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公开(公告)号：US11877402B2
公开(公告)日：2024-01-16
申请号：US18086848
申请日：2022-12-22
IPC分类号： H05K3/20 , H05K3/38 , B41M1/12 , H01L31/0224 , H05K3/34 , H05K1/03 , H05K1/09 , H01L31/0216 , H01L31/0392 , H01L31/20 , H05K1/16
CPC分类号： H05K3/207 , B41M1/12 , H01L31/02167 , H01L31/022425 , H01L31/022433 , H01L31/03926 , H01L31/206 , H05K1/0393 , H05K1/092 , H05K3/3485 , H05K3/386 , H05K1/165 , H05K2201/0195 , H05K2201/035 , H05K2201/0338 , H05K2201/0391 , H05K2201/10098 , H05K2203/0139 , H05K2203/1105 , H05K2203/1131 , H05K2203/1476 , H05K2203/1545 , Y02E10/50
摘要： A method is disclosed for applying an electrical conductor to a solar cell, which comprises providing a flexible membrane with a pattern of groove formed on a first surface thereof, and loading the grooves with a composition comprising conductive particles. The composition is, or may be made, electrically conductive. Once the membrane is loaded, the grooved first surface of the membrane is brought into contact with a front or/and back of a solar cell. A pressure is then applied between the solar cell and the membrane(s) so that the composition loaded to the grooves adheres to the solar cell. The membrane(s) and the solar cell are separated and the composition in the groove is left on the solar cell surface. The electrically conductive particles in the composition are then sintered or otherwise fused to form a pattern of electrical conductor on the solar cell, the pattern corresponding to the pattern formed in the membrane(s).
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公开(公告)号：US20190239351A1
公开(公告)日：2019-08-01
申请号：US16381708
申请日：2019-04-11
IPC分类号： H05K1/03 , C08K7/00 , H05K3/00 , H05K1/09 , H01L23/538 , C09D183/04 , G06F1/16 , C08K3/08 , H05K1/02 , H05K3/28 , C09D5/24
CPC分类号： H05K1/0393 , C08K3/08 , C08K7/00 , C08K2003/0806 , C08K2201/001 , C08K2201/011 , C09D5/24 , C09D183/04 , G06F1/1669 , H01L23/5386 , H01L23/5387 , H05K1/028 , H05K1/0313 , H05K1/09 , H05K1/148 , H05K3/0014 , H05K3/285 , H05K2201/0245 , H05K2201/026 , H05K2201/0391 , H05K2203/0776
摘要： One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.
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公开(公告)号：US09955577B2
公开(公告)日：2018-04-24
申请号：US15133352
申请日：2016-04-20
发明人： Youngjin Cho , Hyeon Cheol Park , Kwanghee Kim , Weonho Shin , Daejin Yang
CPC分类号： H05K1/09 , G06F3/041 , G06F3/047 , G06F2203/04102 , H01B1/02 , H01B1/023 , H01B1/026 , H01B1/16 , H01L51/5206 , H01L51/5234 , H01L2251/301 , H01L2251/5338 , H05K1/0274 , H05K2201/0108 , H05K2201/0323 , H05K2201/0338 , H05K2201/0373 , H05K2201/0379 , H05K2201/0391 , H05K2201/09681 , H05K2201/10128
摘要： A conductive component including: a substrate, a first layer comprising a plurality of island structures disposed on the substrate, wherein the island structures include graphene; and a second layer disposed on the first layer, wherein the second layer includes a plurality of conductive nanowires. Also, an electronic device including the conductive component.
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公开(公告)号：US09872390B1
公开(公告)日：2018-01-16
申请号：US15239645
申请日：2016-08-17
CPC分类号： H05K1/14 , H01L21/486 , H01L23/49872 , H01L23/5387 , H05K1/0283 , H05K1/0296 , H05K1/0393 , H05K3/107 , H05K3/28 , H05K2201/032 , H05K2201/0391 , H05K2201/10977 , H05K2203/1305
摘要： One example provides a flexible electrical interconnect comprising a substrate, a liquid conductive pathway supported by the substrate, and a conductively anisotropic, magnetic particle-embedded encapsulant that interfaces with the liquid conductive pathway for connecting to another circuit element.
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公开(公告)号：US09860987B2
公开(公告)日：2018-01-02
申请号：US14689528
申请日：2015-04-17
申请人： Deere & Company
IPC分类号： H05K1/18 , H05K1/11 , H01L23/473 , H01L23/40
CPC分类号： H05K1/181 , H01L23/473 , H01L2023/4043 , H01L2023/4056 , H05K1/0203 , H05K1/0265 , H05K1/111 , H05K1/184 , H05K2201/0391
摘要： An electronic assembly comprises a semiconductor device that has conductive pads on a semiconductor first side and a metallic region on a semiconductor second side opposite the first side. A lead frame provides respective separate terminals that are electrically and mechanically connected to corresponding conductive pads. A first heat sink comprises a first component having a mating side. A portion of the mating side is directly bonded with the metallic region of the semiconductor device. A circuit board has an opening for receiving the semiconductor device. The lead frame extends outward toward the circuit board or a board first side of the circuit board.
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公开(公告)号：US09826629B2
公开(公告)日：2017-11-21
申请号：US14729806
申请日：2015-06-03
发明人： Won Il Choi , Jong Ho Hong
CPC分类号： H05K1/0283 , H05K2201/0311 , H05K2201/0323 , H05K2201/0329 , H05K2201/0373 , H05K2201/0391 , H05K2201/09263 , H05K2201/09272 , H05K2201/09736
摘要： An electronic device including a stretchable/contractible base and a wiring formed on the base, the wiring being divided into a first region having a shape extending in a proceeding direction and a second region in which the proceeding direction is curved. The wiring includes a first conductive layer and a second conductive layer formed of a material that makes the second conductive layer easier to be curved than the first conductive layer. The first conductive layer is formed in the first region and the second conductive layer is formed in the second region.
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公开(公告)号：US20170311446A1
公开(公告)日：2017-10-26
申请号：US15253615
申请日：2016-08-31
发明人： Simon DODD , Roberto BRIOSCHI
CPC分类号： H05K1/181 , B81C1/0023 , H01L2924/1461 , H05K1/0272 , H05K1/0293 , H05K1/0306 , H05K1/111 , H05K3/10 , H05K3/4007 , H05K2201/0175 , H05K2201/0338 , H05K2201/0391 , H05K2201/09727 , H05K2201/09763 , H05K2201/09827 , H05K2201/10083 , H05K2201/10159 , H05K2201/10181 , H05K2203/171 , H05K2203/175
摘要： The present disclosure is directed to a ceramic substrate that includes a plurality of contact pads, a plurality of electrical traces, and a microelectromechanical die. Contacts on the die are coupled to the plurality of contact pads through the plurality of electrical traces. The substrate also includes a plurality of memory bits formed directly on the substrate. Each memory bit is coupled between a first one of the contact pads and a second one of the contact pads.
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公开(公告)号：US09622344B2
公开(公告)日：2017-04-11
申请号：US14391748
申请日：2013-02-28
发明人： Tatsuo Inoue , Takayasu Sugai , Toshiyuki Kudo , Toshinori Omori
CPC分类号： H05K1/0298 , H05K1/0233 , H05K1/0242 , H05K1/025 , H05K1/09 , H05K3/46 , H05K2201/0154 , H05K2201/0338 , H05K2201/0391 , H05K2201/0776 , H05K2201/0792 , H05K2201/083 , Y10T29/49155
摘要： A multi-layer wiring board includes wiring layers stacked on a substrate with an insulating layer between each layer. A wire formed in the wiring layer consists of a first layer and a second layer to form a double layered structure. The first layer is made of a first conductive material and the second layer is made of a second conductive material having relative magnetic permeability of 10 or more and larger than that of the first conductive material. The characteristic impedance of the wire is adjusted to a value closer to 50 ohms than that of a wire which has the same thickness as of the wire with the double layered structure, and is made only of the first conductive material.
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公开(公告)号：US09490236B2
公开(公告)日：2016-11-08
申请号：US14882574
申请日：2015-10-14
发明人： Makoto Agatani , Toshio Hata , Tomokazu Nada , Shinya Ishizaki
IPC分类号： H01L51/50 , H01L51/52 , H01L25/075 , H01L33/62 , F21K99/00 , H05K1/11 , F21V23/06 , H01L33/54 , H01L33/48 , H01L33/52 , F21Y101/02 , F21Y105/00
CPC分类号： H01L25/0753 , F21K9/00 , F21K9/232 , F21V23/06 , F21Y2101/00 , F21Y2105/10 , F21Y2115/10 , H01L33/483 , H01L33/52 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H01L2924/01327 , H01L2933/0066 , H05K1/11 , H05K2201/0391 , H05K2201/094 , H05K2201/0979 , H05K2201/10106 , H01L2924/00014 , H01L2924/00
摘要： A light-emitting device capable of ensuring an electric connection between a light-emitting element and an electrode without generating any problem in practical use, by both connecting methods with a solder and a connector, and a lighting device provided with the light-emitting device are provided. The light-emitting device according to the present invention has a plurality of LED chips, and a soldering electrode land and a connector connecting electrode land electrically connected to the chips, on a ceramic substrate. The soldering electrode land is formed of a first conductive material having a function to prevent diffusion to a solder, and the connector connecting electrode land is formed of a second conductive material having a function to prevent oxidation.
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公开(公告)号：US09351402B2
公开(公告)日：2016-05-24
申请号：US14554334
申请日：2014-11-26
CPC分类号： H05K1/111 , H01L21/4846 , H01L23/49811 , H01L24/16 , H01L24/81 , H01L2224/16237 , H01L2224/81191 , H01L2224/81385 , H01L2224/82385 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H05K3/107 , H05K3/184 , H05K3/38 , H05K2201/0373 , H05K2201/0391 , H05K2201/09736 , H05K2201/2072 , H05K2203/0307 , H05K2203/0565 , Y02P70/611 , Y10T29/49155 , H01L2924/00
摘要： A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is embedded in a circuit recess formed in the surface of the insulating base substrate, and the surface roughness of the conductor is different in the wiring section and the pad section of the electric circuit. In this case, it is preferable that the surface roughness of the conductor in the pad section is greater than the surface roughness of the conductor in the wiring section.
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