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公开(公告)号：US20240348008A1
公开(公告)日：2024-10-17
申请号：US18335937
申请日：2023-06-15
IPC分类号： H01S5/042 , H01S5/02315 , H01S5/0234 , H01S5/183 , H01S5/42 , H05K1/02
CPC分类号： H01S5/04256 , H01S5/02315 , H01S5/0234 , H01S5/18305 , H01S5/423 , H05K1/0218
摘要： In some implementations, a vertical cavity surface emitting laser (VCSEL) device includes a substrate and a plurality of VCSELs on the substrate. The VCSEL device may include an anode layer on the substrate and electrically connected to the plurality of VCSELs. The VCSEL device may include a cathode electrode over at least a portion of one or more VCSELs, of the plurality of VCSELs, and electrically connected to the one or more VCSELs. The VCSEL device may include a ground layer electrically isolated from the at least one anode layer and the cathode electrode by one or more isolation layers, wherein the ground layer is on the anode layer and the cathode electrode, between the anode layer and the cathode electrode, or underneath the anode layer.
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公开(公告)号：US20240195152A1
公开(公告)日：2024-06-13
申请号：US18194143
申请日：2023-03-31
发明人： Wei SHI , Joseph LEIGH , Suhit Ranjan DAS , Huanlin ZHU , Raman SRINIVASAN , Gianluca BACCHIN , Yuefa LI , Jacob U. LOPEZ RUVALCABA , Lijun ZHU , Qianhuan YU
IPC分类号： H01S5/42 , H01S5/0234 , H01S5/0237
CPC分类号： H01S5/423 , H01S5/0234 , H01S5/0237
摘要： In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs. The emitter assembly may include a plurality of conductive pillars electrically connected to the VCSEL chip, and a conductive pillar, of the plurality of conductive pillars, may have a solder cap at an end of the conductive pillar. The emitter assembly may include a pin extending into the solder cap.
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公开(公告)号：US20240195153A1
公开(公告)日：2024-06-13
申请号：US18194156
申请日：2023-03-31
发明人： Wei SHI , Joseph LEIGH , Suhit Ranjan DAS , Huanlin ZHU , Raman SRINIVASAN , Gianluca BACCHIN , Yuefa LI , Jacob U. LOPEZ RUVALCABA , Lijun ZHU , Qianhuan YU
IPC分类号： H01S5/42 , H01S5/0234 , H01S5/0237 , H01S5/024 , H01S5/183
CPC分类号： H01S5/423 , H01S5/0234 , H01S5/0237 , H01S5/02469 , H01S5/18305
摘要： In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs in a bottom-emitting configuration, and multiple VCSELs, of the plurality of VCSELs, may be grouped in a cluster. The emitter assembly may include a carrier, and the VCSEL chip may be in a flip chip configuration with the carrier. The emitter assembly may include a conductive pillar electrically connected to the multiple VCSELs grouped in the cluster.
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公开(公告)号：US20240195151A1
公开(公告)日：2024-06-13
申请号：US18194133
申请日：2023-03-31
发明人： Wei SHI , Joseph LEIGH , Suhit Ranjan DAS , Huanlin ZHU , Raman SRINIVASAN , Gianluca BACCHIN , Yuefa LI , Jacob U. LOPEZ RUVALCABA , Lijun ZHU , Qianhuan YU
IPC分类号： H01S5/42 , H01S5/0234 , H01S5/0237
CPC分类号： H01S5/423 , H01S5/0234 , H01S5/0237
摘要： In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs. The emitter assembly may include a plurality of conductive pillars electrically connected to the VCSEL chip. The emitter assembly may include a dummy pillar, electrically isolated from the VCSEL chip, mating with a slot. The VCSEL chip may include one of the dummy pillar or the slot.
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5.发明公开公开(公告)号：US20240195145A1
公开(公告)日：2024-06-13
申请号：US18194123
申请日：2023-03-31
发明人： Wei SHI , Joseph LEIGH , Eric R. HEGBLOM , Suhit Ranjan DAS , Huanlin ZHU , Raman SRINIVASAN , Gianluca BACCHIN , Yuefa LI , Jacob U. LOPEZ RUVALCABA , Lijun ZHU , Qianhuan YU
IPC分类号： H01S5/0239 , H01S5/0234 , H01S5/0237 , H01S5/02375 , H01S5/183 , H01S5/42
CPC分类号： H01S5/0239 , H01S5/0234 , H01S5/0237 , H01S5/02375 , H01S5/18305 , H01S5/423
摘要： In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs respectively associated with a plurality of first electrical contacts. A first spacing of the plurality of first electrical contacts may define a first pitch. The emitter assembly may include a redistribution layer, disposed on the VCSEL chip, to increase the first pitch of the plurality of first electrical contacts. The emitter assembly may include a carrier having a plurality of second electrical contacts. A second spacing of the plurality of second electrical contacts may define a second pitch greater than the first pitch. The emitter assembly may include a plurality of conductive pillars that electrically connect the plurality of first electrical contacts and the plurality of second electrical contacts via the redistribution layer. The plurality of conductive pillars may be arranged according to the second spacing.
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