-
1.发明授权公开(公告)号：US07682221B2
公开(公告)日：2010-03-23
申请号：US11677450
申请日：2007-02-21
CPC分类号： B24B37/013 , B24B49/02 , B24B49/10 , B24B49/12 , G01B7/105 , G01B11/0683
摘要： A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
摘要翻译： 化学机械抛光装置和方法可以使用涡流监测系统和光学监测系统。 来自监控系统的信号可以组合在输出线上并由计算机提取。 可以计算抛光垫的厚度。 涡流监测系统和光学监测系统可以测量基板上基本相同的位置。
-
公开(公告)号：US20090253351A1
公开(公告)日：2009-10-08
申请号：US12433433
申请日：2009-04-30
申请人： Gabriel Lorimer Miller , Manoocher Birang , Nils Johansson , Boguslaw A. Swedek , Dominic J. Benvegnu
发明人： Gabriel Lorimer Miller , Manoocher Birang , Nils Johansson , Boguslaw A. Swedek , Dominic J. Benvegnu
CPC分类号： G01N19/02 , B24B37/013 , B24B49/16
摘要： A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.
摘要翻译： 描述了用于监测经历抛光的基底的摩擦系数的系统，方法和装置。 抛光垫组件包括包括抛光表面的抛光层，以及柔性地联接到抛光层上的衬底接触构件，其具有与衬底的暴露表面接触的顶表面。 顶表面的至少一部分与抛光表面基本共面。 提供传感器以测量基板接触构件的横向位移。 一些实施例可以在化学机械抛光期间提供准确的端点检测以指示下层的曝光。
-
公开(公告)号：US07513818B2
公开(公告)日：2009-04-07
申请号：US10977479
申请日：2004-10-28
申请人： Gabriel Lorimer Miller , Manoocher Birang , Nils Johansson , Boguslaw A. Swedek , Dominic J. Benvegnu
发明人： Gabriel Lorimer Miller , Manoocher Birang , Nils Johansson , Boguslaw A. Swedek , Dominic J. Benvegnu
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B37/042 , B24B49/16 , G01N19/02
摘要： A system, method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.
摘要翻译： 描述了用于监测经历抛光的基底的摩擦系数的系统，方法和装置。 抛光垫组件包括包括抛光表面的抛光层，以及柔性地联接到抛光层上的衬底接触构件，其具有与衬底的暴露表面接触的顶表面。 顶表面的至少一部分与抛光表面基本共面。 提供传感器以测量基板接触构件的横向位移。 一些实施例可以在化学机械抛光期间提供准确的端点检测以指示下层的曝光。
-
公开(公告)号：US07500901B2
公开(公告)日：2009-03-10
申请号：US11222561
申请日：2005-09-08
CPC分类号： B24B37/013 , B24B49/10
摘要： Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.
摘要翻译： 实施用于监测抛光衬底的技术的方法和装置。 获取两个或多个数据点，其中每个数据点具有受传感器感测区域内的特征影响的值，并且对应于感测区域穿过衬底的衬底和传感器的相对位置。 一组参考点用于修改采集的数据点。 该修改补偿由穿过衬底的感测区域引起的所获取的数据点中的失真。 基于修改的数据点，评估基板的局部特性以监测抛光。
-
5.发明授权公开(公告)号：US07195536B2
公开(公告)日：2007-03-27
申请号：US11217598
申请日：2005-08-31
CPC分类号： B24B37/013 , B24B49/02 , B24B49/10 , B24B49/12 , G01B7/105 , G01B11/0683
摘要： A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
摘要翻译： 化学机械抛光装置和方法可以使用涡流监测系统和光学监测系统。 来自监控系统的信号可以组合在输出线上并由计算机提取。 可以计算抛光垫的厚度。 涡流监测系统和光学监测系统可以测量基板上基本相同的位置。
-
公开(公告)号：US07101254B2
公开(公告)日：2006-09-05
申请号：US10966948
申请日：2004-10-15
CPC分类号： B24B37/345 , B24B37/005 , B24B49/105 , G01B7/105 , H01L21/67219 , H01L22/12
摘要： A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.
-
公开(公告)号：US06811466B1
公开(公告)日：2004-11-02
申请号：US10330685
申请日：2002-12-27
IPC分类号： B24B4900
CPC分类号： B24B37/345 , B24B37/005 , B24B49/105 , G01B7/105 , H01L21/67219 , H01L22/12
摘要： A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.
摘要翻译： 一种系统包括用于将涡流探针靠近衬底保持器中的衬底定位的测量站。 探针可以产生时变磁场，以便在抛光之前或之后在衬底的一个或多个导电区域中引起涡流。 检测涡流信号，并可用于更新化学机械抛光系统的一个或多个抛光参数。 衬底保持器可以位于多个位置; 例如，在基板传送系统，工厂接口模块，清洁器或化学机械抛光系统的远离抛光站的一部分中。 可以使用附加的探针。
-
公开(公告)号：US08342906B2
公开(公告)日：2013-01-01
申请号：US12433433
申请日：2009-04-30
申请人： Gabriel Lorimer Miller , Manoocher Birang , Nils Johansson , Boguslaw A. Swedek , Dominic J. Benvegnu
发明人： Gabriel Lorimer Miller , Manoocher Birang , Nils Johansson , Boguslaw A. Swedek , Dominic J. Benvegnu
IPC分类号： B24B49/00
CPC分类号： G01N19/02 , B24B37/013 , B24B49/16
摘要： A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of a substrate. At least a portion of the top surface is substantially coplanar with the polishing surface. A sensor is provided to measure a lateral displacement of the substrate contacting member. Some embodiments may provide accurate endpoint detection during chemical mechanical polishing to indicate the exposure of an underlying layer.
摘要翻译： 描述了用于监测经历抛光的基底的摩擦系数的系统，方法和装置。 抛光垫组件包括包括抛光表面的抛光层，以及柔性地联接到抛光层上的衬底接触构件，其具有与衬底的暴露表面接触的顶表面。 顶表面的至少一部分与抛光表面基本共面。 提供传感器以测量基板接触构件的横向位移。 一些实施例可以在化学机械抛光期间提供准确的端点检测以指示下层的曝光。
-
公开(公告)号：US07008296B2
公开(公告)日：2006-03-07
申请号：US10464673
申请日：2003-06-18
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B49/10
摘要： Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.
-
公开(公告)号：US06966816B2
公开(公告)日：2005-11-22
申请号：US09847867
申请日：2001-05-02
IPC分类号： B24B37/005 , B24B37/04 , B24B49/02 , B24B49/10 , B24B49/12 , G01B11/06 , H01L21/304 , B24B49/00
CPC分类号： B24B37/013 , B24B49/02 , B24B49/10 , B24B49/12 , G01B7/105 , G01B11/0683
摘要： A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system and optical monitoring system can measure substantially the same location on the substrate.
-
-
-
-
-
-
-
-
-
搜索结果
211 条记录 (耗时 0.026 秒)
