摘要:
A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times. With similar operation and effect, where any signal line element of the connector mechanism is arranged exterior of its corresponding guard line element, such as adjacent the chuck assembly or on the probe-holding assembly, a guard enclosure is provided to surround and fully guard such signal line element in interposed relationship between that element and the outer shielding enclosure.
摘要:
A probe station is equipped with an integrated guarding system which facilitates the use of the station for low-current measurements, as well as integrated Kelvin connections to eliminate voltage losses caused by line resistances. The station has a chuck assembly which consists of at least three chuck assembly elements. A first element supports the test device, while an underlying second element acts as a guard to reduce leakage currents. These elements are electrically insulated from each other and from their underlying supporting structure, which is the third element. Ready-to-use, selectively detachable electrical connector assemblies provide for signal and guard connections to the first and second chuck assembly elements, respectively, as well as providing Kelvin connections thereto. The capacitance between the respective chuck assembly elements is extremely low due to the provision of air space as the primary electrical insulator. Unique electrical connectors for individually-positionable probes provide both guarding and Kelvin connection capability together with separate EMI shielding movable in unison with each probe individually.
摘要:
A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.
摘要:
A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times. With similar operation and effect, where any signal line element of the connector mechanism is arranged exterior of its corresponding guard line element, such as adjacent the chuck assembly or on the probe-holding assembly, a guard enclosure is provided to surround and fully guard such signal line element in interposed relationship between that element and the outer shielding enclosure.
摘要:
A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.
摘要:
A wafer probe station adapted for low-current measurements provides electrically active upper and lower chuck assembly elements where air gaps are provided between a major portion of either a lower or nonlower surface on the upper chuck assembly element and a corresponding conductive surface on or connected to the lower chuck assembly element thereby minimizing leakage currents therebetween. The chuck assembly elements are preferably enclosed by an environment control enclosure having a sidewall portion relative to which the upper chuck assembly element can move laterally. During such movement, the upper chuck assembly remains in constant spacing with a conductive member that laterally surrounds it so as to stabilize electro-magnetic conditions. Concurrently, the sidewall portion is kept motionless relative to the probe holder which keeps contaminants away from the region immediate to the upper chuck assembly element, including any moisture droplets that have condensed during low-temperature testing. Modularity of the chuck assembly elements is preferably facilitated by detachable electrical connections. Preferably, the lower chuck assembly element, the conductive member and an upper guard plate surround the upper chuck assembly element for guarding thereof so as to further minimize leakage currents and reduce settling times.
摘要:
A probe station is equipped with an integrated guarding system which facilitates the use of the station for low-current measurements, as well as integrated Kelvin connections to eliminate voltage losses caused by line resistances. The station has a chuck assembly which consists of at least three chuck assembly elements. A first element supports the test device, while an underlying second element acts as a guard to reduce leakage currents. These elements are electrically insulated from each other and from their underlying supporting structure, which is the third element. Ready-to-use, selectively detachable electrical connector assemblies provide for signal and guard connections to the first and second chuck assembly elements, respectively, as well as providing Kelvin connections thereto. The capacitance between the respective chuck assembly elements is extremely low due to the provision of air space as the primary electrical insulator. Unique electrical connectors for individually-positionable probes provide both guarding and Kelvin connection capability together with separate EMI shielding movable in unison with each probe individually.
摘要:
A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times. With similar operation and effect, where any signal line element of the connector mechanism is arranged exterior of its corresponding guard line element, such as adjacent the chuck assembly or on the probe-holding assembly, a guard enclosure is provided to surround and fully guard such signal line element in interposed relationship between that element and the outer shielding enclosure.
摘要:
A probe station includes a fully guarded chuck assembly and connector mechanism for increasing sensitivity to low-level currents while reducing settling times. The chuck assembly includes a wafer-supporting first chuck element surrounded by a second chuck element having a lower component, skirting component and upper component each with a surface portion extending opposite the first element for guarding thereof. The connector mechanism is so connected to the second chuck element as to enable, during low-level current measurements, the potential on each component to follow that on the first chuck element as measured relative to an outer shielding enclosure surrounding each element. Leakage current from the first chuck element is thus reduced to virtually zero, hence enabling increased current sensitivity, and the reduced capacitance thus provided by the second chuck element decreases charging periods, hence reducing settling times. With similar operation and effect, where any signal line element of the connector mechanism is arranged exterior of its corresponding guard line element, such as adjacent the chuck assembly or on the probe-holding assembly, a guard enclosure is provided to surround and fully guard such signal line element in interposed relationship between that element and the outer shielding enclosure.
摘要:
A wafer probe station is equipped with an integrated environment control enclosure substantially surrounding a supporting surface for holding a test device, such enclosure limiting fluid communication between the interior and exterior of the enclosure and preferably also providing EMI shielding and a dark environment. The limited communication between the interior and exterior of the enclosure is kept substantially constant despite positioning movement of either the supporting surface or probes. The positioning mechanisms for the supporting surface and probes each are located at least partially outside of the enclosure.