公开(公告)号：US20050287929A1

公开(公告)日：2005-12-29

申请号：US11217598

申请日：2005-08-31

申请人： Boguslaw Swedek ,  Manoocher Birang ,  Nils Johansson

发明人： Boguslaw Swedek ,  Manoocher Birang ,  Nils Johansson

IPC分类号： B24B37/005 ,  B24B37/04 ,  B24B49/02 ,  B24B49/10 ,  B24B49/12 ,  G01B11/06 ,  H01L21/304 ,  B24B49/00

CPC分类号： B24B37/013 ,  B24B49/02 ,  B24B49/10 ,  B24B49/12 ,  G01B7/105 ,  G01B11/0683

摘要： A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.

摘要翻译： 化学机械抛光装置和方法可以使用涡流监测系统和光学监测系统。 来自监控系统的信号可以组合在输出线上并由计算机提取。 可以计算抛光垫的厚度。 涡流监测系统和光学监测系统可以测量基板上基本相同的位置。

公开(公告)号：US20050101224A1

公开(公告)日：2005-05-12

申请号：US11016410

申请日：2004-12-17

申请人： Nils Johansson ,  Boguslaw Swedek ,  Manoocher Birang

发明人： Nils Johansson ,  Boguslaw Swedek ,  Manoocher Birang

IPC分类号： B24B1/00 ,  B24B37/013 ,  B24B49/02 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12 ,  B24B49/00

CPC分类号： B24B37/013 ,  B24B49/02 ,  B24B49/04 ,  B24B49/10 ,  B24B49/12 ,  G01B7/105

摘要： A chemical mechanical polishing apparatus has a polishing pad, a carrier to hold a substrate against a first side of the polishing surface, and a motor coupled to at least one of the polishing pad and carrier head for generating relative motion therebetween. An eddy current monitoring system is positioned to generate an alternating magnetic field in proximity to the substrate, an optical monitoring system generates a light beam and detects reflections of the light beam from the substrate, and a controller receives signals from the eddy current monitoring system and the optical monitoring system.

公开(公告)号：US20130130413A1

公开(公告)日：2013-05-23

申请号：US13745691

申请日：2013-01-18

申请人： Manoocher Birang ,  Nils Johansson ,  Allan Gleason

发明人： Manoocher Birang ,  Nils Johansson ,  Allan Gleason

IPC分类号： H01L21/66

CPC分类号： H01L22/12 ,  B24B37/013 ,  B24B37/205 ,  B24B47/12 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  G01B11/0683

摘要： An endpoint detection method includes processing an outer surface of a substrate, directing an incident light beam through a window in an opaque metal body onto the surface being processed, receiving at a detector a reflected light beam from the substrate and generating a signal from the detector, and generating a signal based on the reflected light beam received at the detector, and detecting a processing endpoint. The signal is a time-varying cyclic signal that varies as the thickness of the layer varies over time, and detecting the processing endpoint includes detecting that a portion of a cycle of the cyclic signal has passed, the portion being less than a full cycle of the cyclic signal.

摘要翻译： 端点检测方法包括处理衬底的外表面，将入射光束通过不透明金属体中的窗口引导到被处理的表面上，在检测器处接收来自衬底的反射光束，并从检测器产生信号 并且基于在检测器处接收的反射光产生信号，并且检测处理端点。 该信号是时变循环信号，其随着层的厚度随时间而变化，并且检测处理端点包括检测循环信号的周期的一部分已经过去，该部分小于全周期 循环信号。

公开(公告)号：US20130048778A1

公开(公告)日：2013-02-28

申请号：US13580874

申请日：2011-02-24

申请人： Nils Johansson

发明人： Nils Johansson

IPC分类号： F42B10/12 ,  F42B30/10 ,  F42B10/16

CPC分类号： F42B10/38 ,  F42B10/62

摘要： The invention relates to a shell (1) arranged with extensible wings (3) having improved guidance characteristics during the gliding and final phase of the shell (1). The invention is characterized in that the extensible wings (3), via threaded wing fixtures (8), are movably arranged on rotatable axial guide shafts (6) on the shell body (2) for separate or simultaneous displacement of the wings (3) in the longitudinal direction A of the shell (1), for guidance of the shell (1) in the vertical and lateral directions during the trajectory phase of the shell, and in that the wings (3) are also rotatably arranged on radial guide shafts for controlling the angle of incidence of the wings (3) during the final phase of the shell (1).

摘要翻译： 本发明涉及一种在壳体（1）的滑行和最终相位期间布置有具有改进的引导特性的可伸展翼（3）的壳体（1）。 本发明的特征在于，通过螺纹翼固定装置（8）可延伸的翼（3）可移动地布置在壳体（2）上的可旋转轴向引导轴（6）上，用于分离或同时移动翼（3） 在壳体（1）的纵向方向A上，用于在壳体的轨迹相位期间在垂直和横向方向上引导壳体（1），并且翼（3）也可旋转地布置在径向引导轴 用于在壳（1）的最后阶段期间控制翼（3）的入射角。

公开(公告)号：US08342906B2

公开(公告)日：2013-01-01

申请号：US12433433

申请日：2009-04-30

申请人： Gabriel Lorimer Miller ,  Manoocher Birang ,  Nils Johansson ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu

发明人： Gabriel Lorimer Miller ,  Manoocher Birang ,  Nils Johansson ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu

IPC分类号： B24B49/00

CPC分类号： G01N19/02 ,  B24B37/013 ,  B24B49/16

摘要： A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.

摘要翻译： 描述了用于监测经历抛光的基底的摩擦系数的系统，方法和装置。 抛光垫组件包括包括抛光表面的抛光层，以及柔性地联接到抛光层上的衬底接触构件，其具有与衬底的暴露表面接触的顶表面。 顶表面的至少一部分与抛光表面基本共面。 提供传感器以测量基板接触构件的横向位移。 一些实施例可以在化学机械抛光期间提供准确的端点检测以指示下层的曝光。

公开(公告)号：US20100297917A1

公开(公告)日：2010-11-25

申请号：US12850569

申请日：2010-08-04

申请人： Manoocher Birang ,  Nils Johansson ,  Allan Gleason

发明人： Manoocher Birang ,  Nils Johansson ,  Allan Gleason

IPC分类号： B24B49/04 ,  B24B49/12

CPC分类号： H01L22/12 ,  B24B37/013 ,  B24B37/205 ,  B24B47/12 ,  B24B49/04 ,  B24B49/12 ,  B24B51/00 ,  G01B11/0683

摘要： An apparatus for chemical mechanical polishing (CMP) of a wafer has a rotatable platen to hold a polishing pad, a polishing head for holding the wafer against the polishing pad, an optical monitoring system and a position sensor. The platen has a hole therein, the optical monitoring system includes a light source to direct a light beam through the aperture toward the wafer from a side of the wafer contacting the polishing pad and a detector to receive reflections of the light beam from the wafer, and the position sensor senses when the hole is adjacent the wafer such that the light beam generated by the light source can pass through the hole and impinge on the wafer.

摘要翻译： 晶片的化学机械抛光（CMP）的装置具有可旋转的压板以保持抛光垫，用于将晶片保持在抛光垫上的抛光头，光学监视系统和位置传感器。 压板在其中具有孔，光学监测系统包括光源，用于将光束通过孔径朝向晶片从晶片接触抛光垫的侧面和检测器接收来自晶片的光束的反射， 并且位置传感器感测孔何时邻近晶片，使得由光源产生的光束可以穿过孔并撞击晶片。

公开(公告)号：US07008296B2

公开(公告)日：2006-03-07

申请号：US10464673

申请日：2003-06-18

申请人： Boguslaw A. Swedek ,  Nils Johansson ,  Manoocher Birang

发明人： Boguslaw A. Swedek ,  Nils Johansson ,  Manoocher Birang

IPC分类号： B24B49/00

CPC分类号： B24B37/013 ,  B24B49/10

摘要： Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.

公开(公告)号：US20060009132A1

公开(公告)日：2006-01-12

申请号：US11219124

申请日：2005-09-02

申请人： Doyle Bennett ,  Sandeep Koppikar ,  Jeffrey David ,  Boguslaw Swedek ,  Nils Johansson

发明人： Doyle Bennett ,  Sandeep Koppikar ,  Jeffrey David ,  Boguslaw Swedek ,  Nils Johansson

IPC分类号： B24B49/00

CPC分类号： B24B37/013 ,  B24B37/04 ,  B24B49/105

摘要： Conductive elements of a chemical mechanical polishing system may generate undesired eddy currents under the influence of a time-dependent magnetic field used in an eddy current monitoring system. To improve the accuracy of an eddy current monitoring system, elements that may contribute an undesired signal to the sensed eddy current signal may be fabricated from a non-conductive material such as plastic or ceramic. In some implementations, elements may be fabricated from non-magnetic materials.

摘要翻译： 化学机械抛光系统的导电元件可能在涡流监测系统中使用的时间依赖磁场的影响下产生不期望的涡流。 为了提高涡流监测系统的精度，可能会对非传导性材料（如塑料或陶瓷）制造可能对感测到的涡流信号造成不必要信号的元件。 在一些实施方案中，元件可以由非磁性材料制成。

公开(公告)号：US20060009131A1

公开(公告)日：2006-01-12

申请号：US11222561

申请日：2005-09-08

申请人： Boguslaw Swedek ,  Nils Johansson ,  Manoocher Birang

发明人： Boguslaw Swedek ,  Nils Johansson ,  Manoocher Birang

IPC分类号： B24B49/00

CPC分类号： B24B37/013 ,  B24B49/10

摘要： Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.

公开(公告)号：US06966816B2

公开(公告)日：2005-11-22

申请号：US09847867

申请日：2001-05-02

申请人： Boguslaw A Swedek ,  Manoocher Birang ,  Nils Johansson

发明人： Boguslaw A Swedek ,  Manoocher Birang ,  Nils Johansson

IPC分类号： B24B37/005 ,  B24B37/04 ,  B24B49/02 ,  B24B49/10 ,  B24B49/12 ,  G01B11/06 ,  H01L21/304 ,  B24B49/00

CPC分类号： B24B37/013 ,  B24B49/02 ,  B24B49/10 ,  B24B49/12 ,  G01B7/105 ,  G01B11/0683

摘要： A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.