止图像感测芯片的图像感测区域被污染 COF胶带包装方法。