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公开(公告)号：US11416982B2
公开(公告)日：2022-08-16
申请号：US17030277
申请日：2020-09-23
Applicant: KLA Corporation
Inventor： Bjorn Brauer , Hucheng Lee , Sangbong Park
Abstract: Methods and systems for controlling a process for inspection of a specimen are provided. One system includes one or more computer subsystems configured for determining a statistical characteristic of difference images generated for multiple instances of a care area on a specimen and determining variation in the statistical characteristic compared to a statistical characteristic of difference images generated for multiple instances of the care area on one or more other specimens. In addition, the one or more computer subsystems are configured for determining one or more changes to one or more parameters used for detecting defects in the care area on the specimen based on the variation.
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公开(公告)号：US20210097666A1
公开(公告)日：2021-04-01
申请号：US17030277
申请日：2020-09-23
Applicant: KLA Corporation
Inventor： Bjorn Brauer , Hucheng Lee , Sangbong Park
Abstract: Methods and systems for controlling a process for inspection of a specimen are provided. One system includes one or more computer subsystems configured for determining a statistical characteristic of difference images generated for multiple instances of a care area on a specimen and determining variation in the statistical characteristic compared to a statistical characteristic of difference images generated for multiple instances of the care area on one or more other specimens. In addition, the one or more computer subsystems are configured for determining one or more changes to one or more parameters used for detecting defects in the care area on the specimen based on the variation.
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公开(公告)号：US20200090904A1
公开(公告)日：2020-03-19
申请号：US16543596
申请日：2019-08-18
Applicant: KLA Corporation
Inventor： Junqing Huang , Paul Russell , Hucheng Lee , Kenong Wu
IPC: H01J37/28 , H01J37/244 , G01N21/95
Abstract: Methods and systems for detecting defects in a logic region on a wafer are provided. One method includes acquiring information for different types of design-based care areas in a logic region of a wafer. The method also includes designating the different types of the design-based care areas as different types of sub-regions and, for a localized area within the logic region, assigning two or more instances of the sub-regions located in the localized area to a super-region. In addition, the method includes generating one scatter plot for all of the two or more instances of the sub-regions assigned to the super-region. The one scatter plot is generated with different segmentation values for the output corresponding to the different types of the sub-regions. The method further includes detecting defects in the sub-regions based on the one scatter plot.
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Patent Agency Ranking
公开(公告)号：US12190498B2
公开(公告)日：2025-01-07
申请号：US18072605
申请日：2022-11-30
Applicant: KLA Corporation
Inventor： Nurmohammed Patwary , James A. Smith , Heonju Shin , Jusang Maeng , Kenong Wu , Xiaochun Li , Hucheng Lee
Abstract: Systems and methods for detecting defects on a reticle are provided. One system is configured for generating different stacked difference images for multiple instances of first patterned areas in different rows on a wafer based on images generated for the first patterned areas in the different rows. The system is also configured for performing double detection based on the different stacked difference images. The system then identifies defects on the reticle based on the defects detected by the double detection. As described further herein, the systems and methods detect defects from multiple reticle rows printed on a wafer, which can reduce noise and enable detection of substantially small repeater defects. The embodiments are particularly useful for high sensitivity repeater defect detection for extreme ultraviolet (EUV) reticles and multi-die reticles (MDR).
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公开(公告)号：US20240177294A1
公开(公告)日：2024-05-30
申请号：US18072605
申请日：2022-11-30
Applicant: KLA Corporation
Inventor： Nurmohammed Patwary , James A. Smith , Heonju Shin , Jusang Maeng , Kenong Wu , Xiaochun Li , Hucheng Lee
CPC classification number: G06T7/001 , G06T5/50 , G06V10/761 , G06T2207/20221 , G06T2207/20224 , G06T2207/30148
Abstract: Systems and methods for detecting defects on a reticle are provided. One system is configured for generating different stacked difference images for multiple instances of first patterned areas in different rows on a wafer based on images generated for the first patterned areas in the different rows. The system is also configured for performing double detection based on the different stacked difference images. The system then identifies defects on the reticle based on the defects detected by the double detection. As described further herein, the systems and methods detect defects from multiple reticle rows printed on a wafer, which can reduce noise and enable detection of substantially small repeater defects. The embodiments are particularly useful for high sensitivity repeater defect detection for extreme ultraviolet (EUV) reticles and multi-die reticles (MDR).
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公开(公告)号：US11783470B2
公开(公告)日：2023-10-10
申请号：US17722710
申请日：2022-04-18
Applicant: KLA CORPORATION
Inventor： Junqing Huang , Hucheng Lee , Sangbong Park , Xiaochun Li
CPC classification number: G06T7/0006 , G01N21/9501 , G01N21/956 , G06T7/11 , H10B12/01 , H10B41/27 , H10B43/27 , G06T2207/30148
Abstract: With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.
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公开(公告)号：US20210049755A1
公开(公告)日：2021-02-18
申请号：US16542376
申请日：2019-08-16
Applicant: KLA CORPORATION
Inventor： Junqing Huang , Hucheng Lee , Sangbong Park , Xiaochun Li
IPC: G06T7/00 , H01L27/108 , H01L27/11556 , H01L27/11582 , G06T7/11 , G01N21/95 , G01N21/956
Abstract: With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.
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公开(公告)号：US20210010945A1
公开(公告)日：2021-01-14
申请号：US16910011
申请日：2020-06-23
Applicant: KLA Corporation
Inventor： Bjorn Brauer , Hucheng Lee , Sangbong Park
Abstract: Methods and systems for selecting defect detection methods for inspection of a specimen are provided. One system includes one or more computer subsystems configured for separating polygons in a care area into initial sub-groups based on a characteristic of the polygons on the specimen and determining a characteristic of noise in output generated by a detector of an inspection subsystem for the polygons in the different initial sub-groups. The computer subsystem(s) are also configured for determining final sub-groups for the polygons by combining any two or more of the different initial sub-groups having substantially the same values of the characteristic of the noise. In addition, the computer subsystem(s) are configured for selecting first and second defect detection methods for application to the output generated by the detector of the inspection subsystem during inspection of the specimen or another specimen.
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