摘要:
The disclosure describes an antenna protection circuit for use in circuits where Single Event Transients from energetic particles is a concern. The antenna protection circuit may include at least three diodes, connected electrically in series and arranged such that at most all but one of the at least three diodes produce a transient current pulse from an energetic particle. During the transient current pulse event, the remaining diode remains reverse biased thereby sufficiently blocking the transient current pulse and an SET does not occur on the signal node. The antenna protection circuit may be constructed so that no unshorted parasitic p-n junction structure is associated with any of the diodes in the circuit, which would otherwise have to be explicitly included in the at least three diodes.
摘要:
A process flow for fabricating shallow trench isolation (STI) devices with direct body tie contacts is provided. The process flow follows steps similar to standard STI fabrication methods except that in one of the etching steps, body tie contacts are etched through the nitride layer and STI oxide layer, directly to the body tie. This process flow provides a direct body tie contact to mitigate floating body effects but also eliminates hysteresis and transient upset effects common in non-direct body tie contact configurations, without the critical alignment requirements and critical dimension control of the layout.
摘要:
This disclosure is directed to techniques for preventing or reducing perturbations of an output signal of a differential amplifier caused by ionizing radiation incident upon the amplifier. The amplifier may include an amplification module that includes a plurality of amplification units configured to amplify a difference between a first component and a second component of a differential voltage signal to generate a plurality of amplified difference signals each corresponding to the amplified difference. The amplifier may further include a combination module that combines the plurality of amplified difference signals to generate a common output signal corresponding to the amplified difference.
摘要:
This disclosure describes voting circuits where an output is generated based on a plurality of inputs. A first plurality of logic paths connects the output to a high voltage. Each logic path of the first plurality of logic paths includes two transistors. A second plurality of logic paths connects the output to the low voltage. Each logic path of the second plurality of logic paths comprises two transistors. Based on N or N−1 of the inputs agreeing, the output is driven to either the low voltage or the high voltage via a subset of logic paths of the first and second plurality of logic paths.
摘要:
A process flow for fabricating shallow trench isolation (STI) devices with direct body tie contacts is provided. The process flow follows steps similar to standard STI fabrication methods except that in one of the etching steps, body tie contacts are etched through the nitride layer and STI oxide layer, directly to the body tie. This process flow provides a direct body tie contact to mitigate floating body effects but also eliminates hysteresis and transient upset effects common in non-direct body tie contact configurations, without the critical alignment requirements and critical dimension control of the layout.
摘要:
Described herein is a majority carrier device. Specifically, an exemplary device may comprise source, channel, and drain regions in a thin semiconductor layer, and the source, channel, and drain region may all share a single doping type of varying concentrations. Further, the device may comprise an insulating layer above the channel region and a gate region above the insulating layer, such that the gate modulates the channel. The device described herein may eliminate the parasitic bipolar transistor and the sensitivity to excess minority carrier generation that results from single event effects (SEE) such as heavy ion hits.
摘要:
An antenna diode circuit is described. The antenna diode circuit includes two diodes connected in series between a signal line and ground. Alternatively, the antenna diode circuit is connected in series between a signal line and a power supply. In addition to protecting the signal line from charge accumulation during wafer fabrication, the antenna diode circuit prevents a single event transient glitch caused by a particle strike to either one of the diodes in the antenna diode circuit.