公开(公告)号：US11814172B2

公开(公告)日：2023-11-14

申请号：US17360814

申请日：2021-06-28

Applicant: Lockheed Martin Corporation

Inventor： Marc T. Angelucci

IPC: B64C39/02 ,  B64C27/08 ,  B64U10/14 ,  B64U20/87 ,  B64U30/297 ,  B64U10/13 ,  B64U30/20 ,  B64U50/19 ,  B64U70/00

CPC classification number: B64C39/024 ,  B64C27/08 ,  B64U10/14 ,  B64U20/87 ,  B64U30/297 ,  B64U10/13 ,  B64U30/20 ,  B64U50/19 ,  B64U70/00 ,  B64U2201/10

Abstract: The present disclosure is directed to unmanned aerial vehicle (UAV) comprising a convertible body operably coupled to at least one sensor, and further configured to rotate at least about a longitudinal axis, thereby providing a full field of regard for the at least one sensor, and a plurality of arms extending laterally from the convertible body, each arm of the plurality of arms having a rotor assembly coupled thereto.

公开(公告)号：US11381044B2

公开(公告)日：2022-07-05

申请号：US16935371

申请日：2020-07-22

Applicant: LOCKHEED MARTIN CORPORATION

Inventor： Anthony Jonathan Bednarz ,  Marc T. Angelucci ,  Ilya Gershkovich ,  Mohsin Peeran ,  Robert C. Hosler

IPC: H01R24/52 ,  H01R13/193 ,  H01R103/00

Abstract: A connector block comprised of a plurality of spring-embedded blind mate connector assemblies. Each of the spring-embedded blind mate connector assemblies can be comprised of a first connector extending in a first direction and a second connector extending in a second direction opposite the first direction, where the first connector and the second connector can have a common axis and can be operatively coupled to pass a signal between opposite ends of the spring-embedded blind mate connector assembly. The first connector can include a captivator, a connection extension, and a spring between the captivator and the second connector, where the spring can abut the captivator and have an outer diameter no greater than an outer diameter of the captivator.

公开(公告)号：US20190261516A1

公开(公告)日：2019-08-22

申请号：US16404293

申请日：2019-05-06

Applicant: Lockheed Martin Corporation

Inventor： Marc T. Angelucci ,  Anthony R. Niemczyk

IPC: H05K3/10 ,  H05K3/22 ,  H01Q21/00

Abstract: A method of manufacturing an electrical circuit from bulk materials includes the steps of machining a first bulk dielectric material, forming a conductive element, and placing the conductive element on a first side the first bulk dielectric material. The method further includes the step of machining a second bulk dielectric material and placing the second bulk dielectric material on the first side of the first bulk dielectric material and over the conductive element. The first bulk dielectric material and the second bulk dielectric material may be laminated together.