公开(公告)号：US11854852B2

公开(公告)日：2023-12-26

申请号：US16818222

申请日：2020-03-13

Applicant: LG ELECTRONICS INC.

Inventor： Inbum Yang ,  Junghun Rho ,  Imdeok Jung ,  Bongwoon Choi

IPC: H01L21/68 ,  H01L21/677 ,  H01L25/075 ,  H01L33/00

CPC classification number: H01L21/68 ,  H01L21/67709 ,  H01L25/0753 ,  H01L33/0095 ,  H01L2933/005

Abstract: Discussed is a substrate chuck including: a substrate support part for supporting a substrate having an assembly electrode; a vertical moving part which moves the substrate so that one surface of the substrate comes in contact with a fluid in a state in which the substrate is supported by the substrate support; an electrode connection part for applying power to the assembly electrode to generate an electric field so that semiconductor light-emitting diodes are placed at the predetermined positions of the substrate in a process of moving the semiconductor light-emitting diodes by a position change of at least one magnet; and a rotating part for rotating the substrate support part around a rotating shaft so that the substrate is placed in an upward or downward direction, wherein the rotating shaft is spaced apart from a center of the substrate support part at a predetermined distance.

公开(公告)号：US11410864B2

公开(公告)日：2022-08-09

申请号：US16842347

申请日：2020-04-07

Applicant: LG ELECTRONICS INC.

Inventor： Inbum Yang ,  Junghun Rho ,  Imdeok Jung ,  Bongwoon Choi

IPC: H01L21/67 ,  H01L21/683 ,  H01L25/075 ,  H01L33/32

Abstract: Discussed is a device for self-assembling semiconductor light-emitting diodes includes a substrate chuck that is provided in an assembly chamber and supports a substrate and disposes the substrate at an assembly position, wherein the substrate chuck sucks or injects a gas present between the substrate and a fluid during loading and unloading of the substrate.