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    High-Temperature Solders and Connections Formed Therefrom
    11.
    发明申请
    High-Temperature Solders and Connections Formed Therefrom 有权

    公开(公告)号：US20210308807A1

    公开(公告)日：2021-10-07

    申请号：US17250596

    申请日：2019-08-08

    Applicant: Kuprion Inc. ,  Lockheed Martin Corporation

    Inventor： Alfred A. Zinn ,  Randall M. Stoltenberg

    IPC: B23K35/02 ,  B23K35/30

    Abstract: Copper nanoparticle paste compositions may be formulated for forming connections that are capable of operating at high temperatures by including a grain growth inhibitor with copper nanoparticles in a suitable amount. Such nanoparticle paste compositions may comprise copper nanoparticles and 0.01-15 wt. % of a grain growth inhibitor or a precursor to a grain growth inhibitor admixed with the copper nanoparticles, in which the grain growth inhibitor comprises a metal. The grain growth inhibitor is insoluble in a bulk copper matrix and is capable of residing at one or more grain boundaries in the bulk copper matrix. The one or more grain boundaries may be formed after the copper nanoparticles undergo consolidation to form bulk copper. The grain growth inhibitor may comprise various metals that are insoluble in bulk copper.

    Metal Nanoparticles Formed Around A Nucleus and Scalable Processes for Producing Same
    12.
    发明申请
    Metal Nanoparticles Formed Around A Nucleus and Scalable Processes for Producing Same 审中-公开

    公开(公告)号：US20200180021A1

    公开(公告)日：2020-06-11

    申请号：US16740776

    申请日：2020-01-13

    Applicant: Kuprion Inc.

    Inventor： Alfred A. Zinn

    IPC: B22F1/00 ,  B22F1/02 ,  B22F9/24 ,  B01J13/02 ,  B22F9/18

    Abstract: Metal nanoparticles and compositions derived therefrom can be used in a number of different applications. Methods for making metal nanoparticles can include providing a first metal salt in a solvent; converting the first metal salt into an insoluble compound that constitutes a plurality of nanoparticle seeds; and after forming the plurality of nanoparticle seeds, reacting a reducing agent with at least a portion of a second metal salt in the presence of at least one surfactant and the plurality of nanoparticle seeds to form a plurality of metal nanoparticles. Each metal nanoparticle can include a metal shell formed around a nucleus derived from a nanoparticle seed, and the metal shell can include a metal from the second metal salt. The methods can be readily scaled to produce bulk quantities of metal nanoparticles.

    ELECTRONICS ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS
    16.
    发明申请
    ELECTRONICS ASSEMBLIES EMPLOYING COPPER IN MULTIPLE LOCATIONS 有权

    公开(公告)号：US20210320078A1

    公开(公告)日：2021-10-14

    申请号：US17266749

    申请日：2019-08-08

    Applicant: Kuprion Inc.

    Inventor： Alfred A. Zinn

    IPC: H01L23/00 ,  H01L23/498 ,  H01L23/373 ,  H01L23/10 ,  H01L25/065

    Abstract: Electronic assemblies may be fabricated with interconnects of different types present in multiple locations and comprising fused copper nanoparticles. Each interconnect or a portion thereof comprises a bulk copper matrix formed from fusion of copper nanoparticles or a reaction product formed from copper nanoparticles. The interconnects may comprise a copper-based wire bonding assembly, a copper-based flip chip connection, a copper-based hermetic seal assembly, a copper-based connector between an IC substrate and a package substrate, a copper-based component interconnect, a copper-based interconnect comprising via copper for establishing electrical communication between opposite faces of a package substrate, a copper-based interconnect defining a heat channel formed from via copper, and any combination thereof.

    Metal nanoparticles formed around a nucleus and scalable processes for producing same
    18.
    发明授权
    Metal nanoparticles formed around a nucleus and scalable processes for producing same 有权

    公开(公告)号：US10569329B2

    公开(公告)日：2020-02-25

    申请号：US15615739

    申请日：2017-06-06

    Applicant: Kuprion Inc.

    Inventor： Alfred A. Zinn

    IPC: B22F1/00 ,  B22F1/02 ,  B22F9/24 ,  B01J13/02 ,  B22F9/18 ,  B82Y40/00

    Abstract: Metal nanoparticles and compositions derived therefrom can be used in a number of different applications. Methods for making metal nanoparticles can include providing a first metal salt in a solvent; converting the first metal salt into an insoluble compound that constitutes a plurality of nanoparticle seeds; and after forming the plurality of nanoparticle seeds, reacting a reducing agent with at least a portion of a second metal salt in the presence of at least one surfactant and the plurality of nanoparticle seeds to form a plurality of metal nanoparticles. Each metal nanoparticle can include a metal shell formed around a nucleus derived from a nanoparticle seed, and the metal shell can include a metal from the second metal salt. The methods can be readily scaled to produce bulk quantities of metal nanoparticles.

    Electronics assemblies employing copper in multiple locations
    19.
    发明授权
    Electronics assemblies employing copper in multiple locations 有权

    公开(公告)号：US12230596B2

    公开(公告)日：2025-02-18

    申请号：US18339865

    申请日：2023-06-22

    Applicant: Kuprion Inc.

    Inventor： Alfred A. Zinn

    IPC: H01L23/00 ,  H01L23/10 ,  H01L23/373 ,  H01L23/498 ,  H01L25/065

    Abstract: Electronic assemblies may be fabricated with interconnects of different types present in multiple locations and comprising fused copper nanoparticles. Each interconnect or a portion thereof comprises a bulk copper matrix formed from fusion of copper nanoparticles or a reaction product formed from copper nanoparticles. The interconnects may comprise a copper-based wire bonding assembly, a copper-based flip chip connection, a copper-based hermetic seal assembly, a copper-based connector between an IC substrate and a package substrate, a copper-based component interconnect, a copper-based interconnect comprising via copper for establishing electrical communication between opposite faces of a package substrate, a copper-based interconnect defining a heat channel formed from via copper, and any combination thereof.

    Heat Pipes Featuring Coefficient of Thermal Expansion Matching and Heat Dissipation Using Same
    20.
    发明公开
    Heat Pipes Featuring Coefficient of Thermal Expansion Matching and Heat Dissipation Using Same 审中-公开

    公开(公告)号：US20240365510A1

    公开(公告)日：2024-10-31

    申请号：US18566137

    申请日：2022-06-03

    Applicant: Kuprion Inc.

    Inventor： Alfred A. Zinn

    IPC: H05K7/20 ,  H05K1/02

    CPC classification number: H05K7/20336 ,  H05K1/0203 ,  H05K2201/068

    Abstract: Heat pipes may be tailored for coefficient of thermal expansion (CTE) matching with heat-producing components, such as electronic components, in thermal contact therewith. Copper nanoparticles may be consolidated under mild conditions with a CTE modifier to form a copper composite defining a sealed outer shell of a heat pipe, which may contact a heat-producing component for promoting effective heat transfer and robust bonding between the two. A working fluid for promoting heat transfer may be present within an internal space defined within the sealed outer shell. The working fluid may transfer heat from a first location to a second location within the heat pipe. The heat may enter the heat pipe from a heat source contacting the first location, and the heat may exit the heat pipe at the second location through discharge to a suitable heat sink.

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