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    Machined features of enclosures for implantable medical devices
    12.
    发明授权
    Machined features of enclosures for implantable medical devices 有权

    公开(公告)号：US12017079B2

    公开(公告)日：2024-06-25

    申请号：US17674195

    申请日：2022-02-17

    Applicant: MEDTRONIC, INC.

    Inventor： Michael J. Baade ,  Steven T. Deininger ,  Katherine J. Bach

    IPC: A61N1/375 ,  A61N1/372 ,  A61N1/378

    CPC classification number: A61N1/375 ,  A61N1/37223 ,  A61N1/3787

    Abstract: Implantable medical devices include an enclosure that is constructed by machining of a material rather than by forming or stamping. The machining produces one or more internal features within the enclosure. These internal features may include shelves that may act as a stiffener and create separate compartments within the enclosure. These internal features may include contoured edges along the shelves to accommodate conductors and other structures that extend from one compartment to another. These features may include slots that are present in one or more locations, such as on a surface of one of the shelves. These internal features may also include standoffs that establish a gap between an internal component and the external wall of the enclosure. These internal features may also include different thicknesses in different areas of the enclosure, such as one wall thickness in one compartment and a different wall thickness in another compartment.

    IMPLANTABLE MEDICAL DEVICE
    13.
    发明申请
    IMPLANTABLE MEDICAL DEVICE 有权

    公开(公告)号：US20210339027A1

    公开(公告)日：2021-11-04

    申请号：US17377675

    申请日：2021-07-16

    Applicant: MEDTRONIC, INC.

    Inventor： Steven T. Deininger ,  Michael J. Baade ,  Charles E. Peters

    IPC: A61N1/375 ,  A61N1/18

    Abstract: An implantable medical device includes an enclosure sleeve and a top cap. The enclosure sleeve comprises an enclosure wall with at least a portion of the enclosure wall comprising the grade 5 titanium and having a thickness between 0.007 inches and 0.009 inches. The enclosure sleeve includes an open top end and an open bottom end that is opposite the open top end. The top cap includes a feedthrough block, a first top cap end portion, and a second top cap end portion. The first top cap end portion is configured to couple to the open top end of the enclosure sleeve, and the second top cap end portion configured to be positioned within the enclosure sleeve.

    IMPLANTABLE MEDICAL DEVICES WITH HEADER STRUCTURES INCLUDING CONDUCTIVE PATHS THAT FACILITATE THE INTERCONNECTION OF FEEDTHROUGH CONDUCTORS TO ELECTRICAL CONNECTORS
    17.
    发明申请
    IMPLANTABLE MEDICAL DEVICES WITH HEADER STRUCTURES INCLUDING CONDUCTIVE PATHS THAT FACILITATE THE INTERCONNECTION OF FEEDTHROUGH CONDUCTORS TO ELECTRICAL CONNECTORS 有权
    具有头部结构的可植入医疗装置，包括有助于将电源连接器连接到电气连接器的导电片

    公开(公告)号：US20160184594A1

    公开(公告)日：2016-06-30

    申请号：US14983519

    申请日：2015-12-29

    Applicant: MEDTRONIC, INC.

    Inventor： Michael J. Baade ,  Katherine J. Bach ,  Steven T. Deininger

    IPC: A61N1/375

    CPC classification number: A61N1/3754 ,  A61N1/3752

    Abstract: Implantable medical devices include header structures with conductive paths from the feedthrough conductors that may be located on one side of the device to electrical connectors that may be located on an opposite side of the device. The conductive paths may include conductive interconnect pins and lead frame conductors. The conductive interconnect pins may be located in holes present in a header body where the conductive interconnect pins are attached to the feedthrough conductors on one end and are attached to the lead frame conductors on the opposite end. The lead frame conductors then extend to the corresponding electrical connectors. The header body may provide cavities on each side to allow for the insertion of stack assemblies that include the electrical connectors and lead frame conductors.

    Abstract translation: 植入式医疗设备包括具有导引路径的头部结构，该导引路径可以位于设备的一侧上的馈通导体与位于设备相对侧上的电连接器。 导电路径可以包括导电互连引脚和引线框架导体。 导电互连引脚可以位于插座主体中的孔中，其中导电互连引脚在一端连接到馈通导体，并且在相对端附接到引线框架导体。 引线架导体然后延伸到相应的电连接器。 集管主体可以在每个侧面上提供空腔，以允许插入包括电连接器和引线框架导体的堆叠组件。

    Connector Assemblies for Implantable Medical Electrical Systems
    18.
    发明申请
    Connector Assemblies for Implantable Medical Electrical Systems 有权
    用于植入式医疗电气系统的连接器组件

    公开(公告)号：US20140052225A1

    公开(公告)日：2014-02-20

    申请号：US13826784

    申请日：2013-03-14

    Applicant: MEDTRONIC, INC.

    Inventor： John E. Kast ,  Charles E. Peters ,  Michael J. Baade ,  James A. Alexander ,  Andrew J. Ries

    IPC: A61N1/05

    CPC classification number: A61N1/3754 ,  A61N1/0551 ,  A61N1/375 ,  A61N1/3752 ,  H01R13/5224 ,  Y10T29/49174

    Abstract: A device connector assembly includes a plurality of electrical contacts and a sealing member including a corresponding plurality of apertures; each electrical contact extends within a corresponding aperture of the plurality of apertures such that each contact is accessible for coupling with a corresponding connector element of a lead connector. The lead connector elements protrude from a first side of an insulative substrate of the lead connector, and may be coupled to the contacts of the device connector assembly by aligning each connector element with the corresponding aperture of the sealing member, and applying a force to a second side of the insulative substrate, opposite the first side, in order to press each connector element into engagement with the corresponding contact.

    Abstract translation: 一种设备连接器组件包括多个电触点和包括相应的多个孔的密封构件; 每个电接触件在多个孔的相应孔内延伸，使得每个接触件可接近以便与引线连接器的对应连接器元件联接。 引线连接器元件从引线连接器的绝缘基板的第一侧突出，并且可以通过将每个连接器元件与密封元件的相应孔对齐，并且将其连接到设备连接器组件的触点上， 绝缘衬底的与第一侧相对的第二侧，以便按压每个连接器元件与相应的触点接合。

    Machined features of enclosures for implantable medical devices
    19.
    发明授权
    Machined features of enclosures for implantable medical devices 有权

    公开(公告)号：US11253708B2

    公开(公告)日：2022-02-22

    申请号：US16413457

    申请日：2019-05-15

    Applicant: MEDTRONIC, INC.

    Inventor： Michael J. Baade ,  Steven T. Deininger ,  Katherine J. Bach

    IPC: A61N1/375 ,  A61N1/372 ,  A61N1/378

    Abstract: Implantable medical devices include an enclosure that is constructed by machining of a material rather than by forming or stamping. The machining produces one or more internal features within the enclosure. These internal features may include shelves that may act as a stiffener and create separate compartments within the enclosure. These internal features may include contoured edges along the shelves to accommodate conductors and other structures that extend from one compartment to another. These features may include slots that are present in one or more locations, such as on a surface of one of the shelves. These internal features may also include standoffs that establish a gap between an internal component and the external wall of the enclosure. These internal features may also include different thicknesses in different areas of the enclosure, such as one wall thickness in one compartment and a different wall thickness in another compartment.

    Machining of enclosures for implantable medical devices
    20.
    发明授权
    Machining of enclosures for implantable medical devices 有权

    公开(公告)号：US10828127B2

    公开(公告)日：2020-11-10

    申请号：US15650665

    申请日：2017-07-14

    Applicant: MEDTRONIC, INC.

    Inventor： Steven T. Deininger ,  Michael J. Baade ,  Charles E. Peters

    IPC: A61N1/375 ,  A61B90/50 ,  A61N1/18

    Abstract: Enclosures for implantable medical devices are machined from biocompatible materials using processes such as electric discharge machining and/or milling. Material is machined to create an enclosure. The enclosure may include an enclosure sleeve that has top and bottom caps added where the enclosure sleeve is machined either as a whole or as two separate halves that are subsequently joined together. During construction, circuitry is installed and where the enclosure includes an enclosure sleeve, the open top and bottom may be closed by caps while a connector block module may be mounted to the complete enclosure. The machining process allows materials that are typically difficult to stamp, such as grade 5 and 9 titanium and 811 titanium, that are beneficial to telemetry and recharging features of an implantable medical device to be used while allowing for an enclosure with a relatively detailed geometry and relatively tight tolerances.

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