Abstract:
A method for production of a component in a tool having a cavity-forming first and a second tool half comprises the following steps: a) insertion at least of two skins with angled-over end regions into the second tool half such that the angled-over end regions of the skins are situated adjacently with the same orientation and angling; b) rear-foaming or rear-spraying of the skins with a foam material or injection moulding material, c) after insertion of the skins, the end regions of the skins being pressed together in a foam-tight or spray-fight manner at least in regions by pressing at least on one side of the end regions which are situated one above the other against a wall which determines the form and position of the pressed-together end regions.
Abstract:
By introducing additional strain-inducing mechanisms on the basis of stress memorization techniques, the performance of NMOS transistors may be significantly increased, thereby reducing the imbalance between PMOS transistors and NMOS transistors. By amorphizing and re-crystallizing the respective material in the presence of a mask layer at various stages of the manufacturing process, a drive current improvement of up to approximately 27% has been observed, with the potential for further performance gain.
Abstract:
By removing an outer spacer of a transistor element, used for the formation of highly complex lateral dopant profiles, prior to the formation of metal silicide, employing a wet chemical etch process, it is possible to position a stressed contact liner layer more closely to the channel region, thereby allowing a highly efficient stress transfer mechanism for creating a corresponding strain in the channel region, without affecting circuit elements in the P-type regions.
Abstract:
A method of forming a semiconductor structure comprises providing a semiconductor substrate comprising a first transistor element and a second transistor element. The first transistor element comprises at least one first amorphous region and the second transistor element comprises at least one second amorphous region. A stress-creating layer is formed over the first transistor element. The stress-creating layer does not cover the second transistor element. A first annealing process is performed. The first annealing process is adapted to re-crystallize the first amorphous region and the second amorphous region. After the first annealing process, a second annealing process is performed. The stress-creating layer remains on the semiconductor substrate during the second annealing process.
Abstract:
This invention relates to a method of encrypting data packets of a data stream and decrypting plurally encrypted data of a data stream that provides an increased level of data security and can be automated using a signal sequence (a computer program product) or a data processing device. A data packet to be encrypted or a data packet to be decrypted is automatically encrypted or decrypted sequentially in at least two subsequent processing steps using different coding algorithms and different assigned coding keys. For encryption, a number, type, and sequence of different coding algorithms is first determined (S10) that is to be used in the subsequent encryption operations and respective different coding keys are assigned to the coding algorithms (S12, S13). Then the data packet to be encrypted is encrypted sequentially in at least two subsequent encryption operations (S16, S17) to obtain a plurally encrypted data packet. For decryption, an unencrypted coding characteristic assigned to the plurally encrypted data packet and specifying at least one coding algorithm and an assigned coding key is detected automatically. The coding characteristic thus allows sequential decryption in at least two subsequent decryption operations.
Abstract:
This invention relates to a network component (11-16) for a communication network (1) in which multiple communication interfaces (31-37) are connected for mutual data exchange via a transmission network (20) and in which said network component (11-16) can be placed between at least one assigned communication interface (31-37) and the transmission network (20). The network component (11-16) according to the invention comprises a first memory facility (41) for storing at least one preset coding key (K1, K2, K3), a decrypter (51) for decrypting the encrypted data received via the transmission network (20) using the stored at least one coding key (K1, K2, K3) as well as a data selector (52) for the selective transfer of data between the transmission network (20) and the at least one assigned communication interface (31-37). Said data selector (52) is designed to automatically prevent transfer of encrypted data received via the transmission network (20) to the at least one assigned communication interface (31-37) if the decrypter (51) cannot decrypt the encrypted data using the at least one coding key (K1, K2, K3). The invention further relates to a respective communication network and a respective method of providing a data connection among at least two communication interfaces that can be connected via a transmission network.
Abstract:
By providing a test structure for evaluating the patterning process and/or the epitaxial growth process for forming embedded semiconductor alloys in sophisticated semiconductor devices, enhanced statistical relevance in combination with reduced test time may be accomplished.
Abstract:
A substrate diode for an SOI device is formed in accordance with an appropriately designed manufacturing flow, wherein transistor performance enhancing mechanisms may be implemented substantially without affecting the diode characteristics. In one aspect, respective openings for the substrate diode may be formed after the formation of a corresponding sidewall spacer structure used for defining the drain and source regions, thereby obtaining a significant lateral distribution of the dopants in the diode areas, which may therefore provide sufficient process margins during a subsequent silicidation sequence on the basis of a removal of the spacers in the transistor devices. In a further aspect, in addition to or alternatively, an offset spacer may be formed substantially without affecting the configuration of respective transistor devices.
Abstract:
A new technique enables providing a stress-inducing alloy having a highly stress-inducing region and a region which is processable by standard processing steps suitable for use in a commercial high volume semiconductor device manufacturing environment. The regions may be formed by a growth process with a varying composition of the growing material or by other methods such as ion implantation. The highly stress-inducing region near the channel region of a transistor may be covered with an appropriate cover.
Abstract:
By recessing portions of the drain and source areas on the basis of a spacer structure, the subsequent implantation process for forming the deep drain and source regions may result in a moderately high dopant concentration extending down to the buried insulating layer of an SOI transistor. Furthermore, the spacer structure maintains a significant amount of a strained semiconductor alloy with its original thickness, thereby providing an efficient strain-inducing mechanism. By using sophisticated anneal techniques, undue lateral diffusion may be avoided, thereby allowing a reduction of the lateral width of the respective spacers and thus a reduction of the length of the transistor devices. Hence, enhanced charge carrier mobility in combination with reduced junction capacitance may be accomplished on the basis of reduced lateral dimensions.