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公开(公告)号：US20240095935A1
公开(公告)日：2024-03-21
申请号：US18178528
申请日：2023-03-05
Applicant: KLA Corporation
Inventor： Hong Chen , Ziqi Fan , Richard Wallingford , Xiaochun Li , Sangbong Park
CPC classification number: G06T7/30 , G06T7/0006 , G06T7/001 , G06T2207/20081 , G06T2207/30148
Abstract: Methods and systems for deep learning alignment for semiconductor applications are provided. One method includes transforming design information for an alignment target on a specimen to a predicted image of the alignment target by inputting the design information into a deep learning model and aligning the predicted image to an image of the alignment target on the specimen generated by an imaging subsystem. The method also includes determining an offset between the predicted image and the image generated by the imaging subsystem based on results of the aligning and storing the determined offset as an align-to-design offset for use in a process performed on the specimen with the imaging subsystem.
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公开(公告)号：US11308606B2
公开(公告)日：2022-04-19
申请号：US16542376
申请日：2019-08-16
Applicant: KLA CORPORATION
Inventor： Junqing Huang , Hucheng Lee , Sangbong Park , Xiaochun Li
IPC: G06K9/00 , G06T7/00 , H01L27/108 , H01L27/11556 , G06T7/11 , G01N21/95 , G01N21/956 , H01L27/11582
Abstract: With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.
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公开(公告)号：US12165306B2
公开(公告)日：2024-12-10
申请号：US17203719
申请日：2021-03-16
Applicant: KLA Corporation
Inventor： Manikandan Mariyappan , Jin Qian , Zhuang Liu , Xiaochun Li , Siqing Nie
Abstract: A rendered image is generated from a semiconductor device design file. The rendered image is segmented based on a grey level of the rendered image. Care areas are determined based on the segmenting. Defect inspection is performed in the care areas. This process can be performed on a wafer inspection tool that uses photon optics or electron beam optics.
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4.发明公开公开(公告)号：US20240193798A1
公开(公告)日：2024-06-13
申请号：US18078980
申请日：2022-12-11
Applicant: KLA Corporation
Inventor： Jun Jiang , Huan Jin , Zhifeng Huang , Wei Si , Xiaochun Li
CPC classification number: G06T7/344 , G06T7/001 , G06T11/00 , G06T2207/30148 , G06T2207/30168
Abstract: Methods and systems for determining information for a specimen are provided. One system includes a model configured for generating a rendered image for an alignment target on a specimen from information for a design of the alignment target. The rendered image is a simulation of images of the alignment target on the specimen generated by an imaging subsystem. The system also includes a computer subsystem configured for modifying parameter(s) of the model based on variation in parameter(s) of the imaging subsystem and/or variation in process condition(s) used to fabricate the specimen. Subsequent to the modifying, the computer subsystem is configured for 10 generating an additional rendered image for the alignment target by inputting the information for the design of the alignment target into the model and aligning the additional rendered image to an image of the alignment target generated by the imaging subsystem.
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公开(公告)号：US20220301133A1
公开(公告)日：2022-09-22
申请号：US17203719
申请日：2021-03-16
Applicant: KLA Corporation
Inventor： Manikandan Mariyappan , Jin Qian , Zhuang Liu , Xiaochun Li , Siqing Nie
Abstract: A rendered image is generated from a semiconductor device design file. The rendered image is segmented based on a grey level of the rendered image. Care areas are determined based on the segmenting. Defect inspection is performed in the care areas. This process can be performed on a wafer inspection tool that uses photon optics or electron beam optics.
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Patent Agency Ranking
公开(公告)号：US11328435B2
公开(公告)日：2022-05-10
申请号：US17334179
申请日：2021-05-28
Applicant: KLA Corporation
Inventor： Bjorn Brauer , Huan Jin , Xiaochun Li
Abstract: Methods and systems for determining one or more alignment parameters for use in a process performed on a specimen are provided. One method includes determining measures of similarity between images generated by an imaging system for corresponding locations in each of two or more pairs of dies on a specimen and performing cluster analysis based on the determined measures of similarity to identify the images that are most similar to each other and to assign different subsets of the images that are most similar to each other to different die clusters, respectively. The method also includes separately determining one or more alignment parameters for two or more of the different die clusters. The one or more alignment parameters are used for aligning images generated by the imaging system for the specimen or another specimen to a common reference.
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公开(公告)号：US11328411B2
公开(公告)日：2022-05-10
申请号：US17246034
申请日：2021-04-30
Applicant: KLA Corporation
Inventor： Hong Chen , Kenong Wu , Xiaochun Li , James A. Smith , Eugene Shifrin , Qing Luo , Michael Cook , Wei Si , Leon Yu , Bjorn Brauer , Nurmohammed Patwary , Ramon Ynzunza , Neil Troy
Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) configured for performing at least one repeater defect detection step in front-end processing during an inspection process performed on a wafer having features printed in a lithography process using a reticle. The at least one repeater defect detection step performed in the front-end processing includes identifying any defects detected at corresponding locations in two or more test images by double detection and any defects detected by stacked defect detection as first repeater defect candidates. One or more additional repeater defect detections may be performed on the first repeater defect candidates to generate final repeater defect candidates and identify defects on the reticle from the final repeater defect candidates.
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公开(公告)号：US20240296545A1
公开(公告)日：2024-09-05
申请号：US18178519
申请日：2023-03-05
Applicant: KLA Corporation
Inventor： Chunwei Song , Siqing Nie , Weifeng Zhou , Xiaochun Li , Sangbong Park
CPC classification number: G06T7/001 , G06V10/74 , G06T2207/10024 , G06T2207/10061 , G06T2207/20224 , G06T2207/30148
Abstract: Methods and systems for detecting defects on a specimen are provided. One system computes different candidate reference images from different combinations of images of the specimen generated by an inspection subsystem and combines different portions of the candidate reference images without modification to thereby generate a final reference image. The final reference image is then used for defect detection, which may be single or double detection. The embodiments are particularly useful for defect detection in areas of specimens including only non-resolvable, repeating device patterns, like cell regions, but may be used for inspection of other types of areas as well.
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公开(公告)号：US20240255448A1
公开(公告)日：2024-08-01
申请号：US18160989
申请日：2023-01-27
Applicant: KLA Corporation
Inventor： Siqing Nie , Chunwei Song , Chaoqing Wang , Weifeng Zhou , Xiaochun Li
IPC: G01N23/2251 , G01N21/95
CPC classification number: G01N23/2251 , G01N21/9501 , G01N2223/07 , G01N2223/6116 , G01N2223/646
Abstract: Methods and systems for detecting defects in an array region on a specimen are provided. One system includes an inspection subsystem configured for generating output responsive to patterned features formed in an array region on a specimen. The system also includes a computer subsystem configured for determining if a pitch of the patterned features in the output is an integer of pixels in a detector of the inspection subsystem that generated the output. When the pitch is not an integer of the pixels, the computer subsystem is configured for interpolating the output to generate interpolated output having a modified pitch of the patterned features in the interpolated output that is an integer of the pixels. The computer subsystem is also configured for detecting defects in the array region by applying a defect detection method to the interpolated output.
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公开(公告)号：US20240054632A1
公开(公告)日：2024-02-15
申请号：US17978713
申请日：2022-11-01
Applicant: KLA Corporation
Inventor： Li Yu , Wei Si , Prashant Verma , Xiaochun Li , Sangbong Park
CPC classification number: G06T7/001 , G06T7/74 , G06T2207/10024 , G06T2207/30148 , G06T2207/30168 , H01L21/67288
Abstract: Methods and systems for detecting defects on a specimen are provided. One system performs double detection in which at least one of the reference images compared to a test image is a computed reference image generated from multiple images corresponding to the test image. The other reference image may or may not be computed from more than one of the multiple images. Such a computed reference image may also be a median-based computed reference generated from multiple-median images generated from different subsets of images in a job of images generated by an inspection subsystem for a specimen. Such a system may also group images for a die row on a specimen into different jobs based on color so that different jobs have different color value ranges. Such grouping may also be performed so that each of the jobs includes a number of images greater than a predetermined, minimum job size.
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