公开(公告)号：US06918176B2

公开(公告)日：2005-07-19

申请号：US10087927

申请日：2002-03-05

申请人： Kazuhide Nagao ,  Takuya Tsutsumi ,  Takahiro Noda ,  Hideki Sumi

发明人： Kazuhide Nagao ,  Takuya Tsutsumi ,  Takahiro Noda ,  Hideki Sumi

IPC分类号： H05K13/00 ,  H05K13/04 ,  H05K3/30

CPC分类号： H05K13/0452 ,  H05K13/0069 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53174 ,  Y10T29/53178

摘要： An apparatus and method for mounting electronic parts wherein a transfer width between a pair of transfer rails is changeable according to a size of a substrate. A mounting head picks up electronic parts at a parts supply member and keeps its stand-by position for mounting the electronic parts on the substrate. The stand-by position of the mounting head is determined according to the changed amount of the transfer width.

摘要翻译： 一种用于安装电子部件的装置和方法，其中一对传送导轨之间的传送宽度可根据基板的尺寸而改变。 安装头在零件供应构件上拾取电子部件，并保持其用于将电子部件安装在基板上的待机位置。 安装头的待机位置根据传送宽度的变化量来确定。

公开(公告)号：US08046907B2

公开(公告)日：2011-11-01

申请号：US11916473

申请日：2006-08-16

申请人： Hideki Sumi ,  Takahiro Noda

发明人： Hideki Sumi ,  Takahiro Noda

IPC分类号： B23P19/00

CPC分类号： H05K13/0452 ,  H05K13/0853 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53178

摘要： In an electronic component placement method in which electronic components are picked up from a plurality of component supply sections which supply electronic components using a plurality of mounting heads which are provided corresponding to the respective component supply sections, and the electronic components are transferred and mounted on a substrate in a same placing stage, in performing the component transferring and mounting operations, head interference areas which constitute exclusive operating regions to which only the specified mounting heads are allowed to access are set for every placing turn. Due to such a constitution, in the component placement operation, it is possible to rationally set the accessible region without causing the interference of one mounting head with another mounting head thus shortening a placing tact time by excluding wasteful standby times of the mounting heads.

摘要翻译： 在电子部件配置方法中，电子部件从使用与各部件供给部对应设置的多个安装头供给电子部件的多个部件供给部拾取，电子部件被传送并安装在 在相同的放置台中的基板，在执行部件传送和安装操作时，对于每个放置转弯设置构成仅允许指定的安装头访问的专用操作区域的头部干涉区域。 由于这样的结构，在部件配置动作中，可以合理地设定可接近区域而不会引起一个安装头与另一个安装头的干扰，从而通过排除安装头的浪费的待机时间来缩短放置时间。

公开(公告)号：US08140176B2

公开(公告)日：2012-03-20

申请号：US12160398

申请日：2006-12-27

申请人： Hideki Sumi

发明人： Hideki Sumi

IPC分类号： G06F19/00 ,  B23P19/00

CPC分类号： H05K13/0452 ,  Y10T29/53174

摘要： In an electronic component mounting system constituted by interconnecting a plurality of mounting apparatuses, a board ID code attached by digital data to the board is read in a board supply apparatus located in the uppermost stream and transmitted to the mounting apparatuses on the downstream side via communication means. By comparing the transmitted board ID code with mounting nonrequirement board code data (defective board code, read error code, dummy board code, etc.) preparatorily stored in a storage section in the mounting apparatus, it is determined whether or not execution of mounting operation of the board is required, and the board determined to be not required to be subjected to mounting is unloaded to the downstream side without carrying out mounting works and without line stop.

摘要翻译： 在通过互连多个安装装置构成的电子部件安装系统中，在位于最上游的板供给装置中读取通过数字数据附加到板的板ID代码，并且经由通信通过下游侧的安装装置 手段。 通过将发送的板ID代码与准备存储在安装装置的存储部中的安装非要求板代码数据（缺陷板代码，读取错误代码，虚拟板代码等）进行比较，确定是否执行安装操作 需要进行安装，无需进行安装就可以将不需要安装的电路板卸载到下游侧。

公开(公告)号：US20130028701A1

公开(公告)日：2013-01-31

申请号：US13639720

申请日：2011-04-13

申请人： Hideki Sumi

发明人： Hideki Sumi

IPC分类号： H05K13/02

CPC分类号： H05K13/0417 ,  H05K13/0215 ,  H05K13/0419

摘要： A method includes: detecting a splice by splicing in a tape feed process of supplying a component by pitch-feeding the carrier tape; and performing data processing of writing splice component information over in-use component information when the splice is detected, and rewriting only a number of remaining component of the in-use component information by means of the number of remaining component of the splice component information without issuing a component depletion alarm when the splice is not detected and when the number of remaining component in the in-use component information has decreased to a predetermined value.

摘要翻译： 一种方法包括：通过在通过对载带进行俯仰馈送来提供部件的带馈送过程中拼接检测拼接; 并且当检测到拼接时执行将拼接分量信息写入到使用中分量信息上的数据处理，并且仅通过拼接分量信息的剩余分量的数量重写仅使用分量信息的剩余分量的数量而没有 当未检测到拼接时以及当使用中分量信息中的剩余分量的数量已经减少到预定值时发出部件耗尽报警。

公开(公告)号：US08245833B2

公开(公告)日：2012-08-21

申请号：US12739585

申请日：2008-10-16

申请人： Hideki Sumi

发明人： Hideki Sumi

IPC分类号： H05K13/04

CPC分类号： H05K13/0061

摘要： To provide a substrate transport apparatus and a substrate transport method that enable curtailing of a mounting wait time incidental to movement of support pins.Height data pertaining to components 10 mounted on a back side of a substrate 1 are stored beforehand. During substrate carrying-in operation, support pins 7 are caused to descend according to component height data and wait at a height h1 where to be able to avoid interference with the components 10. During substrate carrying-out operation, the support pins 7 are caused to descend according to the component height data and recede to the height h1 where to be able to avoid interference with the components 10.

摘要翻译： 提供一种能够抑制与支撑销的移动有关的安装等待时间的基板输送装置和基板输送方法。 预先存储与安装在基板1的背面的部件10有关的高度数据。 在基板输入操作期间，支撑销7根据部件高度数据下降，并且在能够避免与部件10干涉的高度h1处等待。在基板传送操作期间，引起支撑销7 根据部件高度数据下降并减小到能够避免与部件10干涉的高度h1。

公开(公告)号：US07506434B2

公开(公告)日：2009-03-24

申请号：US10863403

申请日：2004-06-08

申请人： Hideki Sumi ,  Hiroshi Matsumura

发明人： Hideki Sumi ,  Hiroshi Matsumura

IPC分类号： H05K3/30

CPC分类号： H05K13/0417 ,  H05K13/022 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178

摘要： An electronic parts mounting apparatus and an electronic parts mounting method for picking up a plurality of electronic parts simultaneously by a transfer head having a plurality of suction nozzles from a plurality of tape feeders and then mounting the electronic parts on a substrate are provided. Displacement amounts of parts stop positions in respective tape feeders are detected in advance and stored as stop position correction data, and then tape feeding mechanisms are controlled based on the stop position correction data upon picking up the parts by the transfer head to execute such a registration that causes the parts stop positions to coincide with parts suction positions of the suction nozzles in the transfer head.

摘要翻译： 提供一种电子部件安装装置和电子部件安装方法，用于通过具有多个吸嘴的多个吸嘴的传送头同时拾取多个电子部件，然后将电子部件安装在基板上。 预先检测各个带式送料机中的零件停止位置的位移量并作为停止位置校正数据存储，然后在由转印头拾取零件时基于停止位置校正数据来控制带进给机构，以执行这种注册 这导致部件停止位置与转印头中的吸嘴的部件吸入位置一致。

公开(公告)号：US20100262276A1

公开(公告)日：2010-10-14

申请号：US12739585

申请日：2008-10-16

申请人： Hideki Sumi

发明人： Hideki Sumi

IPC分类号： H01L21/677 ,  H01L21/683

CPC分类号： H05K13/0061

摘要： To provide a substrate transport apparatus and a substrate transport method that enable curtailing of a mounting wait time incidental to movement of support pins.Height data pertaining to components 10 mounted on a back side of a substrate 1 are stored beforehand. During substrate carrying-in operation, support pins 7 are caused to descend according to component height data and wait at a height h1 where to be able to avoid interference with the components 10. During substrate carrying-out operation, the support pins 7 are caused to descend according to the component height data and recede to the height h1 where to be able to avoid interference with the components 10.

摘要翻译： 提供一种能够抑制与支撑销的移动有关的安装等待时间的基板输送装置和基板输送方法。 预先存储与安装在基板1的背面的部件10有关的高度数据。 在基板输入操作期间，支撑销7根据部件高度数据下降，并且在能够避免与部件10干涉的高度h1处等待。在基板传送操作期间，引起支撑销7 根据部件高度数据下降并减小到能够避免与部件10干涉的高度h1。

公开(公告)号：US20090100672A1

公开(公告)日：2009-04-23

申请号：US11916473

申请日：2006-08-16

申请人： Hideki Sumi ,  Takahiro Noda

发明人： Hideki Sumi ,  Takahiro Noda

IPC分类号： B23P19/00 ,  H05K3/30

CPC分类号： H05K13/0452 ,  H05K13/0853 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53174 ,  Y10T29/53178

摘要： In an electronic component placement method in which electronic components are picked up from a plurality of component supply sections which supply electronic components using a plurality of mounting heads which are provided corresponding to the respective component supply sections, and the electronic components are transferred and mounted on a substrate in a same placing stage, in performing the component transferring and mounting operations, head interference areas which constitute exclusive operating regions to which only the specified mounting heads are allowed to access are set for every placing turn. Due to such a constitution, in the component placement operation, it is possible to rationally set the accessible region without causing the interference of one mounting head with another mounting head thus shortening a placing tact time by excluding wasteful standby times of the mounting heads.

摘要翻译： 在电子部件配置方法中，电子部件从使用与各部件供给部对应设置的多个安装头供给电子部件的多个部件供给部拾取，电子部件被传送并安装在 在相同的放置台中的基板，在执行部件传送和安装操作时，对于每个放置转弯设置构成仅允许指定的安装头访问的专用操作区域的头部干涉区域。 由于这样的结构，在部件配置动作中，可以合理地设定可接近区域而不会引起一个安装头与另一个安装头的干扰，从而通过排除安装头的浪费的待机时间来缩短放置时间。

公开(公告)号：US20050253596A1

公开(公告)日：2005-11-17

申请号：US10942127

申请日：2004-09-16

申请人： Mayo Kitano ,  Hideki Sumi ,  Tsuyoshi Moribe

发明人： Mayo Kitano ,  Hideki Sumi ,  Tsuyoshi Moribe

IPC分类号： G01C19/56 ,  G01D5/24 ,  G01D5/241 ,  G01P15/125 ,  G01R27/26

CPC分类号： G01C19/56 ,  G01D5/24 ,  G01P15/125 ,  G01P2015/084

摘要： Oscillators have capacitors, respectively, whose capacitances change according to an external force and generate first oscillating signals according to the capacitances. Each of the capacitors is disposed, for example, between a substrate and a mass body that is movably disposed to face the substrate and oscillates in a direction perpendicular to the substrate. A detecting unit detects a relative difference between the capacitances of the capacitors as a difference between frequencies of the first oscillating signals. An angular speed or acceleration applied in a horizontal direction of the substrate is calculated according to the frequency change detected by the detecting unit. Therefore, a capacitance difference detecting circuit and a MEMS sensor that detect a minute change in the capacitances of the two capacitors caused by the external force are formed.

摘要翻译： 振荡器分别具有电容器，其电容根据外力而变化，并根据电容产生第一振荡信号。 每个电容器例如设置在基板和可移动地设置成面对基板并在垂直于基板的方向上振荡的质量体之间。 检测单元检测作为第一振荡信号的频率之间的差异的电容器的电容之间的相对差。 根据由检测单元检测到的频率变化来计算在基板的水平方向上施加的角速度或加速度。 因此，形成检测由外力引起的两个电容器的电容的微小变化的电容差检测电路和MEMS传感器。

公开(公告)号：US06578261B2

公开(公告)日：2003-06-17

申请号：US09923897

申请日：2001-08-07

申请人： Hideki Sumi

发明人： Hideki Sumi

IPC分类号： H05K330

CPC分类号： H05K13/08 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/53174

摘要： In a part-mounting system formed by linking plural part-mounting devices which carry out respective process steps of part-mounting, when a production tact-time of one of the devices varies beyond a given variation range, a tact-time change signal is sent to other devices located at upstream and/or downstream of the device via a communicating section. The other devices receive the tact-time change signal and changes their own work tact-times from the ones corresponding to a productivity-oriented mode to a slower tact-pattern corresponding to a quality-oriented mode. Thus every device constituting the system can accommodate a tact-time variation due to a tact-time delay of any part-mounting device. As a result, the quality appropriate to the tact-time can be secured.

摘要翻译： 在通过连接执行部件安装的各个工艺步骤的多个部件安装装置形成的部件安装系统中，当一个装置的生产节拍时间变化超过给定的变化范围时，节拍改变信号为 经由通信部分发送到位于设备的上游和/或下游的其他设备。 其他设备接收节拍时间改变信号，并将自己的工作生产时间从对应于生产力导向模式的工作时间改变为对应于质量导向模式的较慢的节拍模式。 因此，构成系统的每个装置可以由于任何部件安装装置的触发时间延迟而适应节拍时间变化。 结果，可以确保适合于节拍时间的质量。