SEMICONDUCTOR DEVICE AND INTERCONNECT STRUCTURE AND THEIR RESPECTIVE FABRICATING METHODS
    11.
    发明申请
    SEMICONDUCTOR DEVICE AND INTERCONNECT STRUCTURE AND THEIR RESPECTIVE FABRICATING METHODS 审中-公开
    半导体器件和互连结构及其相关的制作方法

    公开(公告)号:US20070099328A1

    公开(公告)日:2007-05-03

    申请号:US11163812

    申请日:2005-10-31

    IPC分类号: H01L21/00

    CPC分类号: H01L27/14689 H01L21/76804

    摘要: A semiconductor device is described, including a substrate, a transistor, a hard mask layer and an anti-reflection layer. The substrate includes a first area and a second area, wherein the second area includes a photosensing area. The transistor is disposed on the substrate in the first area and the hard mask layer over the substrate in the second area. The anti-reflection layer is disposed between the hard mask layer and the substrate.

    摘要翻译: 描述了一种半导体器件,包括衬底,晶体管,硬掩模层和抗反射层。 衬底包括第一区域和第二区域,其中第二区域包括光敏区域。 晶体管设置在第一区域的基板上,第二区域中设置在基板上的硬掩模层。 防反射层设置在硬掩模层和基板之间。

    Method of fabricating metal oxide semiconductor transistor
    13.
    发明授权
    Method of fabricating metal oxide semiconductor transistor 有权
    制造金属氧化物半导体晶体管的方法

    公开(公告)号:US08076194B2

    公开(公告)日:2011-12-13

    申请号:US12781826

    申请日:2010-05-18

    IPC分类号: H01L21/8238

    摘要: A method of fabricating a MOS transistor is disclosed. The method includes the steps of: providing a semiconductor substrate; forming at least a gate on the semiconductor substrate; forming a protective layer on the semiconductor substrate, and the protective layer covering the surface of the gate; forming at least a recess within the semiconductor substrate adjacent to the gate; forming an epitaxial layer in the recess, wherein the top surface of the epitaxial layer is above the surface of the semiconductor substrate; and forming a spacer on the sidewall of the gate and on a portion of the epitaxial layer, wherein a contact surface of the epitaxial layer and the spacer is above the surface of the semiconductor substrate.

    摘要翻译: 公开了制造MOS晶体管的方法。 该方法包括以下步骤:提供半导体衬底; 在所述半导体衬底上形成至少栅极; 在所述半导体衬底上形成保护层,所述保护层覆盖所述栅极表面; 在所述半导体衬底内至少形成与所述栅极相邻的凹部; 在所述凹部中形成外延层,其中所述外延层的顶表面在所述半导体衬底的表面之上; 以及在所述栅极的侧壁和所述外延层的一部分上形成间隔物,其中所述外延层和所述间隔物的接触表面在所述半导体衬底的表面之上。