Method of producing secondary battery cathode material, and secondary battery
    13.
    发明授权
    Method of producing secondary battery cathode material, and secondary battery 有权
    二次电池正极材料的制造方法和二次电池

    公开(公告)号:US07815888B2

    公开(公告)日:2010-10-19

    申请号:US10485671

    申请日:2002-07-31

    IPC分类号: C01D1/02

    摘要: Disclosed is a process for producing a secondary battery cathode material by calcining raw materials. The process is characterized by calcining the raw materials together with one or more substances, which are selected from the group consisting of hydrogen, water and water vapor, and conductive carbon and/or a substance, which can form conductive carbon by pyrolysis, added thereto. As crystals of the secondary battery cathode material obtained by this process have been controlled fine sizes, the secondary battery cathode material promotes movements of ions of an alkali metal led by lithium between the interiors of grains of the cathode material and an electrolyte to suppress polarization in an electrode reaction, and further, increases an area of contact between the positive material and a conductivity-imparting material to provide improved conductivity so that improvements are assured in voltage efficiency and specific battery capacity.

    摘要翻译: 公开了通过煅烧原料制造二次电池正极材料的方法。 该方法的特征在于将原料与一种或多种选自氢,水和水蒸气的物质一起煅烧,以及可通过热解形成导电碳的导电碳和/或物质 。 由于通过该方法获得的二次电池正极材料的晶体已被控制为精细尺寸,所以二次电池正极材料促进在由阴极材料的晶粒和电解质的内部之间的由锂引导的碱金属的离子的移动以抑制极化 电极反应,并且进一步增加正材料和导电性赋予材料之间的接触面积,以提供改善的导电性,从而确保电压效率和特定电池容量的改进。

    SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
    16.
    发明申请
    SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 审中-公开
    半导体器件和半导体器件制造方法

    公开(公告)号:US20110006310A1

    公开(公告)日:2011-01-13

    申请号:US12742398

    申请日:2008-11-11

    IPC分类号: H01L29/24 H01L21/20

    摘要: A semiconductor device comprises a semiconductor substrate made of silicon carbide, a gate insulating film formed on the semiconductor substrate, and a gate electrode formed on the gate insulating film. The junction surface of the semiconductor surface joined with the gate insulating film is macroscopically parallel to a nonpolar face and microscopically comprised of the nonpolar face and a polar face. In the polar face, either a Si face or a C face is dominant. A semiconductor device comprises a semiconductor substrate comprised of silicon carbide and a gate electrode formed on the semiconductor substrate. The junction surface of the semiconductor surface joined with the electrode is macroscopically parallel to a nonpolar face and microscopically comprised of the nonpolar face and a polar face. In the polar face, either a Si face or a C face is dominant. The present invention is a semiconductor device having a silicon carbide substrate, and the electrical characteristics and the stability of the interface between the electrode and the silicon carbide or between the oxide film (insulating film) and the silicon carbide in the nonpolar face of a silicon carbide epitaxial layer can be improved.

    摘要翻译: 半导体器件包括由碳化硅制成的半导体衬底,形成在半导体衬底上的栅极绝缘膜和形成在栅极绝缘膜上的栅电极。 与栅极绝缘膜接合的半导体表面的接合表面在宏观上平行于非极性面并且显微地由非极性面和极面组成。 在极面中,Si面或C面是主要的。 半导体器件包括由碳化硅构成的半导体衬底和形成在半导体衬底上的栅电极。 与电极接合的半导体表面的结表面在宏观上平行于非极性面并且显微地由非极性面和极面组成。 在极面中,Si面或C面是主要的。 本发明是一种具有碳化硅衬底的半导体器件,以及电极和碳化硅之间或氧化膜(绝缘膜)和硅的非极性表面中的碳化硅之间的界面的电特性和稳定性 可以改善碳化物外延层。