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    Receiving device, clock synchronizing method, and computer program
    11.
    发明授权
    Receiving device, clock synchronizing method, and computer program 有权
    接收设备，时钟同步方法和计算机程序

    公开(公告)号：US07940805B2

    公开(公告)日：2011-05-10

    申请号：US12381749

    申请日：2009-03-16

    申请人： Takahiro Ichikawa ,  Koji Obata ,  Tomoyuki Sato ,  Yoshikatsu Niwa ,  Junichi Otani ,  Tomoaki Takemura ,  Shinya Masunaga

    发明人： Takahiro Ichikawa ,  Koji Obata ,  Tomoyuki Sato ,  Yoshikatsu Niwa ,  Junichi Otani ,  Tomoaki Takemura ,  Shinya Masunaga

    IPC分类号： H04J3/06

    CPC分类号： H04L43/087 ,  H04L43/106

    摘要： There is provided a receiving device including: a receiving unit that receives a packet stream; an oscillator; a measuring unit that performs a measuring operation; an acquiring unit that reads the newest time stamp read from the packet stream received by the receiving unit and the newest measurement value measured by the measuring unit with a predetermined period, from a point of time when the packet stream starts to be received; a calculating unit that calculates an accumulation value of the time stamps and the measurement values acquired by the acquiring unit; a comparing unit that compares a difference between the accumulation value of the time stamps and the accumulation value of the measurement values calculated by the calculating unit, and a value corresponding to a network jitter; and a frequency control unit that controls the oscillation frequency of the oscillator based on the comparison result by the comparing unit.

    摘要翻译： 提供了一种接收装置，包括：接收单元，其接收分组流; 振荡器 执行测量操作的测量单元; 获取单元，从分组流开始接收的时间点开始，读取从接收单元接收的分组流中读取的最新时间戳和由测量单元测量的最新测量值; 计算单元，计算所述时间戳的积累值和由所述获取单元获取的测量值; 比较单元，其比较所述时间戳的累积值与由所述计算单元计算出的测量值的累积值之间的差以及与所述网络抖动相对应的值; 以及频率控制单元，其基于比较单元的比较结果来控制振荡器的振荡频率。

    Resin sealing semiconductor device and electronic device using resin sealing semiconductor device
    12.
    发明授权
    Resin sealing semiconductor device and electronic device using resin sealing semiconductor device 有权
    树脂密封半导体器件和使用树脂密封半导体器件的电子器件

    公开(公告)号：US07868451B2

    公开(公告)日：2011-01-11

    申请号：US12302376

    申请日：2006-05-30

    申请人： Shuichi Muramatsu ,  Hidetoshi Suzuki ,  Tomoyuki Sato ,  Kazuo Hara

    发明人： Shuichi Muramatsu ,  Hidetoshi Suzuki ,  Tomoyuki Sato ,  Kazuo Hara

    IPC分类号： H01L23/34

    CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A resin sealing semiconductor device (2) having a structure in which a portion to be sealed of components including a plurality of chip mounting board, a semiconductor chip mounted to a front surface of each chip mounting board, and a plurality of leads provided correspondingly to each chip mounting board is embedded in resin molded portions (41 and 42) molded into a generally plate shape, and outer lead portions of the plurality of leads (16 and 17) are led out in line from a side surface at one end in a width direction of the resin molded portions, and back surfaces as exposed surfaces (11u1 to 11w1 and 12u1 to 12w1) of each chip mounting board are placed on one surfaces of the resin molded portions (41 and 42), wherein a plurality of positioning protrusions (50) are provided on one surfaces of the resin molded portions (41 and 42), and a protrusion height of the positioning protrusions is set so that a gap to be filled with insulating resin is formed between each part of the exposed surface of each chip mounting board and a radiator plate when the positioning protrusions (50) are abutted against the radiator plate.

    摘要翻译： 一种树脂密封半导体器件（2），其结构是将包括多个芯片安装板的部件被密封的部分，安装到每个芯片安装板的前表面的半导体芯片以及相应于 每个芯片安装板嵌入到模制成大致板形的树脂模制部分（41和42）中，并且多个引线（16和17）的外引线部分从一端的侧表面被引出 树脂模制部分的宽度方向和每个芯片安装板的暴露表面（11u1至11w1和12u1至12w1）的背面放置在树脂模制部分（41和42）的一个表面上，其中多个定位突起 （40）设置在树脂模制部分（41和42）的一个表面上，并且定位突起的突出高度被设定成在暴露的每个部分之间形成填充有绝缘树脂的间隙 当定位突起（50）抵靠散热板时，每个芯片安装板的表面和散热板。

    RESIN SEALING SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE USING RESIN SEALING SEMICONDUCTOR DEVICE
    20.
    发明申请
    RESIN SEALING SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE USING RESIN SEALING SEMICONDUCTOR DEVICE 有权
    使用树脂密封半导体器件的树脂密封半导体器件和电子器件

    公开(公告)号：US20090201651A1

    公开(公告)日：2009-08-13

    申请号：US12302376

    申请日：2006-05-30

    申请人： Shuichi Muramatsu ,  Hidetoshi Suzuki ,  Tomoyuki Sato ,  Kazuo Hara

    发明人： Shuichi Muramatsu ,  Hidetoshi Suzuki ,  Tomoyuki Sato ,  Kazuo Hara

    IPC分类号： H05K7/00

    CPC分类号： H01L23/3107 ,  H01L21/565 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A resin sealing semiconductor device (2) having a structure in which a portion to be sealed of components including a plurality of chip mounting board, a semiconductor chip mounted to a front surface of each chip mounting board, and a plurality of leads provided correspondingly to each chip mounting board is embedded in resin molded portions (41 and 42) molded into a generally plate shape, and outer lead portions of the plurality of leads (16 and 17) are led out in line from a side surface at one end in a width direction of the resin molded portions, and back surfaces as exposed surfaces (11u1 to 11w1 and 12u1 to 12w1) of each chip mounting board are placed on one surfaces of the resin molded portions (41 and 42), wherein a plurality of positioning protrusions (50) are provided on one surfaces of the resin molded portions (41 and 42), and a protrusion height of the positioning protrusions is set so that a gap to be filled with insulating resin is formed between each part of the exposed surface of each chip mounting board and a radiator plate when the positioning protrusions (50) are abutted against the radiator plate.

    摘要翻译： 一种树脂密封半导体器件（2），其结构是将包括多个芯片安装板的部件被密封的部分，安装到每个芯片安装板的前表面的半导体芯片以及相应于 每个芯片安装板嵌入到模制成大致板形的树脂模制部分（41和42）中，并且多个引线（16和17）的外引线部分从一端的侧表面被引出 树脂模制部分的宽度方向和每个芯片安装板的暴露表面（11u1至11w1和12u1至12w1）的背面放置在树脂模制部分（41和42）的一个表面上，其中多个定位突起 （40）设置在树脂模制部分（41和42）的一个表面上，并且定位突起的突出高度被设定成在暴露的每个部分之间形成填充有绝缘树脂的间隙 当定位突起（50）抵靠散热板时，每个芯片安装板的表面和散热板。