Testing semiconductor devices based on warpage and associated methods

    公开(公告)号:US11127612B2

    公开(公告)日:2021-09-21

    申请号:US15962648

    申请日:2018-04-25

    Abstract: Several embodiments of the present technology are directed to semiconductor devices, and systems and associated methods for treating semiconductor devices based on warpage data. In some embodiments, a method can include heating a plurality of semiconductor devices from a first temperature to a second temperature, and determining warpage data at a plurality of points on the surfaces of the semiconductor devices as they are being heated. The method can further comprise applying a multivariate analysis to the surface warpage data to generate a multivariate statistic for each of the semiconductor devices at various sample temperatures. The multivariate statistics can be used to determine whether the semiconductor devices exceed or fall below a threshold limit.

    APPARATUSES AND METHODS FOR INTERFACING ON-MEMORY PATTERN MATCHING

    公开(公告)号:US20210263847A1

    公开(公告)日:2021-08-26

    申请号:US16800356

    申请日:2020-02-25

    Abstract: Embodiments of the disclosure are drawn to apparatuses, systems, methods, and memories that are capable of performing pattern matching operations within a memory device. The pattern matching operations may be performed on data stored within the memory based on a pattern stored in a register. The result of the pattern matching operation may be provided by the memory. The data may be retrieved from a memory array for the pattern matching operation by a read operation, a refresh operation, an error correction operation, and/or a pattern matching operation. The data may be retrieved from incoming data input lines instead of or in addition to the memory array. How the data is stored or retrieved for pattern matching operations may be controlled by a memory controller.

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