公开(公告)号：US5468910A

公开(公告)日：1995-11-21

申请号：US375061

申请日：1995-01-19

Applicant: James H. Knapp ,  Keith E. Nelson

Inventor： James H. Knapp ,  Keith E. Nelson

IPC: H01L23/34 ,  H01L23/16 ,  H01L23/31 ,  H01L23/433 ,  H01L23/495 ,  H01L23/28 ,  H01L23/12 ,  H05K1/18 ,  H05K7/20

CPC classification number: H01L23/49531 ,  H01L23/16 ,  H01L23/315 ,  H01L23/4334 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025

Abstract: A method for making an improved semiconductor device package is provided. A semiconductor die (16) is attached to a supportive substrate (10, 12). A protective lid (20) is attached to the supportive substrate (10, 12), over the semiconductor die (16). The protective lid (20) is partially encapsulated with molding compound (28). The protective lid (20) prevents the molding compound (30) from contacting the semiconductor die (16), and associated wirebonded wires (18). A portion (30) of the protective lid (20) remains exposed. Thus, a molded package compatible with current product designs and assembly processes is provided, yet disadvantages caused by molding compound contacting the die (16) and wires (18) are avoided. Furthermore, the exposed protective lid (30) provides superior heat dissipation for the package.

Abstract translation: 提供了一种制造改进的半导体器件封装的方法。 将半导体管芯（16）连接到支撑衬底（10,12）上。 保护盖（20）在半导体管芯（16）上方附着到支撑基板（10,12）上。 保护盖（20）用模塑料（28）部分封装。 保护盖（20）防止模塑料（30）与半导体管芯（16）和相关的引线键合线（18）接触。 保护盖（20）的一部分（30）保持暴露。 因此，提供了与当前产品设计和组装过程兼容的模制封装，但是避免了由模具（16）和导线（18）接触的模制化合物引起的缺点。 此外，暴露的保护盖（30）为包装提供了优异的散热。

公开(公告)号：US5182071A

公开(公告)日：1993-01-26

申请号：US627526

申请日：1990-12-14

Applicant: James H. Knapp ,  Keith E. Nelson

Inventor： James H. Knapp ,  Keith E. Nelson

IPC: B29C45/02 ,  B29C45/14 ,  B29C45/27 ,  B29C45/58 ,  H01L21/56 ,  H01L23/495

CPC classification number: B29C45/581 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/2701 ,  H01L21/565 ,  H01L23/49558 ,  B29K2063/00 ,  H01L2924/0002

Abstract: Molding carrier structures to leads of existing semiconductor packages is accomplished by molding at temperatures which maintain approximately matched thermal expansion between an encapsulating material and leads of the semiconductor package. The matched thermal expansion is provided by molding at temperatures below that which is required for glass transition of the encapsulating material. Molding at such temperatures is facilitated by a molding assembly that has a molding pot with an irregular shaped bottom which fluidizes the encapsulating material at low temperatures. Molding at temperatures that essentially match thermal expansion between the package's leads and the encapsulating material prevents damaging the leads of the package.

Abstract translation: 通过在密封材料和半导体封装的引线之间保持大致匹配的热膨胀的温度下模制来实现对现有半导体封装的引线的成型载体结构。 匹配的热膨胀通过在低于封装材料的玻璃化转变所需温度的温度下模制而提供。 通过具有不规则形状底部的模制罐的模制组件可以在这种温度下成型，这在低温下使封装材料流化。 在基本匹配封装引线和封装材料之间的热膨胀的温度下成型可防止损坏封装的引线。