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    METHOD OF FORMING A SEMICONDUCTOR STRUCTURE COMPRISING A FIELD EFFECT TRANSISTOR HAVING A STRESSED CHANNEL REGION
    11.
    发明申请
    METHOD OF FORMING A SEMICONDUCTOR STRUCTURE COMPRISING A FIELD EFFECT TRANSISTOR HAVING A STRESSED CHANNEL REGION 有权
    形成具有应力通道区域的场效应晶体管的半导体结构的方法

    公开(公告)号：US20080102590A1

    公开(公告)日：2008-05-01

    申请号：US11750816

    申请日：2007-05-18

    申请人： Andreas Gehring ,  Andy Wei ,  Anthony Mowry ,  Manuj Rathor

    发明人： Andreas Gehring ,  Andy Wei ,  Anthony Mowry ,  Manuj Rathor

    IPC分类号： H01L21/336 ,  H01L21/428

    CPC分类号： H01L29/7833 ,  H01L21/268 ,  H01L21/823807 ,  H01L29/6656 ,  H01L29/6659 ,  H01L29/7843

    摘要： A method of forming a semiconductor structure comprises providing a semiconductor substrate comprising a first transistor element and a second transistor element. The first transistor element comprises at least one first amorphous region and the second transistor element comprises at least one second amorphous region. A stress-creating layer is formed over the first transistor element. The stress-creating layer does not cover the second transistor element. A first annealing process is performed. The first annealing process is adapted to re-crystallize the first amorphous region and the second amorphous region. After the first annealing process, a second annealing process is performed. The stress-creating layer remains on the semiconductor substrate during the second annealing process.

    摘要翻译： 形成半导体结构的方法包括提供包括第一晶体管元件和第二晶体管元件的半导体衬底。 第一晶体管元件包括至少一个第一非晶区，而第二晶体管元件包括至少一个第二非晶区。 应力产生层形成在第一晶体管元件上。 应力产生层不覆盖第二晶体管元件。 执行第一退火处理。 第一退火工艺适于重新结晶第一非晶区域和第二非晶区域。 在第一退火处理之后，进行第二退火处理。 应力产生层在第二退火工艺期间保留在半导体衬底上。

    SOI device having a substrate diode with process tolerant configuration and method of forming the SOI device
    13.
    发明授权
    SOI device having a substrate diode with process tolerant configuration and method of forming the SOI device 有权
    SOI器件具有具有工艺容限配置的衬底二极管和形成SOI器件的方法

    公开(公告)号：US07943442B2

    公开(公告)日：2011-05-17

    申请号：US11862296

    申请日：2007-09-27

    申请人： Andreas Gehring ,  Jan Hoentschel ,  Andy Wei

    发明人： Andreas Gehring ,  Jan Hoentschel ,  Andy Wei

    IPC分类号： H01L21/84

    CPC分类号： H01L21/8221 ,  H01L21/823481 ,  H01L21/823835 ,  H01L21/84 ,  H01L27/0688 ,  H01L27/1203 ,  H01L27/1207 ,  H01L29/66128 ,  H01L29/8611

    摘要： A substrate diode for an SOI device is formed in accordance with an appropriately designed manufacturing flow, wherein transistor performance enhancing mechanisms may be implemented substantially without affecting the diode characteristics. In one aspect, respective openings for the substrate diode may be formed after the formation of a corresponding sidewall spacer structure used for defining the drain and source regions, thereby obtaining a significant lateral distribution of the dopants in the diode areas, which may therefore provide sufficient process margins during a subsequent silicidation sequence on the basis of a removal of the spacers in the transistor devices. In a further aspect, in addition to or alternatively, an offset spacer may be formed substantially without affecting the configuration of respective transistor devices.

    摘要翻译： 根据适当设计的制造流程形成用于SOI器件的衬底二极管，其中可以基本上实现晶体管性能增强机制而不影响二极管特性。 在一个方面，用于衬底二极管的相应开口可以在形成用于限定漏极和源极区域的相应的侧壁间隔结构形成之后形成，从而获得掺杂剂在二极管区域中的显着的横向分布，这可能因此提供足够的 基于去除晶体管器件中的间隔物，在随后的硅化序列期间的工艺余量。 在另一方面，除了或者可选地，可以基本上形成偏移间隔物而不影响各个晶体管器件的配置。

    SOI device having a substrate diode with process tolerant configuration and method of forming the SOI device
    14.
    发明授权
    SOI device having a substrate diode with process tolerant configuration and method of forming the SOI device 有权
    SOI器件具有具有工艺容限配置的衬底二极管和形成SOI器件的方法

    公开(公告)号：US08377761B2

    公开(公告)日：2013-02-19

    申请号：US13081575

    申请日：2011-04-07

    申请人： Andreas Gehring ,  Jan Hoentschel ,  Andy Wei

    发明人： Andreas Gehring ,  Jan Hoentschel ,  Andy Wei

    IPC分类号： H01L21/84

    CPC分类号： H01L21/8221 ,  H01L21/823481 ,  H01L21/823835 ,  H01L21/84 ,  H01L27/0688 ,  H01L27/1203 ,  H01L27/1207 ,  H01L29/66128 ,  H01L29/8611

    摘要： A substrate diode for an SOI device is formed in accordance with an appropriately designed manufacturing flow, wherein transistor performance enhancing mechanisms may be implemented substantially without affecting the diode characteristics. In one aspect, respective openings for the substrate diode may be formed after the formation of a corresponding sidewall spacer structure used for defining the drain and source regions, thereby obtaining a significant lateral distribution of the dopants in the diode areas, which may therefore provide sufficient process margins during a subsequent silicidation sequence on the basis of a removal of the spacers in the transistor devices. In a further aspect, in addition to or alternatively, an offset spacer may be formed substantially without affecting the configuration of respective transistor devices.

    摘要翻译： 根据适当设计的制造流程形成用于SOI器件的衬底二极管，其中可以基本上实现晶体管性能增强机制而不影响二极管特性。 在一个方面，用于衬底二极管的相应开口可以在形成用于限定漏极和源极区域的相应的侧壁间隔结构形成之后形成，从而获得掺杂剂在二极管区域中的显着的横向分布，这可能因此提供足够的 基于去除晶体管器件中的间隔物，在随后的硅化序列期间的工艺余量。 在另一方面，除了或者可选地，可以基本上形成偏移间隔物而不影响各个晶体管器件的配置。