公开(公告)号：US12114416B2

公开(公告)日：2024-10-08

申请号：US17517693

申请日：2021-11-03

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Elad Mentovich ,  Anna Sandomirsky ,  Dimitrios Kalavrouziotis

IPC: H05K1/02 ,  H01L23/367 ,  H01L23/38 ,  H05K1/18 ,  H05K3/30 ,  H01L23/13 ,  H10N10/13

CPC classification number: H05K1/0206 ,  H01L23/367 ,  H01L23/38 ,  H05K1/0298 ,  H05K1/183 ,  H05K3/30 ,  H01L23/13 ,  H10N10/13

Abstract: A semiconductor device assembly (10) includes a multi-layer printed circuit board (PCB—40), a thermoelectric cooler (TEC—30), a chip (22), and packaged integrated circuitry (IC—26). The multi-layer PCB includes a lateral heat conducting path (60) formed in a recessed area (44) of the PCB. The TEC and the chip are disposed on the PCB, side-by-side to one another over the lateral heat conducting path. The TEC is configured to evacuate heat from the chip via the lateral heat conducting path, and to dissipate the evacuated heat via a first end of a heat sink (33) in thermal contact with the TEC. The packaged IC is disposed on an un-recessed area of the PCB, wherein the packaged IC is configured to dissipate heat via a second end of the heat sink that is in thermal contact with the packaged IC.

公开(公告)号：US20230305250A1

公开(公告)日：2023-09-28

申请号：US17660348

申请日：2022-04-22

Applicant: Mellanox Technologies, Ltd.

Inventor： Elad Mentovich ,  Paraskevas Bakopoulos ,  Boaz Atias ,  Anna Sandomirsky ,  James Steven Fields, JR. ,  Dimitrios Kalavrouziotis

IPC: G02B6/43 ,  G02B6/42

CPC classification number: G02B6/43 ,  G02B6/428

Abstract: An optoelectronic component may include a substrate, an electronic integrated circuit supported by the substrate, and a photonic integrated circuit supported by the substrate. The optoelectronic component may include a plurality of substrate interconnect connectors disposed on the substrate, a plurality of electronic integrated circuit interconnect connectors disposed on the electronic integrated circuit, and a plurality of photonic integrated circuit interconnect connectors disposed on the photonic integrated circuit. The optoelectronic component may include a first plurality of cable connectors, each cable connector connected to the substrate, the electronic integrated circuit, and the photonic integrated circuit via respective interconnect connectors. The first plurality of cable connectors may be configured to facilitate electrical communication between the substrate, the electronic integrated circuit, and the photonic integrated circuit. The first plurality of cable connectors may define a first layout, and an overall connectivity of the optoelectronic component may correspond to the first layout.

公开(公告)号：US11487066B2

公开(公告)日：2022-11-01

申请号：US17117867

申请日：2020-12-10

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Elad Mentovich ,  Yaakov Gridish ,  Anna Sandomirsky ,  Alon Rubinstein ,  Nimrod Rockman ,  Dimitrios Kalavrouziotis

IPC: G02B6/42 ,  H04B10/25 ,  H04B10/40

Abstract: A package includes a light emitting portion configured to emit light, a lens including a first lens surface and a second lens surface, a protective layer between the light emitting portion and the first lens surface and that shields the first lens surface from a surrounding environment, and an optical component that redirects light output from the second lens surface. The first lens surface is configured to receive the emitted light from the light emitting portion, the second lens surface is configured output light that has passed through the first lens surface, and the protective layer has a refractive index greater than 1.5.

公开(公告)号：US10855331B1

公开(公告)日：2020-12-01

申请号：US16685400

申请日：2019-11-15

Applicant: Mellanox Technologies, Ltd.

Inventor： Elad Mentovich ,  Anna Sandomirsky ,  Itshak Kalifa ,  Boaz Atias ,  Eyal Babish

IPC: H04B3/00 ,  H04L25/00 ,  H04B3/02 ,  H01R13/66 ,  H01B1/02

Abstract: Apparatuses, systems, and associated methods are described that provide signal transmission over copper media. An example module includes a number of electrical signal generators that each generate an electrical signal, and a signal modulation system that receives the electrical signals generated by the electrical signal generators. The signal modulation system further modulates each of the electrical signals such that each modulated electrical signal is distinguishable from the other modulated electrical signals. The module further includes an active copper multiplexer in electrical communication with the electrical signal generators that receives the modulated electrical signals from the signal modulation system. The active copper multiplexer further combines the multiple modulated signals into a single combined electrical signal and transmits the single combined electrical signal through a single copper cable.

公开(公告)号：US10088639B2

公开(公告)日：2018-10-02

申请号：US15195538

申请日：2016-06-28

Applicant: Mellanox Technologies, Ltd.

Inventor： Elad Mentovich ,  Itshak Kalifa ,  Sylvie Rockman ,  Alon Webman ,  Amir Prescher ,  Evelyn Landman ,  Anna Sandomirsky ,  Eitan Zahavi ,  Yaakov Gridish

IPC: G02B6/42 ,  G02B6/32 ,  G02B6/43

Abstract: An opto-mechanical coupler and corresponding method are provided. The coupler may include a first end and a second end configured to receive optical fibers and a top surface and bottomed surface defining a through hole extending between the top and bottom surfaces. The coupler may include a reflective surface that redirects the optical signals between a first direction and a second direction substantially perpendicular to the first direction. The coupler may position one or more optical fibers along a second direction such that an optical signal from the plurality of optoelectronic transceivers is directed into one or more optical fibers or an optical signal from the one or more optical fibers is directed into a plurality of the optoelectronic transceivers, with the coupler accommodating different diameters of optical fiber including POF, SMF, and/or MMF fiber.

公开(公告)号：US20170363823A1

公开(公告)日：2017-12-21

申请号：US15187109

申请日：2016-06-20

Applicant: Mellanox Technologies, Ltd.

Inventor： Elad Mentovich ,  Itshak Kalifa ,  Sylvie Rockman ,  Pierre Avner Badehi ,  Anna Sandomirsky ,  Evelyn Landman

IPC: G02B6/42 ,  G02B6/12

CPC classification number: G02B6/4245 ,  G02B6/12004 ,  G02B6/4206 ,  G02B6/428 ,  G02B6/4284

Abstract: An apparatus and method of assembly are described that provide an improved printed circuit board (PCB) assembly for an electro-optical interface, where more accurate positioning and alignment of electro-optical components can be achieved in an active part of the PCB assembly that is used for the electro-optical interface to meet tighter tolerances in an easier and more cost efficient manner. In particular, a photonic integrated circuit (PIC) is received in a cavity defined in a PCB that includes conductive elements for transmitting electrical signals. An optoelectronic transducer is connected to the PIC to convert between the optical signals and the corresponding electrical signals, and an optical coupler is secured to the optoelectronic transducer and supported by the PIC and/or PCB, where the optical coupler is configured to transmit the optical signals between the optoelectronic transducer and an optical fiber.