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公开(公告)号：US20240195151A1
公开(公告)日：2024-06-13
申请号：US18194133
申请日：2023-03-31
发明人： Wei SHI , Joseph LEIGH , Suhit Ranjan DAS , Huanlin ZHU , Raman SRINIVASAN , Gianluca BACCHIN , Yuefa LI , Jacob U. LOPEZ RUVALCABA , Lijun ZHU , Qianhuan YU
IPC分类号： H01S5/42 , H01S5/0234 , H01S5/0237
CPC分类号： H01S5/423 , H01S5/0234 , H01S5/0237
摘要： In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs. The emitter assembly may include a plurality of conductive pillars electrically connected to the VCSEL chip. The emitter assembly may include a dummy pillar, electrically isolated from the VCSEL chip, mating with a slot. The VCSEL chip may include one of the dummy pillar or the slot.
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12.发明公开公开(公告)号：US20240195145A1
公开(公告)日：2024-06-13
申请号：US18194123
申请日：2023-03-31
发明人： Wei SHI , Joseph LEIGH , Eric R. HEGBLOM , Suhit Ranjan DAS , Huanlin ZHU , Raman SRINIVASAN , Gianluca BACCHIN , Yuefa LI , Jacob U. LOPEZ RUVALCABA , Lijun ZHU , Qianhuan YU
IPC分类号： H01S5/0239 , H01S5/0234 , H01S5/0237 , H01S5/02375 , H01S5/183 , H01S5/42
CPC分类号： H01S5/0239 , H01S5/0234 , H01S5/0237 , H01S5/02375 , H01S5/18305 , H01S5/423
摘要： In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs respectively associated with a plurality of first electrical contacts. A first spacing of the plurality of first electrical contacts may define a first pitch. The emitter assembly may include a redistribution layer, disposed on the VCSEL chip, to increase the first pitch of the plurality of first electrical contacts. The emitter assembly may include a carrier having a plurality of second electrical contacts. A second spacing of the plurality of second electrical contacts may define a second pitch greater than the first pitch. The emitter assembly may include a plurality of conductive pillars that electrically connect the plurality of first electrical contacts and the plurality of second electrical contacts via the redistribution layer. The plurality of conductive pillars may be arranged according to the second spacing.
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公开(公告)号：US20230047740A1
公开(公告)日：2023-02-16
申请号：US17449612
申请日：2021-09-30
发明人： Siu Kwan CHEUNG , Wei SHI , Hao HUANG , Lijun ZHU , Huanlin ZHU
摘要： In some implementations, a vertical cavity surface emitting laser (VCSEL) package may include a substrate. The VCSEL package may include a VCSEL disposed on a surface of the substrate. The VCSEL package may include a VCSEL driver disposed on the surface of the substrate. The VCSEL package may include an embedded capacitor electrically connected to the VCSEL and the VCSEL driver. The embedded capacitor may be formed from a subset of layers of the substrate. The capacitor may be associated with a first capacitance that is different from a second capacitance of at least one other capacitor associated with the substrate.
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公开(公告)号：US20230027279A1
公开(公告)日：2023-01-26
申请号：US17449386
申请日：2021-09-29
发明人： Wei SHI , Kevin WANG , Hao HUANG , John Michael MILLER , Siu Kwan CHEUNG , Lijun ZHU
摘要： In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.
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