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公开(公告)号：US20070093187A1
公开(公告)日：2007-04-26
申请号：US11528562
申请日：2006-09-28
申请人： Kenji Takenouchi
发明人： Kenji Takenouchi
CPC分类号： C09G1/02 , C09K3/1409 , C09K3/1463 , H01L21/3212
摘要： According to an aspect of the invention, there is provided a polishing liquid for polishing a barrier metal material on an interlayer insulation material, the polishing liquid having a pH of from 2.0 to 6.0 and including an aqueous solution containing a compound represented by the following formula (1), and polishing particles containing silicon oxide and dispersed in the aqueous solution: R1—(CH2)m—(CHR2)n—COOH (1) wherein m+n≦4; R1 represents a hydrogen atom, a methyl group, an ethyl group or a hydroxyl group; R2 represents a methyl group, an ethyl group, a benzene ring or a hydroxyl group; and when a plurality of R2s are present in the formula (1), they are the same or different from one another.
摘要翻译： 根据本发明的一个方面，提供了一种用于在层间绝缘材料上抛光阻挡金属材料的抛光液，所述抛光液的pH为2.0至6.0，并且包括含有由下式表示的化合物的水溶液 （1），和含有氧化硅并分散在水溶液中的抛光颗粒：R 1 - （CH 2）2 - （CHR 2） 其中m + n <4;其中m + n <= 4; R 1表示氢原子，甲基，乙基或羟基; R 2表示甲基，乙基，苯环或羟基; 并且当式（1）中存在多个R 2 2时，它们彼此相同或不同。
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公开(公告)号：US06544307B2
公开(公告)日：2003-04-08
申请号：US09769058
申请日：2001-01-25
IPC分类号： C09K314
CPC分类号： C09K3/1436 , C09G1/02 , C09K3/1463
摘要： A polishing compound containing cocoon-shaped silica particles and crystal silica particles, and water-soluble polymers including; at least one type selected from the groups including ammonium nitrate and ammonium acetate, and at least one type selected from methylcellulose, carboxymethylcellulose, hydroxyethylcellulose, and the group including carboxymethylcellulose.
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13.发明授权
公开(公告)号：US5322575A
公开(公告)日：1994-06-21
申请号：US36490
申请日：1993-03-24
IPC分类号： C22F1/08
摘要： A copper base alloy for terminals that is superior in all aspects of tensile strength, spring limits, conductivity, and stress relaxation characteristics can be produced by a process repeating the cycles consisting of hot-rolling, cold-rolling and annealing, in which process an ingot is prepared by melting and casting an alloy containing 1.0-3.0 wt % Ni, 0.02-0.15 wt % P. 0.5-2.0 wt. % Sn and, as an optional component, 0.01-2.0 wt % Zn, with the balance being Cu and incidental impurities, and with the ratio of weight percentages of Ni to P being within the range of 10-50%.
摘要翻译： 可以通过重复由热轧，冷轧和退火组成的循环的过程来制造在拉伸强度，弹簧极限，导电性和应力松弛特性的各个方面都优异的用于端子的铜基合金，其中， 通过熔融和铸造含有1.0-3.0重量％Ni，0.02-0.15重量％P.0.5-2.0重量％的Ni， ％Sn，并且作为任选组分，为0.01-2.0重量％的Zn，余量为Cu和偶然杂质，并且Ni与P的重量百分比的比例在10-50％的范围内。
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公开(公告)号：USD326085S
公开(公告)日：1992-05-12
申请号：US297515
申请日：1989-01-17
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公开(公告)号：USD319426S
公开(公告)日：1991-08-27
申请号：US262002
申请日：1988-10-24
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公开(公告)号：USD318042S
公开(公告)日：1991-07-09
申请号：US297514
申请日：1989-01-17
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公开(公告)号：US4950179A
公开(公告)日：1990-08-21
申请号：US350483
申请日：1989-05-11
IPC分类号： H01R13/639 , H01R13/627 , H01R13/64 , H01R13/641
CPC分类号： H01R13/6272 , H01R13/641
摘要： A locking security mechanism for an electrical connector having a pair of male and female connector members, locking means and a locking security member mounted in a male connector member in a normally undetachable manner and maintained in a pre-engagement position with a pre-engagement releasing means in a female connector member. When the male and female connector members are engaged with each other, actuating fingers in the female connector member act on a inclined lower surface of pre-engagement fingers in the locking security member to escape the pre-engagement. Locking means in the male connector member comes into engagement with the locking security member unlocked from the pre-engagement state wherein a means for preventing the locking security member from securing in incomplete locking includes a block member provided at the free end of the locking arm member, an enclosure wall portion provided in the main body of the locking securing member for receiving the block member of the locking arm member, and checking lugs provided in the block member and the enclosure portion for abutting with each other.
摘要翻译： 一种用于电连接器的锁定安全机构，其具有一对阳连接器构件和阴连接器构件，锁定装置和锁定安全构件，其以正常不可拆卸的方式安装在阳连接器构件中并保持在预接合位置，其具有预接合释放 在阴连接器构件中的装置。 当阳连接器构件和阴连接器构件彼此接合时，阴连接器构件中的致动指状件作用在锁定安全构件中的预接合指状物的倾斜下表面上以逃离预接合。 阳连接器构件中的锁定装置与从预接合状态解锁的锁定安全构件接合，其中用于防止锁定安全构件固定在不完全锁定中的装置包括设置在锁定臂构件的自由端处的阻挡构件 ，设置在所述锁定固定构件的主体中的用于接收所述锁定臂构件的所述块构件的外壳壁部分，以及设置在所述块构件中的凸耳和所述外壳部分，用于彼此邻接。
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18.发明申请Metal-polishing liquid and chemical mechanical polishing method using the same 失效金属抛光液和化学机械抛光方法使用相同公开(公告)号：US20070186484A1
公开(公告)日：2007-08-16
申请号：US11699406
申请日：2007-01-30
IPC分类号： B24D3/02
CPC分类号： C09G1/02 , C09K3/1445 , C09K3/1463 , H01L21/3212
摘要： The invention provides a metal polishing liquid comprising an oxidizing agent and colloidal silica in which a part of a surface of the colloidal silica is covered with aluminum atoms, and a Chemical Mechanical Polishing method using the same. An amino acid, a compound having an isothiazoline-3-one skeleton, an organic acid, a passivated film forming agent, a cationic surfactant, a nonionic surfactant, and a water-soluble polymer may be contained. A metal polishing liquid which is used in Chemical Mechanical Polishing in manufacturing of a semiconductor device, attains low dishing of a subject to be polished, and can perform polishing excellent in in-plane uniformity of a surface to be polished.
摘要翻译： 本发明提供了一种金属抛光液，其包含氧化剂和胶体二氧化硅，其中胶体二氧化硅的一部分表面被铝原子覆盖，并使用化学机械抛光方法。 可以包含氨基酸，具有异噻唑啉-3-酮骨架的化合物，有机酸，钝化成膜剂，阳离子表面活性剂，非离子表面活性剂和水溶性聚合物。 在半导体装置的制造中使用的化学机械抛光中使用的金属研磨液，能够使被研磨对象的低凹陷，能够进行抛光面的面内均匀性优异的抛光。
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公开(公告)号：US5968783A
公开(公告)日：1999-10-19
申请号：US43175
申请日：1998-03-16
申请人： Kazuya Ishige , Kenji Takenouchi
发明人： Kazuya Ishige , Kenji Takenouchi
CPC分类号： C12P19/30
摘要： The present invention relates to a process for preparing sugar nucleotides from nucleotides and sugar derivatives by the use of yeast, characterized in that the reactions are conducted at 20.degree. C. or below. According to this process, even when the preparation is conducted on an enlarged scale, a reduction in the yield of a sugar nucleotide can be inhibited by a very simple means; lowering the reaction temperature 20.degree. C. or below. Thus, the process is an extremely practical one applicable to the mass-production of sugar nucleotides.
摘要翻译： PCT No.PCT / JP97 / 02387第 371日期：1998年3月16日 102（e）1998年3月16日PCT 1997年7月10日PCT公布。 第WO98 / 02566号公报 日期1998年1月22日本发明涉及通过使用酵母从核苷酸和糖衍生物制备糖核苷酸的方法，其特征在于反应在20℃以下进行。 根据该方法，即使在制剂进行扩大的情况下，也可以通过非常简单的手段抑制糖核苷酸的收率降低; 降低反应温度20℃以下。 因此，该方法是适用于大量生产糖核苷酸的非常实用的方法。
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公开(公告)号：US5387293A
公开(公告)日：1995-02-07
申请号：US36489
申请日：1993-03-24
摘要： A copper base alloy for terminals that is of the Cu-Ni-Sn-P or Cu-Ni-Sn-P-Zn system and that has a tensile strength of at least 50 kgf/mm.sup.2, a spring limit of at least 40 kgf/mm.sup.2, a stress relaxation of not more than 10% and a conductivity of at least 30% IACS is provided. Terminals the spring portion or the entire part of which is produced from that copper base alloy, having an insertion/extraction force of 0.2-3 kgf and a resistance of not more than 3 m.OMEGA. at low voltage and current as initial performance, with the added characteristic that the terminals will experience not more than 20% stress relaxation are also provided. The alloy is superior to the conventional bronze, phosphor bronze and Cu-Sn-Fe-P alloys for terminals in terms of tensile strength, spring limits, stress relaxation characteristic and conductivity and, hence, the terminals manufactured from those alloys have higher performance and reliability than the terminals made of the conventional copper base alloys for terminals.
摘要翻译： 用于Cu-Ni-Sn-P或Cu-Ni-Sn-P-Zn系的端子用铜基合金，其拉伸强度为至少50kgf / mm 2，弹簧极限为至少40kgf / mm2，应力松弛不大于10％，电导率至少为30％IACS。 端子弹簧部分或其整个部分由该铜基合金制成，其具有0.2-3kgf的插入/拉伸力和在低电压和电流下不超过3m欧姆电阻作为初始性能，其中 还提供了终端将经历不超过20％的应力松弛的特征。 在拉伸强度，弹簧极限，应力松弛特性和导电性方面，该合金优于常规的青铜，磷青铜和Cu-Sn-Fe-P合金，因此，由这些合金制造的端子具有更高的性能和 可靠性高于由常规铜基合金端子制成的端子。
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