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公开(公告)号：US20110073359A1
公开(公告)日：2011-03-31
申请号：US12570029
申请日：2009-09-30
CPC分类号： H05K3/0094 , H05K1/0234 , H05K1/0242 , H05K1/0251 , H05K1/09 , H05K1/167 , H05K3/0047 , H05K3/244 , H05K3/429 , H05K2201/0391 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T156/1057 , Y10T428/12528
摘要： Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper.
摘要翻译： 描述了例如多层印刷电路板（“PCB”），以及制造和使用这种包括层压层的PCB的方法; 穿过层压体层的至少一个通孔，以及包含在通孔内的通孔导体，所述通孔导体包括使用部分和未使用部分，所述通孔导体包括涂覆有电导率低于 铜。
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12.发明申请公开(公告)号：US20110023007A1
公开(公告)日：2011-01-27
申请号：US12507992
申请日：2009-07-23
申请人： Robert B. Chumbley , Jacob D. Eisinger , Travis M. Grigsby , Christopher M. Laffoon , Rohan U. Mandrekar
发明人： Robert B. Chumbley , Jacob D. Eisinger , Travis M. Grigsby , Christopher M. Laffoon , Rohan U. Mandrekar
IPC分类号： G06F9/44
摘要： Systems, methods, and articles of manufacture for facilitating workflow control for a document. In one embodiment, a portion of computer program source code is associated with a workflow. The computer program is monitored for reference to or by the portion of the computer program source code. In response to a reference to or by the computer program source code, the workflow is fired off.
摘要翻译： 用于促进文档的工作流控制的系统，方法和制品。 在一个实施例中，计算机程序源代码的一部分与工作流相关联。 监视计算机程序以引用计算机程序源代码或由计算机程序源代码的一部分引用。 响应于对计算机程序源代码的引用或响应，工作流被关闭。
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公开(公告)号：US08658911B2
公开(公告)日：2014-02-25
申请号：US13448787
申请日：2012-04-17
IPC分类号： H05K1/11
CPC分类号： H05K3/0094 , H05K1/0234 , H05K1/0242 , H05K1/0251 , H05K1/09 , H05K1/167 , H05K3/0047 , H05K3/244 , H05K3/429 , H05K2201/0391 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T156/1057 , Y10T428/12528
摘要： Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper.
摘要翻译： 描述了例如多层印刷电路板（“PCB”），以及制造和使用这种包括层压层的PCB的方法; 穿过层压体层的至少一个通孔，以及包含在通孔内的通孔导体，所述通孔导体包括使用部分和未使用部分，所述通孔导体包括涂覆有电导率低于 铜。
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公开(公告)号：US08242384B2
公开(公告)日：2012-08-14
申请号：US12570029
申请日：2009-09-30
IPC分类号： H05K1/11
CPC分类号： H05K3/0094 , H05K1/0234 , H05K1/0242 , H05K1/0251 , H05K1/09 , H05K1/167 , H05K3/0047 , H05K3/244 , H05K3/429 , H05K2201/0391 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , Y10T29/49165 , Y10T156/1057 , Y10T428/12528
摘要： Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of making and using such PCBs that include layers of laminate; at least one via hole traversing the layers of laminate, and a via conductor contained within the via hole, the via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a metal having a conductivity lower than the conductivity of copper.
摘要翻译： 描述了例如多层印刷电路板（“PCB”），以及制造和使用这种包括层压层的PCB的方法; 穿过层压体层的至少一个通孔，以及包含在通孔内的通孔导体，所述通孔导体包括使用部分和未使用部分，所述通孔导体包括涂覆有电导率低于 铜。
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