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公开(公告)号：US07018215B2
公开(公告)日：2006-03-28
申请号：US10741577
申请日：2003-12-19
IPC分类号： H01R12/00
CPC分类号： H01R13/60
摘要： Embodiments of a routing system for electronic module assemblies are disclosed that may incorporate a module base having at least one routing end and a channel formed across a length of the at least one routing end, wherein the channel has a dimension that allows a wire to be routed from the module base to a connection point external to the module base and allows the wire to be bent within the channel in a direction of the connection point.
摘要翻译： 公开了一种用于电子模块组件的路由系统的实施例，其可以包括具有至少一个路由端和形成在所述至少一个路由端的长度上的信道的模块基座，其中所述信道具有允许电线为 从模块基座路由到模块底座外部的连接点，并允许电线沿着连接点的方向在通道内弯曲。
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公开(公告)号：US06910271B2
公开(公告)日：2005-06-28
申请号：US10283907
申请日：2002-10-29
CPC分类号： F28F23/00 , F28F2013/005 , Y10T29/4935
摘要： A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.
摘要翻译： 热界面垫由多个热界面板组件构成。 替代的热界面板组件在衬垫内相互旋转约180度。 每个板组件包括一个或多个弹簧构件，其构造成使得完整的热界面垫在衬垫的至少两侧上包括多个弹簧构件。 热界面板组件被配置为允许热界面垫的厚度变化很大。 垫片的厚度可以充分调节，以适应多个发热和下沉装置之间的总容差。 插入板中的开口中的杆可以用于对准板组件并且向板施加压力，从而改善相邻板之间的热导率并大大降低热界面垫的整体热阻。
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公开(公告)号：US06900987B2
公开(公告)日：2005-05-31
申请号：US10890941
申请日：2004-07-13
IPC分类号： H01L23/36 , H01L23/367 , H01L23/433 , H05K1/02 , H05K1/14 , H05K7/20
CPC分类号： H01L23/433 , H01L23/36 , H01L23/3675 , H01L2924/0002 , H05K1/0203 , H05K1/0204 , H05K1/021 , H05K1/144 , H05K2201/042 , H05K2201/066 , H01L2924/00
摘要： A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.
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公开(公告)号：US06625026B1
公开(公告)日：2003-09-23
申请号：US10210000
申请日：2002-07-31
IPC分类号： H05K720
CPC分类号： F28F13/00 , F28F2013/005 , H01L21/4882 , H01L23/42 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A heat-activated self-aligning heat sink is built thermally connecting at least one heat-generating devices on a substrate to the heat sink body, where the heat-generating devices may not be co-planar with each other due to tolerance stack-up or parallel with the heat sink body. A pedestal is attached to the substrate to support the heat sink body. A plug or floating pedestal is placed on top of each heat-generating device and held within the pedestal allowing sufficient movement for the bottom surface of the plug to fully contact the top surface of the heat-generating device. A quantity of a low melting temperature, thermally conductive material, such as solder, or a thermally conductive liquid, is placed over each plug and a heat sink body is placed over the assembly. When heated, the thermal material melts, forming a low impedance thermal junction between the plug and the heat sink body regardless of planarity differences between the two devices.
摘要翻译： 热激活的自对准散热器是将至少一个基板上的发热装置热连接到散热体上，其中发热装置可能由于公差叠加而彼此不共面 或与散热器主体平行。 基座附接到基板以支撑散热体。 插头或浮动底座放置在每个发热装置的顶部并且保持在基座内，允许足够的运动使插塞的底表面完全接触发热装置的顶表面。 将一定数量的低熔点温度的导热材料，例如焊料或导热液体放置在每个塞子上，并将散热器主体放置在组件上。 当加热时，热材料熔化，在插头和散热器本体之间形成低阻抗热连接，而与两个器件之间的平面度差异无关。
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公开(公告)号：US07286352B2
公开(公告)日：2007-10-23
申请号：US11107187
申请日：2005-04-15
CPC分类号： F28F21/02 , F28D2021/0029 , H01L21/4882 , H01L23/3672 , H01L23/373 , H01L2224/73253
摘要： Embodiments include apparatus, methods, and systems providing a heatsink for electronic heat generating components. In one embodiment, the heatsink includes a metal base having a plurality of grooves, and a plurality of graphite fins connected to the base. The fins thermally dissipate heat from the base and into a surrounding environment. The fins are secured within the grooves with an interference fit produced by thermally expanding the base.
摘要翻译： 实施例包括为电子发热部件提供散热器的装置，方法和系统。 在一个实施例中，散热器包括具有多个凹槽的金属基底和连接到基座的多个石墨翅片。 翅片热量从基部散热并进入周围环境。 翅片通过热膨胀基部产生的过盈配合固定在凹槽内。
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公开(公告)号：US07131199B2
公开(公告)日：2006-11-07
申请号：US11049346
申请日：2005-02-01
CPC分类号： F28F23/00 , F28F2013/005 , Y10T29/4935
摘要： A thermal interface pad is constructed from a plurality of thermal interface plate assemblies. Alternate thermal interface plate assemblies are rotated about 180 degrees from each other within the pad. Each plate assembly includes one or more spring members configured such that the completed thermal interface pad includes a plurality of spring members on at least two sides of the pad. The thermal interface plate assemblies are configured to allow the thermal interface pad to vary greatly in thickness. The pad is sufficiently adjustable in thickness to accommodate gross tolerance differences between multiple heat generating and sinking devices. Rods inserted in openings in the plates may be used to align the plate assemblies and to apply compressive force to the plates, improving the thermal conductivity between adjacent plates and greatly decreasing the overall thermal resistance of the thermal interface pad.
摘要翻译： 热界面垫由多个热界面板组件构成。 替代的热界面板组件在衬垫内相互旋转约180度。 每个板组件包括一个或多个弹簧构件，其构造成使得完整的热界面垫在衬垫的至少两侧上包括多个弹簧构件。 热界面板组件被配置为允许热界面垫的厚度变化很大。 垫片的厚度可以充分调节，以适应多个发热和下沉装置之间的总容差。 插入板中的开口中的杆可以用于对准板组件并且向板施加压力，改善相邻板之间的热导率并大大降低热界面垫的总体热阻。
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公开(公告)号：US07117929B2
公开(公告)日：2006-10-10
申请号：US10976033
申请日：2004-10-27
IPC分类号： F28F7/00
CPC分类号： H05K7/20418
摘要： A first heat sink is built including two sets of fins with a gap between the two fin sets. The gap is configured to allow the placement of a second heat sink between the two fin sets of the first heat sink. The first heat sink also includes slotted mounting lugs to allow the second heat sink to be mounted to the first heat sink allowing for varying stack up tolerances of the heat generating devices cooled by the first and second heat sinks.
摘要翻译： 建造了第一个散热器，其中包括两组散热片，两组散热片之间具有间隙。 间隙被配置为允许将第二散热器放置在第一散热器的两个翅片组之间。 第一散热器还包括开槽的安装凸耳，以允许第二散热器安装到第一散热器，从而允许由第一和第二散热器冷却的发热装置的叠加公差变化。
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18.发明授权公开(公告)号：US06958445B1
公开(公告)日：2005-10-25
申请号：US11014292
申请日：2004-12-16
CPC分类号： H05K9/0024 , H05K1/0218 , H05K2201/0715 , H05K2201/09354 , H05K2201/10371 , H05K2203/1572 , Y10S174/35
摘要： A system composes a circuit board, electronic devices mounted on a first surface of the circuit board, and an electromagnetic interference (EMI) shield removably mounted to the first surface of the circuit board. The EMI shield defines a chamber to contain the electronic devices. An electrically conductive member is mounted to a second surface of the circuit board. At least an electrically conductive structure extends from the first surface to the second surface of the circuit board to electrically connect the EMI shield to the electrically conductive member.
摘要翻译： 系统包括电路板，安装在电路板的第一表面上的电子装置以及可移除地安装到电路板的第一表面的电磁干扰（EMI）屏蔽。 EMI屏蔽件限定一个容纳电子设备的腔室。 导电构件安装到电路板的第二表面。 至少导电结构从电路板的第一表面延伸到第二表面，以将EMI屏蔽电连接到导电构件。
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公开(公告)号：US06947286B2
公开(公告)日：2005-09-20
申请号：US11030774
申请日：2005-01-06
IPC分类号： H01L23/36 , H01L23/367 , H01L23/433 , H05K1/02 , H05K1/14 , H05K7/20
CPC分类号： H01L23/433 , H01L23/36 , H01L23/3675 , H01L2924/0002 , H05K1/0203 , H05K1/0204 , H05K1/021 , H05K1/144 , H05K2201/042 , H05K2201/066 , H01L2924/00
摘要： A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.
摘要翻译： 构建第一印刷电路板，其包括被配置为对应于附接到第二印刷电路板的发热装置的一个或多个开口。 第一和第二印刷电路板彼此对准和散热器，使得散热器与第一和第二印刷电路板上的发热电子器件热耦合。 发热装置与一个或多个印刷电路板上的散热垫热耦合。 然后将散热垫与散热器热耦合。 可选地，第一和第二印刷电路板可以通过电连接器彼此电耦合。
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公开(公告)号：US06922340B2
公开(公告)日：2005-07-26
申请号：US10890938
申请日：2004-07-13
IPC分类号： H01L23/36 , H01L23/367 , H01L23/433 , H05K1/02 , H05K1/14 , H05K7/20
CPC分类号： H01L23/433 , H01L23/36 , H01L23/3675 , H01L2924/0002 , H05K1/0203 , H05K1/0204 , H05K1/021 , H05K1/144 , H05K2201/042 , H05K2201/066 , H01L2924/00
摘要： A first printed circuit board is built including one or more openings configured to correspond to heat-generating devices attached to a second printed circuit board. The first and second printed circuit boards are aligned with each other and a heat sink, such that the heat sink is thermally coupled with heat-generating electronic devices on both the first and second printed circuit boards. Heat-generating devices are thermally coupled with a thermal pad on one or more of the printed circuit boards. The thermal pad is then thermally coupled with the heat sink. Optionally, the first and second printed circuit boards may be electrically coupled with each other through an electrical connector.
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